STM32H747BI

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High-performance and DSP with DP-FPU, Arm Cortex-M7 + Cortex-M4 MCU with 2MBytes of Flash memory, 1MB RAM, 480 MHz CPU, Art Accelerator, L1 cache, external memory interface, large set of peripherals, SMPS

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Product overview

Description

STM32H747xI/G devices are based on the high-performance Arm® Cortex®-M7 and Cortex®-M4 32-bit RISC cores. The Cortex®-M7 core operates at up to 480 MHz and the Cortex®-M4 core at up to 240 MHz. Both cores feature a floating point unit (FPU) which supports Arm® single- and double-precision (Cortex®-M7 core) operations and conversions (IEEE 754 compliant), including a full set of DSP instructions and a memory protection unit (MPU) to enhance application security. STM32H747xI/G devices incorporate high-speed embedded memories with a dual-bank Flash memory of up to 2 Mbytes, up to 1 Mbyte of RAM (including 192 Kbytes of TCM RAM, up to 864 Kbytes of user SRAM and 4 Kbytes of backup SRAM), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, 2x32-bit multi-AHB bus matrix and a multi layer AXI interconnect supporting internal and external memory access.
All the devices offer three ADCs, two DACs, two ultra-low power comparators, a low-power RTC, a high-resolution timer, 12 general-purpose 16-bit timers, two PWM timers for motor control, five low-power timers, a true random number generator (RNG). The devices support four digital filters for external sigma-delta modulators (DFSDM). They also feature standard and advanced communication interfaces.
  • All features

    • Dual core
      • 32-bit Arm® Cortex®-M7 core with double-precision FPU and L1 cache: 16 Kbytes of data and 16 Kbytes of instruction cache; frequency up to 480 MHz, MPU, 1027 DMIPS/ 2.14 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
      • 32-bit Arm® 32-bit Cortex®-M4 core with FPU, Adaptive real-time accelerator (ART Accelerator™) for internal Flash memory and external memories, frequency up to 240 MHz, MPU, 300 DMIPS/1.25 DMIPS /MHz (Dhrystone 2.1), and DSP instructions
    • Memories
      • Up to 2 Mbytes of Flash memory with read-while-write support
      • 1 Mbyte of RAM: 192 Kbytes of TCM RAM (inc. 64 Kbytes of ITCM RAM + 128 Kbytes of DTCM RAM for time critical routines), 864 Kbytes of user SRAM, and 4 Kbytes of SRAM in Backup domain
      • Dual mode Quad-SPI memory interface running up to 133 MHz
      • Flexible external memory controller with up to 32-bit data bus: SRAM, PSRAM, SDRAM/LPSDR SDRAM, NOR/NAND Flash memory clocked up to 125 MHz in Synchronous mode
      • CRC calculation unit
    • Security
      • ROP, PC-ROP, active tamper
    • General-purpose input/outputs
      • Up to 168 I/O ports with interrupt capability
    • Reset and power management
      • 3 separate power domains which can be independently clock-gated or switched off:
        • D1: high-performance capabilities
        • D2: communication peripherals and timers
        • D3: reset/clock control/power management
      • 1.62 to 3.6 V application supply and I/Os
      • POR, PDR, PVD and BOR
      • Dedicated USB power embedding a 3.3 V internal regulator to supply the internal PHYs
      • Embedded regulator (LDO) to supply the digital circuitry
      • High power-efficiency SMPS step-down converter regulator to directly supply VCORE and/or external circuitry
      • Voltage scaling in Run and Stop mode (6 configurable ranges)
      • Backup regulator (~0.9 V)
      • Voltage reference for analog peripheral/VREF+
      • 1.2 to 3.6 V VBAT supply
      • Low-power modes: Sleep, Stop, Standby and VBAT supporting battery charging
    • Low-power consumption
      • VBAT battery operating mode with charging capability
      • CPU and domain power state monitoring pins
      • 2.95 μA in Standby mode (Backup SRAM OFF, RTC/LSE ON)
    • Clock management
      • Internal oscillators: 64 MHz HSI, 48 MHz HSI48, 4 MHz CSI, 32 kHz LSI
      • External oscillators: 4-48 MHz HSE, 32.768 kHz LSE
      • 3× PLLs (1 for the system clock, 2 for kernel clocks) with Fractional mode
    • Interconnect matrix
    • 4 DMA controllers to unload the CPU
      • 1× high-speed master direct memory access controller (MDMA) with linked list support
      • 2× dual-port DMAs with FIFO
      • 1× basic DMA with request router capabilities
    • Up to 35 communication peripherals
      • 4× I2Cs FM+ interfaces (SMBus/PMBus)
      • 4× USARTs/4x UARTs (ISO7816 interface, LIN, IrDA, up to 12.5 Mbit/s) and 1x LPUART
      • 6× SPIs, 3 with muxed duplex I2S audio class accuracy via internal audio PLL or external clock, 1x I2S in LP domain (up to 150 MHz)
      • 4x SAIs (serial audio interface)
      • SPDIFRX interface
      • SWPMI single-wire protocol master I/F
      • MDIO Slave interface
      • 2× SD/SDIO/MMC interfaces (up to 125 MHz)
      • 2× CAN controllers: 2 with CAN FD, 1 with time-triggered CAN (TT-CAN)
      • 2× USB OTG interfaces (1FS, 1HS/FS) crystal-less solution with LPM and BCD
      • Ethernet MAC interface with DMA controller
      • HDMI-CEC
      • 8- to 14-bit camera interface (up to 80 MHz)
    • 11 analog peripherals
      • 3× ADCs with 16-bit max. resolution (up to 36 channels, up to 3.6 MSPS)
      • 1× temperature sensor
      • 2× 12-bit D/A converters (1 MHz)
      • 2× ultra-low-power comparators
      • 2× operational amplifiers (7.3 MHz bandwidth)
      • 1× digital filters for sigma delta modulator (DFSDM) with 8 channels/4 filters
    • Graphics
      • LCD-TFT controller up to XGA resolution
      • MIPI DSI host including an MIPI D-PHY to interface with low-pin count large displays
      • Chrom-ART graphical hardware Accelerator™ (DMA2D) to reduce CPU load
      • Hardware JPEG Codec
    • Up to 22 timers and watchdogs
      • 1× high-resolution timer (2.1 ns max resolution)
      • 2× 32-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input (up to 240 MHz)
      • 2× 16-bit advanced motor control timers (up to 240 MHz)
      • 10× 16-bit general-purpose timers (up to 240 MHz)
      • 5× 16-bit low-power timers (up to 240 MHz)
      • 4× watchdogs (independent and window)
      • 2× SysTick timers
      • RTC with sub-second accuracy and hardware calendar
    • Debug mode
      • SWD & JTAG interfaces
      • 4-Kbyte Embedded Trace Buffer
    • True random number generators (3 oscillators each)
    • 96-bit unique ID

Circuit Diagram

All tools & software

    • Part number
      Status
      Description
      Type
      Supplier

      Enhanced Carrier Connectivity Services

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      Optimized regional cellular connectivity with one point of accountability & invoice for multiple Tier-1 carrier services

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      Enhanced Carrier Connectivity Services

      Description:

      Optimized regional cellular connectivity with one point of accountability & invoice for multiple Tier-1 carrier services

      Global Smart Connectivity Services

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      Smart Connectivity simplifies IoT deployments, eliminates coverage gaps with access to multiple networks, while reducing the total cost of opportunity

      Cloud Sierra Wireless
      Global Smart Connectivity Services

      Description:

      Smart Connectivity simplifies IoT deployments, eliminates coverage gaps with access to multiple networks, while reducing the total cost of opportunity

      Octave Services

      Active

      Octave all-in-one platform for connecting IoT assets and microcontrollers to the cloud

      Cloud Sierra Wireless
      Octave Services

      Description:

      Octave all-in-one platform for connecting IoT assets and microcontrollers to the cloud
    • Part number
      Status
      Description
      Type
      Supplier

      Enhanced Carrier Connectivity SIM

      Active

      Cellular connectivity that simplifies, optimizes regional deployments via 1 point of accountability and invoice for multiple Tier-1 carrier services

      Components and Modules Sierra Wireless
      Enhanced Carrier Connectivity SIM

      Description:

      Cellular connectivity that simplifies, optimizes regional deployments via 1 point of accountability and invoice for multiple Tier-1 carrier services

      Global Smart Connectivity SIM

      Active

      Sierra Wireless' Smart Connectivity provides resilient Global cellular coverage in a single SIM

      Components and Modules Sierra Wireless
      Global Smart Connectivity SIM

      Description:

      Sierra Wireless' Smart Connectivity provides resilient Global cellular coverage in a single SIM

      Octave Cellular Modules

      Active

      Octave enabled LPWA/LTE-M connectivity with 2G fallback for any cellular network in the world

      Components and Modules Sierra Wireless
      Octave Cellular Modules

      Description:

      Octave enabled LPWA/LTE-M connectivity with 2G fallback for any cellular network in the world

      OpenMV Cam

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      The OnpenMV Cam H7 is a small, low power, microcontroller board which allows you to easily implement applications using machine vision in the real-world.

      Components and Modules OpenMV
      OpenMV Cam

      Description:

      The OnpenMV Cam H7 is a small, low power, microcontroller board which allows you to easily implement applications using machine vision in the real-world.

      SensorTile.box

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      SensorTile.box is an evaluation kit IoT node made up of an electronics board, a lithium rechargeble battery, a plastic housing and APP.

      Components and Modules FAE Technology
      SensorTile.box

      Description:

      SensorTile.box is an evaluation kit IoT node made up of an electronics board, a lithium rechargeble battery, a plastic housing and APP.