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The LSM6DS3TR-C is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 0.90 mA in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.
The LSM6DS3TR-C supports main OS requirements, offering real, virtual and batch sensors with 4 kbyte for dynamic data batching.
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.
The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
The LSM6DS3TR-C has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
High robustness to mechanical shock makes the LSM6DS3TR-C the preferred choice of system designers for the creation and manufacturing of reliable products.
The LSM6DS3TR-C is available in a plastic land grid array (LGA) package.Key Features
- “Always-on” experience with low power consumption for both accelerometer and gyroscope
- Power consumption: 0.90 mA in combo high-performance mode
- Smart FIFO up to 4 kbyte based on features set
- Android M compliant
- Hard, soft ironing for external magnetic sensor corrections
- ±2/±4/±8/±16 g full scale
- ±125/±250/±500/±1000/±2000 dps full scale
- Analog supply voltage: 1.71 V to 3.6 V
- Independent IO supply (1.62 V)
- Compact footprint, 2.5 mm x 3 mm x 0.83 mm
- SPI & I2C serial interface with main processor data synchronization feature
- Pedometer, step detector and step counter
- Significant motion and tilt function
- Standard interrupts: free-fall, wakeup, 6D/4D orientation, click and double-click
- Embedded temperature sensor
- ECOPACK®, RoHS and “Green” compliant
Sample & Buy
| Part Number | Package | Packing Type | Marketing Status | Budgetary Price (US$)* | Quantity | ECCN (US) | Country of Origin | Order from Distributors | Order from ST |
|---|---|---|---|---|---|---|---|---|---|
| LSM6DS3TR-C | VFLGA2.5X3X.86 14L P.5 L.475X.25 | Tape And Reel |
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- | - | EAR99 | PHILIPPINES | No availability of distributors reported, please contact our sales office |
LSM6DS3TR-C
Package
VFLGA2.5X3X.86 14L P.5 L.475X.25Packing Type
Tape And ReelUnit Price (US$)
*(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
Ecosystems
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Picture Part number Manufacturer Description AWS IoT Core AWS AWS IoT Core is a managed cloud platform that lets connected devices easily and securely interact with cloud applications and other devices. AZURE Cloud Microsoft Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks. Watson IoT Platform IBM IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices. Part NumberAWS IoT Core is a managed cloud platform that lets connected devices easily and securely interact with cloud applications and other devices.
Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks.
IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices.
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Support and Applications
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Picture Part number Manufacturer Description SensorTile.box customization services FAE Technology Engineering services on theSensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing. Part NumberEngineering services on theSensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing.
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| Part Number | Marketing Status | Package | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|
| LSM6DS3TR-C |
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VFLGA2.5X3X.86 14L P.5 L.475X.25 | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
