SPC574S64E3

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32-bit Power Architecture MCU for Automotive Chassis and Safety Applications

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Product overview

Description

The SPC574Sx is a family of next generation microcontrollers built on the Power Architecture embedded category.

The SPC574Sx family of 32-bit microcontrollers is the latest achievement in integrated automotive application controllers. It belongs to an expanding family of automotive-focused products designed to address the next wave of Chassis and Safety electronics applications within the vehicle. The advanced and cost-efficient host processor core of this automotive controller family complies with the Power Architecture embedded category and only implements the VLE (variable-length encoding) APU, providing improved code density. It operates at speeds of up to 140 MHz and offers high performance processing optimized for low power consumption. It capitalizes on the available development infrastructure of current Power Architecture devices and is supported with software drivers, operating systems and configuration code to assist with users implementations.

  • All features

    • AEC-Q100 qualified
    • High performance e200z4d dual core
      • 32-bit Power Architecture technology CPU
      • Core frequency as high as 140 MHz
      • Dual issue 5-stage pipeline in-order execution core
      • Variable Length Encoding (VLE)
      • Core MPU
      • Floating Point, End-to-End Error Correction
      • 8 KB instruction cache with error detection code
      • 32 KB local data RAM and 4 KB data cache along with 8 KB instruction cache
    • 1600 KB (1.5 MB code + 64 KB data) on-chip flash memory: supports read during program and erase operations, and multiple blocks allowing EEPROM emulation
    • 128 KB on-chip RAM (96 KB on chip RAM + 32 KB local data RAM)
    • Multi-channel direct memory access controller (eDMA) with 32 channels
    • Comprehensive new generation ASILD safety concept
      • ASILD SEooC approach (Safety Element out of Context)
      • FCCU for collection and reaction to failure notifications
      • Memory Error Management Unit (MEMU) for collection and reporting of error events in memories
      • End-to-end Error Correction Code (e2eECC) logic
      • Cyclic redundancy check (CRC) unit
    • 8 enhanced 12-bit SAR analog converters
      • 2 sets of: 3 ADCs and one supervisor ADC
      • 1.5 µs conversion time at 12 MHz
      • Up to 32 physical channels
      • Dual Programmable CTU
    • 4 general purpose eTimer units (6 channels each)
    • 4 FlexPWM units
      • 2 (4 channels each) used for motor control with hardware synchronization between the control systems
      • 2 (2 channels each) used for SWG emulation
    • Communication interfaces
      • 4 LINFlexD modules
      • 4 deserial serial peripheral interface (DSPI) modules
      • 2 MCAN interfaces with advanced shared memory scheme (808 x 32-bit words for MCAN0 and 520 x 32-bit words for MCAN1) and CAN-FD support
      • 1 FlexRay module with 2 channels, 128 message buffers
      • 2 SENT interfaces (3 channels each)
    • Dual phase-locked loops with stable clock domain for peripherals and FM modulation domain for computational shell
    • Nexus Class 3 debug and trace interface
    • On-chip CAN/UART Bootstrap loader with BAF. Physical Interface (PHY) can be UART
    • Advanced and flexible supply scheme
      • On-chip voltage regulator for 1.2 V core logic supply. Bypass mode supported for external 1.2 V core logic supply
      • 3.3 V or 5 V IO and ADC supply (2 independent power domains available)
    • Junction temperature range -40 °C to 150 °C

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Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
SPC574S64E3CEFAR
Active
TQFP 100 14x14x1.0 Automotive Safety Ecopack2
SPC574S64E3CEFAY
Active
TQFP 100 14x14x1.0 Automotive Safety Ecopack2

SPC574S64E3CEFAR

Package:

TQFP 100 14x14x1.0

Material Declaration**:

PDF XML

Marketing Status

Active

Package

TQFP 100 14x14x1.0

Grade

Automotive Safety

RoHS Compliance Grade

Ecopack2

SPC574S64E3CEFAY

Package:

TQFP 100 14x14x1.0

Material Declaration**:

PDF XML

Marketing Status

Active

Package

TQFP 100 14x14x1.0

Grade

Automotive Safety

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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SPC574S64E3CEFAY
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Part Number:

SPC574S64E3CEFAY

Operating Temperature (°C)

Min:

Max:

CPU Clock Frequency (MHz) (max):

140

Features set:

-

Flash Size (kB) (Data):

64

SPC574S64E3CEFAR Active

Budgetary Price (US$)*/Qty:
-
Package:
Packing Type:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

Part Number:

SPC574S64E3CEFAR

Operating Temperature (°C)

Min:

Max:

CPU Clock Frequency (MHz) (max):

140

Features set:

-

Flash Size (kB) (Data):

64

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(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors