SPC572L64F2

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32-bit Power Architecture MCU for Automotive Powertrain Applications

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Product overview

Description

This family of MCUs is targeted at automotive powertrain controller applications for four-cylinder gasoline and diesel engines, chassis control applications, transmission control applications, steering and braking applications, as well as low-end hybrid applications.

The family is designed to achieve ISO26262 ASIL-A compliance.

This document provides electrical specifications, pin assignments, and package diagrams for the SPC572Lx series of microcontroller units (MCUs). For functional characteristics, see the device reference manual.

This family of MCUs is targeted at automotive powertrain controller applications for four-cylinder gasoline and diesel engines, chassis control applications, transmission control applications, steering and braking applications, as well as low-end hybrid applications.

The family is designed to achieve ISO26262 ASIL-A compliance.

  • All features

    • AEC-Q100 qualified
    • One main 32-bit Power Architecture® VLE Compliant CPU core, single issue
      • Single-precision floating point operations
    • 1568 KB on-chip RWW flash memory
      • Supporting EEPROM emulation (32 KB)
    • 64 KB general-purpose data SRAM
    • System Memory Protection Unit (SMPU)
    • Multi-channel direct memory access controllers (eDMA) with 16-channel for up to 60 DMA sources
    • Interrupt controller (INTC)
    • Four 32-bit and one 64-bit Periodic Interrupt Timer channels (PIT)
    • Single phase-locked loops with stable clock domain for peripherals and core (PLL)
    • System integration unit lite (SIUL2)
    • Boot assist flash (BAF) supports factory programming through UART/LIN, CAN
    • Generic timer module (GTM101)
      • Intelligent complex timer module
      • 72 channels (16 input and 56 output)
    • Enhanced analog-to-digital converter system with:
      • Three 12-bit SAR analog converters
      • One 16-bit Sigma-Delta analog converters
    • Decimation unit to support SD ADC data conditioning
    • Two deserial serial peripheral interface (DSPI) modules
    • Two LIN and UART communication interfaces (LINFlexD) modules
    • One μs-bus channel (composed by one DSPI and one LINFlexD)
    • Four SENT channels
    • Two modular controller area network (M_CAN) modules
    • Fast Ethernet controller (FEC)
    • Fast Asynchronous Serial Transmission (LFAST)
    • Nexus development interface (NDI) per IEEE-ISTO 5001-2003 standard, with some support for 2010 standard
    • Device and board test support per Joint Test Action Group (JTAG) (IEEE 1149.1 and IEEE 1149.7)
    • Single 5 V +/-10% Power supply supporting cold start conditions (down to 3.0 V)
    • Self Test capability
    • Designed for eTQFP80 and eTQFP100

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Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
SPC572L64F2BC6AR
Active
TQFP-EP 80L 10X10X1.0 EXPADDOWN Automotive Ecopack2
SPC572L64F2BC6AY
Active
TQFP-EP 80L 10X10X1.0 EXPADDOWN Automotive Ecopack2

SPC572L64F2BC6AR

Package:

TQFP-EP 80L 10X10X1.0 EXPADDOWN

Material Declaration**:

PDF XML

Marketing Status

Active

Package

TQFP-EP 80L 10X10X1.0 EXPADDOWN

Grade

Automotive

RoHS Compliance Grade

Ecopack2

SPC572L64F2BC6AY

Package:

TQFP-EP 80L 10X10X1.0 EXPADDOWN

Material Declaration**:

PDF XML

Marketing Status

Active

Package

TQFP-EP 80L 10X10X1.0 EXPADDOWN

Grade

Automotive

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

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Part Number
Order from distributors
Order from ST
Marketing Status
ECCN (US)
ECCN (EU)
Packing Type
Package
Temperature (°C) CPU Clock Frequency (MHz) (max)
Budgetary Price (US$)*/Qty
Flash Size (kB) (Data)
Features set
Unit Price (US$)
Country of Origin
min
max
SPC572L64F2BC6AY Available at distributors

Distributor availability of SPC572L64F2BC6AY

Distributor Name
Region Stock Min. Order Third party link

Distributor reported inventory date:

No availability of distributors reported, please contact our sales office
Active
5A991.b.4.a NEC Tray TQFP-EP 80L 10X10X1.0 EXPADDOWN -40 105 80

32

4.5-5.5V

9.99

MALTA

SPC572L64F2BC6AR Available at distributors

Distributor availability of SPC572L64F2BC6AR

Distributor Name
Region Stock Min. Order Third party link

Distributor reported inventory date:

No availability of distributors reported, please contact our sales office
Active
5A991.b.4.a NEC Tape and Reel TQFP-EP 80L 10X10X1.0 EXPADDOWN -40 105 80

32

4.5-5.5V

9.99

MALAYSIA

SPC572L64F2BC6AY Active

Package:
TQFP-EP 80L 10X10X1.0 EXPADDOWN
ECCN (US):
5A991.b.4.a
Budgetary Price (US$)*/Qty:
-

Part Number:

SPC572L64F2BC6AY

ECCN (EU):

NEC

Packing Type:

Tray

Operating Temperature (°C)

Min:

-40

Max:

105

CPU Clock Frequency (MHz) (max):

80

Flash Size (kB) (Data):

32

Features set:

4.5-5.5V

Country of Origin:

MALTA

SPC572L64F2BC6AR Active

Package:
TQFP-EP 80L 10X10X1.0 EXPADDOWN
ECCN (US):
5A991.b.4.a
Budgetary Price (US$)*/Qty:
-

Part Number:

SPC572L64F2BC6AR

ECCN (EU):

NEC

Packing Type:

Tape and Reel

Operating Temperature (°C)

Min:

-40

Max:

105

CPU Clock Frequency (MHz) (max):

80

Flash Size (kB) (Data):

32

Features set:

4.5-5.5V

Country of Origin:

MALAYSIA

Swipe or click the button to explore more details Don't show this again

(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors