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STM32MP157 microprocessors are based on the flexible architecture of a Dual Arm® Cortex®-A7 core running at 650 MHz and Cortex®-M4 at 209 MHz combined with a dedicated 3D graphics processing unit (GPU) and MIPI-DSI display interface and a CAN FD interface.

Specifically designed to accelerate 3D graphics in applications such as graphical user interfaces (GUI), menu displays or animations, the STM32MP157 3D OpenGL ES 2.0 graphics engine works together with an optimized software stack design for industry-standard APIs with support for Android™ and Linux® embedded development platforms.

As well as an LCD-TFT display controller, the STM32MP157 line embeds up to 37 communication peripherals including 10/100M or Gigabit Ethernet, 3x USB 2.0 Host/OTG, 29x Timers and Advanced Analog.

In addition to true random number generators (TRNG), hardware cryptographic and hash processors, the security option includes Secure Boot, TrustZone® peripherals, and an active tamper-detect feature.

The STM32MP157 line is available in 4 different packages for a cost-efficient PCB architecture:

  • 448-pin LFBGA package: 18 x 18 mm, 0.8 mm pitch package enabling a 6-layer plated-through hole (PTH) PCB
  • 354-pin LFBGA package: 16 x 16 mm, 0.8 mm pitch package enabling a 4-layer PTH PCB
  • 361-pin TFBGA package: 12 x 12 mm, 0.5 mm pitch package enabling a 4-layer PTH and laser-drilled via PCB
  • 257-pin TFBGA package: 10 x 10 mm, 0.5 mm pitch package enabling a 4-layer PTH PCB