-
The ASM330LHH is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope with an extended temperature range up to +105 °C and designed to address automotive non-safety applications.
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes to serve both the automotive and consumer market. The ASM330LHH is AEC-Q100 compliant and industrialized through a dedicated MEMS production flow to meet automotive reliability standards. All the parts are fully tested with respect to temperature to ensure the highest quality level.
The sensing elements are manufactured using ST’s proprietary micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
The ASM330LHH has a full-scale acceleration range of ±2/±4/±8/±16 g and a wide angular rate range of ±125/±250/±500/±1000/±2000/±4000 dps that enables its usage in a broad range of automotive applications.
All the design aspects of the ASM330LHH have been optimized to reach superior output stability, extremely low noise and full data synchronization to the benefit of sensor-assisted applications like dead reckoning and sensor fusion.
The ASM330LHH is available in a 14-lead plastic land grid array (LGA) package.Key Features
- AEC-Q100 qualified
- Extended temperature range from -40 to +105 °C
- Embedded compensation for high stability over temperature
- Accelerometer user-selectable full scale up to ±16 g
- Extended gyroscope range from ±125 to ±4000 dps
- SPI & I2C host serial interface
- Six-channel synchronized output to enhance accuracy of dead-reckoning algorithms
- Smart programmable interrupts
- Embedded 3 kB FIFO available to underload host processor
- ECOPACK®, RoHS and “Green” compliant
Sample & Buy
| Part Number | Package | Packing Type | Marketing Status | Budgetary Price (US$)* | Quantity | ECCN (US) | Country of Origin | Order from Distributors | Order from ST |
|---|---|---|---|---|---|---|---|---|---|
| ASM330LHHTR | VFLGA2.5X3X.86 14L P.5 L.475X.25 | Tape And Reel |
Active
|
5 | 1000 | EAR99 | - | Check Availability | |
| ASM330LHH | VFLGA2.5X3X.86 14L P.5 L.475X.25 | Tray |
Active
|
- | - | EAR99 | - | No availability of distributors reported, please contact our sales office |
ASM330LHHTR
Package
VFLGA2.5X3X.86 14L P.5 L.475X.25Packing Type
Tape And ReelUnit Price (US$)
5.0*ASM330LHH
Package
VFLGA2.5X3X.86 14L P.5 L.475X.25Packing Type
TrayUnit Price (US$)
*(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
Featured Videos
The STEVAL-MKSBOX1V1 (SensorTile.box) is a ready-to-use box kit with wireless IoT and wearable sensor platform to help you use and develop apps based on remote motion and environmental sensor data, regardless of your level of expertise.
Ecosystems
-
-
Picture Part number Manufacturer Description AWS IoT Core AWS AWS IoT Core is a managed cloud platform that lets connected devices easily and securely interact with cloud applications and other devices. AZURE Cloud Microsoft Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks. Watson IoT Platform IBM IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices. Part NumberAWS IoT Core is a managed cloud platform that lets connected devices easily and securely interact with cloud applications and other devices.
Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks.
IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices.
-
Embedded Software
-
-
Picture Part number Manufacturer Description AndroidHAL-IIO ST Android sensor HAL for MEMS motion and environmental sensors (Industrial I/O framework) C-Driver-MEMS ST Standard C platform-independent drivers for MEMS motion and environmental sensors LinuxDriverIIO ST Linux device drivers for MEMS motion and environmental sensors (Industrial I/O framework) Part NumberAndroid sensor HAL for MEMS motion and environmental sensors (Industrial I/O framework)
Standard C platform-independent drivers for MEMS motion and environmental sensors
Linux device drivers for MEMS motion and environmental sensors (Industrial I/O framework)
-
Evaluation Tools
-
-
Picture Part number Manufacturer Description 
STEVAL-MKI193V1 ST ASM330LHH adapter board for a standard DIL24 socket Part NumberASM330LHH adapter board for a standard DIL24 socket
-
Support and Applications
-
-
Picture Part number Manufacturer Description SensorTile.box customization services FAE Technology Engineering services on theSensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing. Part NumberEngineering services on theSensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing.
-
| Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|---|
| ASM330LHH |
Active
|
VFLGA2.5X3X.86 14L P.5 L.475X.25 | Automotive | Ecopack2 | |
| ASM330LHHTR |
Active
|
VFLGA2.5X3X.86 14L P.5 L.475X.25 | Automotive | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
