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Edge Processing

Overview
Documentation
Tools and Software
HW Evaluation Tools
Solutions
Key Products
Condition Monitoring and Predictive Maintenance systems include a several smart sensor nodes in the equipment, which are directly connected to the cloud directly or connected via intermediate gateways.  Computation is performed inside the smart sensor or on the local microprocessor, either in gateways or in the cloud, depending on the expected latency and on how far the raw data and processed data are sent over connectivity.  Edge processing occurs when the computation of data is carried out directly in the smart sensor node or at the gateway, in order to save power consumption and ensure data is kept confidential, allowing companies to analyze critical information at the node level and to reduce anomaly detection time.   Combining edge and cloud computing technologies could help tpo develop predictive maintenance techniques and enhance their efficiency and effectiveness.  Indeed, working on data at the edge, close to the sensor, allows companies to detect machine deterioration at the node level and to take immediate and informed corrective actions, thus preventing further damage and machine failures. Long-term analysis and actions to determine trends and optimize local analysis models can be managed on the cloud, enabling more complex analytics on large amounts of pre-processed data coming from multiple nodes. Read more

Benefits of Edge processing

  • Confidentiality: data is not sent to the cloud and is locally stored on the device or the equipment 
  • Cost reduction: latency and throughput of high-volume time-series asset data is significantly optimized. Reducing the amount of useless machine data sent and stored in the cloud leads to significant benefits, as it enables real-time distributed applications and eliminates the need for complex systems 
  • Lower latency: minimal delay in the repair of equipment is essential for assets which are mission-critical.

AI ecosystem for STM32 MCUs and MPUs

To easily implement Predictive Maintenance algorithms on MCU and MPU edge devices, STM32 Tools were enriched with the STM32Cube. AI ecosystem, extending STM32CubeMX software capabilities with the automatic conversion of pre-trained Neural Networks. STM32Cube. AI supportsing several deep learning frameworks and includes optimized libraries which can be used to implement AI  algorithms in embedded applications level. 

STMicroelectronics also provides a complete offer of microprocessors and optimized Power Management solutions for industrial gateways as key enablers of aggregated processing in the field. Software development kits and cloud applications for Edge and Cloud processing (starter kits) as well as AI studio tools, like STM32Cube. AI software and code examples, are included our function packs and solutions.

All tools & software

    • Part number
      Status
      Description
      Type
      Supplier

      DSH-PREDMNT

      Active

      Cloud based web application for condition monitoring and predictive maintenance

      Evaluation Tool Software ST
      DSH-PREDMNT

      Description:

      Cloud based web application for condition monitoring and predictive maintenance
    • Part number
      Status
      Description
      Type
      Supplier

      FP-AI-NANOEDG1

      Active

      Artificial Intelligence (AI) condition monitoring function pack for STM32Cube

      STM32Cube Expansion Packages ST
      FP-AI-NANOEDG1

      Description:

      Artificial Intelligence (AI) condition monitoring function pack for STM32Cube

      FP-CLD-AZURE1

      Active

      STM32Cube function pack for IoT sensor node with telemetry and device management applications for Microsoft Azure cloud

      STM32 ODE Function Pack SW ST
      FP-CLD-AZURE1

      Description:

      STM32Cube function pack for IoT sensor node with telemetry and device management applications for Microsoft Azure cloud

      STM32CubeMP1

      Active

      STM32CubeMP1 Package for STM32MP1 series (HAL, Low-Layer APIs and CMSIS, OpenAMP for Inter processor communication, and examples running on ST boards)

      STM32Cube MCU & MPU Packages ST
      STM32CubeMP1

      Description:

      STM32CubeMP1 Package for STM32MP1 series (HAL, Low-Layer APIs and CMSIS, OpenAMP for Inter processor communication, and examples running on ST boards)

      X-CUBE-AI

      Active

      AI expansion pack for STM32CubeMX

      STM32Cube Expansion Packages ST
      X-CUBE-AI

      Description:

      AI expansion pack for STM32CubeMX

      X-LINUX-PREDMNT

      Active

      STM32 MPU OpenSTLinux Expansion Pack for Predictive Maintenance applications

      STM32 MPU OpenSTLinux Expansion Packages ST
      X-LINUX-PREDMNT

      Description:

      STM32 MPU OpenSTLinux Expansion Pack for Predictive Maintenance applications
    • Part number
      Status
      Description
      Type
      Supplier

      HW Design Service

      Active

      Complete OEM solution from end to end.

      Design Services from Partners DiZiC
      HW Design Service

      Description:

      Complete OEM solution from end to end.
    • Part number
      Status
      Description
      Type
      Supplier

      Unico-GUI

      Active

      MEMS evaluation kit software package for Linux, Mac OSX and Windows

      Sensor Software Development Tools ST
      Unico-GUI

      Description:

      MEMS evaluation kit software package for Linux, Mac OSX and Windows

All Hardware Evaluation Tools

    • Part Number
      Description
      Core product
      Tool Type
      Supplier
      Sort by: part number

      STEVAL-IDP004V1

      NRND

      IO-Link master multi-port evaluation board based on L6360

      L6360 Communication and Connectivity Solution Eval Boards ST
      STEVAL-IDP004V1
      NRND

      IO-Link master multi-port evaluation board based on L6360

      STEVAL-IDP004V2

      Active

      IO-Link master multi-port evaluation board based on L6360

      L6360 Communication and Connectivity Solution Eval Boards ST
      STEVAL-IDP004V2
      Active

      IO-Link master multi-port evaluation board based on L6360

      STEVAL-STWINKT1B

      Active

      STWIN SensorTile Wireless Industrial Node development kit and reference design for industrial IoT applications

      ISM330DHCX Sensor Solution Eval Boards ST
      STEVAL-STWINKT1B
      Active

      STWIN SensorTile Wireless Industrial Node development kit and reference design for industrial IoT applications

Picture Solution
Vibration, ultrasound and environmental sensor nodes for condition monitoring with Wi-Fi and cellular connectivity to cloud applications
Vibration, ultrasound and environmental sensor nodes for condition monitoring with Wi-Fi and cellular connectivity to cloud applications