LSM6DS3TR-C

iNEMO 6DoF inertial module, for entry level / mid-tier smart phones and Portable PC platforms

Quick View Resources

The LSM6DS3TR-C is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 0.90 mA in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.

The LSM6DS3TR-C supports main OS requirements, offering real, virtual and batch sensors with 4 kbyte for dynamic data batching.

ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.

The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.

The LSM6DS3TR-C has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.

High robustness to mechanical shock makes the LSM6DS3TR-C the preferred choice of system designers for the creation and manufacturing of reliable products.

The LSM6DS3TR-C is available in a plastic land grid array (LGA) package.

Key Features

“Always-on” experience with low power consumption for both accelerometer and gyroscope
Power consumption: 0.90 mA in combo high-performance mode
Smart FIFO up to 4 kbyte based on features set
Android M compliant
Hard, soft ironing for external magnetic sensor corrections
±2/±4/±8/±16 g full scale
±125/±250/±500/±1000/±2000 dps full scale
Analog supply voltage: 1.71 V to 3.6 V
Independent IO supply (1.62 V)
Compact footprint, 2.5 mm x 3 mm x 0.83 mm
SPI & I² C serial interface with main processor data synchronization feature
Pedometer, step detector and step counter
Significant motion and tilt function
Standard interrupts: free-fall, wakeup, 6D/4D orientation, click and double-click
Embedded temperature sensor
ECOPACK^® , RoHS and “Green” compliant

Resources

Technical Documentation

Product Specifications

	Description	Version	Size
	DS11937: iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope	3.0	1 MB

Application Notes

	Description	Version	Size
	AN5130: LSM6DS3TR-C: always-on 3D accelerometer and 3D gyroscope	1.0	1 MB

Technical Notes & Articles

	Description	Version	Size
	TN0018: Surface mounting guidelines for MEMS sensors in an LGA package	6.0	214 KB

Design Notes & Tips

	Description	Version	Size
	DT0064: Noise analysis and identification in MEMS sensors, Allan, Time, Hadamard, Overlapping, Modified, Total variance	1.0	616 KB

Publications and Collaterals

Brochures

	Description	Version	Size
	MEMS and Sensors, Smart solutions for IoT and enhanced user experience		1 MB

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Sample & Buy

Part Number	Package	Packing Type	Marketing Status	Unit Price (US$) *	Quantity	ECCN (EU)	ECCN (US)	Country of Origin	More info	Order from ST	Order from Distributors
LSM6DS3TR-C	VFLGA2.5X3X.86 14L P.5 L.475X.25	Tape And Reel	Active : Product is in volume production	-	-	NEC	EAR99	PHILIPPINES	MORE INFO		No availability reported, please contact our Sales office

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors

Quality & Reliability

Part Number	Marketing Status	Package	RoHS Compliance Grade	Material Declaration**
LSM6DS3TR-C	Active	VFLGA2.5X3X.86 14L P.5 L.475X.25	Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.