STM32L100C6

NRND
Education

Ultra-low-power 32-bit Value Line Arm Cortex-M3 MCU with 32 Kbytes of Flash memory, 32 MHz CPU, LCD, USB

Download datasheet
Overview
Online design
Sample & Buy
Solutions
Documentation
CAD Resources
Tools & Software
Quality & Reliability
Partner products
Sales Briefcase

Product overview

Description

The ultra-low-power STM32L100C6 and STM32L100R8/RB devices incorporate the connectivity power of the universal serial bus (USB) with the high-performance ARM® Cortex®-M3 32-bit RISC core operating at a frequency of 32 MHz (33.3 DMIPS), a memory protection unit (MPU), high-speed embedded memories (Flash memory up to 128 Kbytes and RAM up to 10 Kbytes) and an extensive range of enhanced I/Os and peripherals connected to two APB buses. All the devices offer a 12-bit ADC, 2 DACs and 2 ultra-low-power comparators, six general-purpose 16-bit timers and two basic timers, which can be used as time bases.
Moreover, the STM32L100C6 and STM32L100R8/RB devices contain standard and advanced communication interfaces: up to two I2Cs and SPIs, three USARTs and a USB.
They also include a real-time clock with sub-second counting and a set of backup registers that remain powered in Standby mode.
Finally, the integrated LCD controller has a built-in LCD voltage generator that allows to drive up to 8 multiplexed LCDs with contrast independent of the supply voltage.
The ultra-low-power STM32L100C6 and STM32L100R8/RB devices operate from a 1.8 to 3.6 V power supply. They are available in the -40 to +85 °C temperature range. A comprehensive set of power-saving modes allows the design of low-power applications.
  • All features

    • Ultra-low-power platform
      • 1.8 V to 3.6 V power supply
      • -40°C to 85°C temperature range
      • 0.3 µA Standby mode (2 wakeup pins)
      • 0.9 µA Standby mode + RTC
      • 0.57 µA Stop mode (16 wakeup lines)
      • 1.2 µA Stop mode + RTC
      • 9 µA Low-power run mode
      • 214 µA/MHz Run mode
      • 10 nA ultra-low I/O leakage
      • < 8 µs wakeup time
    • Core: 32-bit ARM® Cortex®-M3 CPU
      • From 32 kHz up to 32 MHz max
      • 1.25 DMIPS/MHz (Dhrystone 2.1)
      • Memory protection unit
    • Reset and supply management
      • Ultra-safe, low-power BOR (brownout reset) with 5 selectable thresholds
      • Ultra-low-power POR/PDR
      • Programmable voltage detector (PVD)
    • Clock sources
      • 1 to 24 MHz crystal oscillator
      • 32 kHz oscillator for RTC with calibration
      • High-speed internal 16 MHz
      • Internal low-power 37 kHz RC
      • Internal multispeed low-power 65 kHz to 4.2 MHz
      • PLL for CPU clock and USB (48 MHz)
    • Pre-programmed bootloader
      • USART supported
    • Development support
      • Serial wire debug supported
      • JTAG supported
    • Up to 51 fast I/Os (42 I/Os 5V tolerant), all mappable on 16 external interrupt vectors
    • Memories
      • Up to 128 Kbytes of Flash memory with ECC
      • Up to 10 Kbytes of RAM
      • Up to 2 Kbytes of true EEPROM with ECC
      • 20-byte backup register
    • LCD Driver for up to 8x28 segments
    • Analog peripherals
      • 12-bit ADC 1 Msps up to 20 channels
      • 12-bit DAC 2 channels with output buffers
      • Two ultra-low-power comparators
    • Seven DMA controller channels
    • Eight communication interface peripherals
      • One USB 2.0
      • Three USARTs (ISO 7816, IrDA)
      • Two SPIs (16 Mbit/s)
      • Two I2Cs (SMBus/PMBus)
    • Ten timers:
      • Six 16-bit timers with up to 4 IC/OC/PWM channels
      • Two 16-bit basic timers
      • Two watchdog timers (independent and window)
    • CRC calculation unit
    • All packages ECOPACK®2

Circuit Diagram

You might also like...

All tools & software

    • Part number
      Status
      Description
      Type
      Supplier

      Enhanced Carrier Connectivity Services

      Active

      Optimized regional cellular connectivity with one point of accountability & invoice for multiple Tier-1 carrier services

      Cloud Sierra Wireless
      Enhanced Carrier Connectivity Services

      Description:

      Optimized regional cellular connectivity with one point of accountability & invoice for multiple Tier-1 carrier services

      Global Smart Connectivity Services

      Active

      Smart Connectivity simplifies IoT deployments, eliminates coverage gaps with access to multiple networks, while reducing the total cost of opportunity

      Cloud Sierra Wireless
      Global Smart Connectivity Services

      Description:

      Smart Connectivity simplifies IoT deployments, eliminates coverage gaps with access to multiple networks, while reducing the total cost of opportunity

      Octave Services

      Active

      Octave all-in-one platform for connecting IoT assets and microcontrollers to the cloud

      Cloud Sierra Wireless
      Octave Services

      Description:

      Octave all-in-one platform for connecting IoT assets and microcontrollers to the cloud
    • Part number
      Status
      Description
      Type
      Supplier

      Enhanced Carrier Connectivity SIM

      Active

      Cellular connectivity that simplifies, optimizes regional deployments via 1 point of accountability and invoice for multiple Tier-1 carrier services

      Components and Modules Sierra Wireless
      Enhanced Carrier Connectivity SIM

      Description:

      Cellular connectivity that simplifies, optimizes regional deployments via 1 point of accountability and invoice for multiple Tier-1 carrier services

      Global Smart Connectivity SIM

      Active

      Sierra Wireless' Smart Connectivity provides resilient Global cellular coverage in a single SIM

      Components and Modules Sierra Wireless
      Global Smart Connectivity SIM

      Description:

      Sierra Wireless' Smart Connectivity provides resilient Global cellular coverage in a single SIM

      Octave Cellular Modules

      Active

      Octave enabled LPWA/LTE-M connectivity with 2G fallback for any cellular network in the world

      Components and Modules Sierra Wireless
      Octave Cellular Modules

      Description:

      Octave enabled LPWA/LTE-M connectivity with 2G fallback for any cellular network in the world

      RF Modules

      Active

      RF modules for Sub GigaHz and Bluetooth.

      Components and Modules DiZiC
      RF Modules

      Description:

      RF modules for Sub GigaHz and Bluetooth.

      SIGFOX-MOD1-C / -E

      Active

      The SIGFOX-MOD1 are ultra-low-power modules designed especially for sensor node applications mounted with chip antenna.

      Components and Modules XoverIoT
      SIGFOX-MOD1-C / -E

      Description:

      The SIGFOX-MOD1 are ultra-low-power modules designed especially for sensor node applications mounted with chip antenna.