Product overview
Description
The TSV73x series of single, dual, and quad operational amplifiers offer low-voltage operation, rail-to-rail input and output, and excellent accuracy (Violower than 200 μV at 25 °C).
These devices benefit from STMicroelectronics®5 V CMOS technology and offer an excellent speed/power consumption ratio (900 kHz typical gain bandwidth) while consuming 60 μA typical at 5 V. The TSV73x series also feature an ultra-low input bias current.
The single version (TSV731), the dual version (TSV732), and the quad version (TSV734) are housed in the smallest industrial packages.
These characteristics make the TSV73x family ideal for sensor interfaces, battery-powered and portable applications, and active filtering.
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All features
- Low offset voltage: 200 μV max.
- Low power consumption: 60 μA at 5 V
- Low supply voltage: 1.5 V to 5.5 V
- Gain bandwidth product: 900 kHz typ.
- Low input bias current: 1 pA typ.
- Rail-to-rail input and output
- EMI hardened operational amplifiers
- High tolerance to ESD: 4 kV HBM
- Extended temperature range: -40 to +125 °C
- Benefits
- Higher accuracy without calibration
- Energy saving
- Guaranteed operation on low-voltage battery
- Related products
- See the TSV71 series (150 kHz for 14 μA) for more power savings
eDesignSuite
eDesignSuite is a comprehensive set of easy-to-use design-aid utilities ready to help you streamline the system development process with a wide range of ST products.
Signal Conditioning Design Tool
Active Filters
Handles multi-stage-designs and common topologies Returns circuit component values Provides gain, phase and group delay graphs Low Pass, High Pass and Band Pass 
Current Sensing
Returns circuit component values Provides current error graphs Start your design with the TSV731 now
xwith our eDesignSuite online design aid utilities and simulation tools.
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EDA Symbols, Footprints and 3D Models
STMicroelectronics - TSV731
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
All resources
| Resource title | Version | Latest update |
|---|
SPICE models (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| ZIP | 1.0 | 01 Aug 2015 | 01 Aug 2015 |
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|---|
| TSV731ICT | Active | SC70-5 | Industrial | Ecopack3 | |
TSV731ICT
Package:
SC70-5Material Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Order from distributors | Order from ST | Marketing Status | Grade | ECCN (US) | ECCN (EU) | Packing Type | Package | Temperature (°C) | Country of Origin | Budgetary Price (US$)*/Qty | Unit Price (US$) | Country of Origin | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | ||||||||||||||
| TSV731ICT | distributors No availability of distributors reported, please contact our sales office | Active | Industrial | EAR99 | NEC | Tape and Reel | SC70-5 | -40 | 125 | MALAYSIA | | 0.4611 | MALAYSIA | ||
(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors