SPC58EC70E3

Active
Design Win

32-bit Power Architecture MCU for Automotive General Purpose Applications - Chorus family

Download datasheet
Overview
Sample & Buy
Solutions
Documentation
CAD Resources
Tools & Software
Quality & Reliability
Get Started
Partner products
Sales Briefcase

Product overview

Description

The SPC584Cx and SPC58ECx microcontroller is the first in a new family of devices superseding the SPC564Cx and SPC56ECx family. SPC584Cx and SPC58ECx builds on the legacy of the SPC564Cx and SPC56ECx family, while introducing new features coupled with higher throughput to provide substantial reduction of cost per feature and significant power and performance improvement (MIPS per mW). On the SPC584Cx and SPC58ECx device, there are two processor cores e200z420 and one e200z0 core embedded in the Hardware Security Module.

  • All features

    • AEC-Q100 qualified
    • High performance e200z420n3 dual core
      • 32-bit Power Architecture technology CPU
      • Core frequency as high as 180 MHz
      • Variable Length Encoding (VLE)
    • 4224 KB (4096 KB code flash + 128 KB data flash) on-chip flash memory: supports read during program and erase operations, and multiple blocks allowing EEPROM emulation
    • 176 KB HSM dedicated flash memory (144 KB code + 32 KB data)
    • 384 KB on-chip general-purpose SRAM (in addition to 128 KB core local data RAM: 64 KB included in each CPU)
    • Multi-channel direct memory access controller (eDMA) with 64 channels
    • 1 interrupt controller (INTC)
    • Comprehensive new generation ASIL-B safety concept
      • ASIL-B of ISO 26262
      • FCCU for collection and reaction to failure notifications
      • Memory Error Management Unit (MEMU) for collection and reporting of error events in memories
      • Cyclic redundancy check (CRC) unit
    • Crossbar switch architecture for concurrent access to peripherals, Flash, or RAM from multiple bus masters with end-to-end ECC
    • Body cross triggering unit (BCTU)
      • Triggers ADC conversions from any eMIOS channel
      • Triggers ADC conversions from up to 2 dedicated PIT_RTIs
    • Enhanced modular IO subsystem (eMIOS): up to 64 timed I/O channels with 16-bit counter resolution
    • Enhanced analog-to-digital converter system with:
      • 3 independent fast 12-bit SAR analog converters
      • 1 supervisor 12-bit SAR analog converter
      • 1 10-bit SAR analog converter with STDBY mode support
    • Communication interfaces
      • 18 LINFlexD modules
      • 8 deserial serial peripheral interface (DSPI) modules
      • 8 MCAN interfaces with advanced shared memory scheme and ISO CAN-FD support
      • Dual-channel FlexRay controller
      • 1 ethernet controller 10/100 Mbps, compliant IEEE 802.3-2008
    • Low power capabilities
      • Versatile low power modes
      • Ultra low power standby with RTC
      • Smart Wake-up Unit for contact monitoring
      • Fast wakeup schemes
    • Dual phase-locked loops with stable clock domain for peripherals and FM modulation domain for computational shell
    • Nexus development interface (NDI) per IEEE-ISTO 5001-2003 standard, with some support for 2010 standard
    • Boot assist Flash (BAF) supports factory programming using a serial bootload through the asynchronous CAN or LIN/UART
    • Junction temperature range -40 °C to 150 °C

You might also like...

EDA Symbols, Footprints and 3D Models

STMicroelectronics - SPC58EC70E3

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

Symbols

Symbols

Footprints

Footprints

3D model

3D models

Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
SPC58EC70E3F001X
Active
TQFP 100 14x14x1.0 Automotive Safety Ecopack2

SPC58EC70E3F001X

Package:

TQFP 100 14x14x1.0

Material Declaration**:

PDF XML

Marketing Status

Active

Package

TQFP 100 14x14x1.0

Grade

Automotive Safety

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

Swipe or click the button to explore more details Don't show this again
Part Number
Order from distributors
Order from ST
Marketing Status
ECCN (US)
ECCN (EU)
Packing Type
Package
Temperature (°C) CPU Clock Frequency (MHz) (max)
Budgetary Price (US$)*/Qty
Flash Size (kB) (Data)
Features set
Unit Price (US$)
Country of Origin
min
max
SPC58EC70E3F001X Available at distributors

Distributor availability of SPC58EC70E3F001X

Distributor Name
Region Stock Min. Order Third party link

Distributor reported inventory date:

No availability of distributors reported, please contact our sales office
Active
5A991.b.4.a NEC Tape and Reel TQFP 100 14x14x1.0 -40 - 180

128

-

-

MALAYSIA

SPC58EC70E3F001X Active

Package:
TQFP 100 14x14x1.0
ECCN (US):
5A991.b.4.a
Budgetary Price (US$)*/Qty:
-

Part Number:

SPC58EC70E3F001X

ECCN (EU):

NEC

Packing Type:

Tape and Reel

Operating Temperature (°C)

Min:

-40

Max:

-

CPU Clock Frequency (MHz) (max):

180

Flash Size (kB) (Data):

128

Features set:

-

Country of Origin:

MALAYSIA

Swipe or click the button to explore more details Don't show this again

(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors