ASM330LHH

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Automotive 6-axis inertial module: 3D accelerometer and 3D gyroscope

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  • The ASM330LHH is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope with an extended temperature range up to +105 °C and designed to address automotive non-safety applications.

    ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes to serve both the automotive and consumer market. The ASM330LHH is AEC-Q100 compliant and industrialized through a dedicated MEMS production flow to meet automotive reliability standards. All the parts are fully tested with respect to temperature to ensure the highest quality level.
    The sensing elements are manufactured using ST’s proprietary micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
    The ASM330LHH has a full-scale acceleration range of ±2/±4/±8/±16 g and a wide angular rate range of ±125/±250/±500/±1000/±2000/±4000 dps that enables its usage in a broad range of automotive applications.
    All the design aspects of the ASM330LHH have been optimized to reach superior output stability, extremely low noise and full data synchronization to the benefit of sensor-assisted applications like dead reckoning and sensor fusion.
    The ASM330LHH is available in a 14-lead plastic land grid array (LGA) package.

    Key Features

    • AEC-Q100 qualified
    • Extended temperature range from -40 to +105 °C
    • Embedded compensation for high stability over temperature
    • Accelerometer user-selectable full scale up to ±16 g
    • Extended gyroscope range from ±125 to ±4000 dps
    • SPI & I²C host serial interface
    • Six-channel synchronized output to enhance accuracy of dead-reckoning algorithms
    • Smart programmable interrupts
    • Embedded 3 kbytes FIFO available to underload host processor
    • ECOPACK, RoHS and “Green” compliant

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      Watson IoT Platform

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      IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices.

      Cloud IBM
      AWS IoT Core

      Description:

      AWS IoT Core is a managed cloud service that lets connected devices easily and securely interact with cloud applications and other devices
      AZURE Cloud

      Description:

      Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks.
      Watson IoT Platform

      Description:

      IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices.
    • Part number
      Status
      Description
      Type
      Supplier

      X-CUBE-MEMS1

      Active

      Sensor and motion algorithm software expansion for STM32Cube

      STM32Cube Expansion Packages ST
      X-CUBE-MEMS1

      Description:

      Sensor and motion algorithm software expansion for STM32Cube
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      SensorTile.box customization services

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      Engineering services on theSensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing.

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Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
ASM330LHHTR
Active
VFLGA2.5X3X.86 14L P.5 L.475X.25 Automotive Ecopack2

ASM330LHHTR

Package:

VFLGA2.5X3X.86 14L P.5 L.475X.25

Material Declaration**:

PDF XML

Marketing Status

Active

Package

VFLGA2.5X3X.86 14L P.5 L.475X.25

Grade

Automotive

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

Part Number
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Marketing Status
ECCN (US)
ECCN (EU)
Packing Type
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Temperature (°C) Country of Origin
Budgetary Price (US$)*/Qty
min
max
ASM330LHHTR No availability of distributors reported, please contact our sales office
Active
EAR99 NEC Tape And Reel VFLGA2.5X3X.86 14L P.5 L.475X.25 -40 85 MALTA 5.0 / 1k

ASM330LHHTR

Marketing Status

Active

ECCN (US)

EAR99

Budgetary Price (US$)*/Qty

5.0 / 1k

ECCN (EU)

NEC

Packing Type

Tape And Reel

Package

VFLGA2.5X3X.86 14L P.5 L.475X.25

Operating Temperature (°C)

(min)

-40

(max)

85

Budgetary Price (US$)* / Qty

5.0 / 1k

Country of Origin

MALTA

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors