STM32WB06KC

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Ultra-low-power, Arm Cortex-M0+ MCU 64 MHz with 256 Kbytes of Flash memory, 32 Kbytes of RAM, Bluetooth LE 5.4

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Product overview

Key Benefits

High wireless performance

  • Best-in-class radio enabling robust and stable connectivity​
  • State-of-the-art radio efficiency​
  • Power control options on IoT devices​ for longer battery life

Cost effectiveness

  • Optimal price point ensuring best value respect to feature availability​
  • High integration in tiny packages (integrating balun and HSE)​
  • Enables 2-layer PCBs for reduced BOM and simplified circuitry

Extensive wireless design ecosystem

  • Streamlined project development thanks to STM32Cube​
  • RF reference designs, IPD chip for easy impedance matching​
  • Bluetooth® Low Energy and Mesh stacks, software, tools, and resources.​

Description

The STM32WB0xxC is an ultra-low-power programmable Bluetooth® Low Energy wireless SoC solution. It embeds STMicroelectronics state-of-art 2.4 GHz RF radio IPs combining unparalleled performance with extremely long-battery lifetime. It is compliant with Bluetooth® Low Energy SIG core specification version 5.4 addressing point-to-point connectivity and Bluetooth Mesh networking and allows large-scale device networks to be established in a reliable way. The STM32WB0xxC is also suitable for 2.4 GHz proprietary radio wireless communication to address ultra-low latency applications.

The STM32WB0xxC embeds a Cortex®‑M0+ microcontroller that can operate up to 64 MHz and also the BlueNRG core coprocessor (DMA based) for Bluetooth® Low Energy timing critical operations.

In addition, the STM32WB0xxC provides enhanced security hardware support by dedicated hardware functions:

True random number generator (RNG), encryption AES maximum 128-bit security coprocessor, public key accelerator (PKA), CRC calculation unit, 64-bit unique ID, flash memory read and write protection.

The STM32WB0xxC can be configured to support standalone or network processor applications. In the first configuration, the STM32WB0xxC operates as a single device in the application for managing both the application code and the Bluetooth® Low Energy stack.

The STM32WB0xxC embeds high-speed and flexible memory types: flash memory of 256 Kbytes, RAM memory of 64 Kbytes, one-time-programmable (OTP) memory area of 1 Kbyte, ROM memory of 7 Kbytes (ST reserved area).

Direct data transfer between memory and peripherals and from memory-to-memory is supported by eight DMA channels with a full flexible channel mapping by the DMAMUX peripheral.

The STM32WB0xxC embeds a 12-bit ADC, allowing measurements of up to eight external sources and up to three internal sources, including battery monitoring and a temperature sensor.

The STM32WB0xxC has a low-power RTC and one advanced 16-bit timer.

The STM32WB0xxC features standard and advanced communication interfaces:

1x SPI, 2x SPI/I2S, 1x LPUART, 1x USART supporting ISO 7816 (smartcard mode), IrDA, and modbus mode, 2x I2C supporting SMBus/PMBus, 1x channel PDM.

The STM32WB0xxC operates in the -40 to +105°C temperature range from a 1.7 V to 3.6 V power supply. A comprehensive set of power-saving modes enables the design of low-power applications.

The STM32WB0xxC integrates a high efficiency SMPS step-down converter and an integrated PDR circuitry with a fixed threshold that generates a device reset when the VDD drops under 1.65 V.

The STM32WB0xxC comes in different package versions supporting up to:

32 I/Os for the VFQFPN48 package, 20 I/Os for the VFQFPN32 package, 30 I/Os for the WLCSP49 package.

  • All features

    • Includes ST state-of-the-art patented technology.
    • Bluetooth® Low Energy system-on-chip supporting Bluetooth 5.4 specifications
      • 2 Mbps data rate
      • Long range (Coded PHY)
      • Advertising extensions
      • Channel selection algorithm #2
      • GATT caching
      • LE Ping procedure
      • Periodic advertising and periodic advertising sync transfer
      • Periodic advertising with response
      • Advertising coding selection
      • Encrypted advertising
      • LE L2CAP connection-oriented channel
      • LE power control and path loss monitoring
      • LE channel classification
      • Enhanced ATT (EATT)
      • Connection subrating
      • Broadcast isochronous streams (BIS)
      • Connection isochronous streams (CIS)
    • Radio
      • Rx sensitivity level: -97 dBm @ 1 Mbps, -104 dBm @ 125 kbps (long range)
      • Programmable output power up to +8 dBm (at antenna connector)
      • Data rate supported: 2 Mbps, 1 Mbps, 500 kbps, and 125 kbps
      • 128 physical connections
      • Integrated balun
      • Support for external PA
      • STM32WB0xxC core coprocessor (DMA based) for Bluetooth® Low Energy timing critical operation
      • 2.4 GHz proprietary radio driver
      • Suitable for systems requiring compliance with the following radio frequency regulations: ETSI EN 300 328, EN 300 440, FCC CFR47 part 15, ARIB STD-T66
      • Available integrated passive device (IPD) companion chip for optimized matching and filtering
    • Ultra-low-power features (ultra-low-power devices)
      • 10 nA in Shutdown mode (1.8 V)
      • 0.6 μA in Deepstop mode (with external LSE and Bluetooth® Low Energy wake-up sources, 1.8 V)
      • 0.9 μA in Deepstop mode (with internal LSI and Bluetooth® Low Energy wake-up sources, 1.8 V)
      • 4.3 mA peak current in Tx (@ 0 dBm, 3.3 V)
      • 3.4 mA peak current in Rx (@ sensitivity level, 3.3 V)
      • High performance and ultralow power Arm® Cortex®-M0+ 32-bit, running up to 64 MHz
      • Dynamic current consumption: 16.5 μA/MHz
      • Operating supply voltage: from 1.7 to 3.6 V
    • Security
      • Flash read/write protection
      • SWD disabling
      • Secure bootloader
      • True random number generator (RNG)
      • Hardware encryption AES maximum 128-bit security coprocessor
      • Hardware public key accelerator (PKA)
      • CRC calculation unit
      • 64-bit unique ID
    • Clock management
      • High efficiency embedded SMPS step-down converter with intelligent bypass mode
      • Ultra-low-power power-on-reset (POR) and power-down-reset (PDR)
      • Programmable voltage detector (PVD)
      • Fail-safe 32 MHz crystal oscillator with integrated trimming capacitors
      • 32 kHz crystal oscillator
      • Internal low-power 32 kHz RO
    • Memories
      • On-chip nonvolatile flash memory of 256 Kbytes
      • On-chip RAM of 64 Kbytes or 32 Kbytes
      • One-time-programmable (OTP) memory area of 1 Kbyte
      • Embedded UART bootloader
      • Ultra-low-power modes with or without timer and RAM retention
    • System peripherals
      • 1x DMA controller with eight channels supporting ADC, SPI, I2C, USART, and LPUART
      • 1x SPI
      • 2x SPI/I2S
      • 2x I2C (SMBus/PMBus)
      • 1x PDM (digital microphone interface)
      • 1x LPUART
      • 1x USART (ISO 7816 smartcard mode, IrDA, SPI controller, and modbus)
      • 1x independent WDG
      • 1x real-time clock (RTC)
      • 1x independent SysTick
      • 1x 16-bit, six channel advanced timer
    • General-purpose inputs/outputs
      • Quadrature decoder
      • Up to 32 fast I/Os
      • 28 of them with wake-up capability
      • 31 of them 5 V tolerant
    • Analog peripherals
      • 12-bit ADC with eight input channels, up to 16 bits with a decimation filter
      • Battery monitoring
      • Analog watchdog
      • Analog mic I/F with PGA
    • Debug
      • Development support
      • Serial wire debug (SWD)
      • Four breakpoints and two watchpoints
    • All packages are ECOPACK2 compliant.

Circuit Diagram

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Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
STM32WB06KCV6TR
Active
VFQFPN 32 5x5x1.0 mm Industrial Ecopack2
STM32WB06KCV7TR
Active
VFQFPN 32 5x5x1.0 mm Industrial Ecopack2

STM32WB06KCV6TR

Package:

VFQFPN 32 5x5x1.0 mm

Material Declaration**:

Marketing Status

Active

Package

VFQFPN 32 5x5x1.0 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32WB06KCV7TR

Package:

VFQFPN 32 5x5x1.0 mm

Material Declaration**:

Marketing Status

Active

Package

VFQFPN 32 5x5x1.0 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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D/A Converters (typ) (12-bit)
Timers (typ) (16-bit)
Timers (typ) (32-bit)
Number of Channels (typ)
SMPS
Number of Channels (typ)
UART (typ)
I/Os (High Current)
Integrated op-amps
Comparator
SPI (typ)
USART (typ)
Number of Channels (typ)
I2S (typ)
Advanced Motor Control Timers
CAN (2.0)
CAN (FD)
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STM32WB06KCV6TR
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STM32WB06KCV7TR
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STM32WB06KCV6TR Active

Budgetary Price (US$)*/Qty:
-
Package:
Packing Type:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

Part Number:

STM32WB06KCV6TR

Operating Temperature (°C)

Min:

Max:

D/A Converters (typ) (12-bit):

-

Timers (typ) (16-bit):

3

Timers (typ) (32-bit):

-

Number of Channels (typ):

-

SMPS:

Internal

Number of Channels (typ):

-

UART (typ):

-

I/Os (High Current):

20

Integrated op-amps:

-

Comparator:

-

SPI (typ):

-

USART (typ):

-

Number of Channels (typ):

8

I2S (typ):

2

Advanced Motor Control Timers:

-

CAN (2.0):

-

CAN (FD):

-

STM32WB06KCV7TR Active

Budgetary Price (US$)*/Qty:
-
Package:
Packing Type:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

Part Number:

STM32WB06KCV7TR

Operating Temperature (°C)

Min:

Max:

D/A Converters (typ) (12-bit):

-

Timers (typ) (16-bit):

3

Timers (typ) (32-bit):

-

Number of Channels (typ):

-

SMPS:

Internal

Number of Channels (typ):

-

UART (typ):

-

I/Os (High Current):

20

Integrated op-amps:

-

Comparator:

-

SPI (typ):

-

USART (typ):

-

Number of Channels (typ):

8

I2S (typ):

2

Advanced Motor Control Timers:

-

CAN (2.0):

-

CAN (FD):

-

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