Product overview
Description
The ST25DA-C device is an NFC dynamic tag integrated circuit providing the upcoming Matter commissioning flow over NFC, and cryptographic services.
The ST25DA-C offers a solution for commissioning a new device on a Matter network without requiring external power. On the NFC interface, it offers NFC Forum T4A Tag and Matter NFC Transport Layer applications. It implements secure storage, cryptographic primitives, and protocols to handle Matter Passcode-Authenticated Session Establishment (PASE) based on SPAKE2+ protocol, authentication of Matter device conformance with Matter device attestation, Node Operational Certificate (NOC), offline configuration of the operational network (Thread), and online signature service required for Certificate-Authenticated Session Establishment (CASE).
Based on a Common Criteria (CC) certified secure hardware, the device is designed to be the NFC component of a smart IoT device, acting as an NFC secure companion to the main microcontroller.
It exposes an NFC Forum Type 4 interface to communicate with a smartphone, and a high-speed (400 kHz) I²C interface to communicate with the main microcontroller.
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All features
- Contact interface
- 1.62 V to 3.3 V supply voltage range
- ESD protection:
- Human body model (HBM): 6 kV for digital and antenna pads
- Charge device model (CDM): 1 kV based on a STMicroelectronics module
- Two-wire I²C serial interface supporting fast mode (up to 400 kHz)
- Contactless interface
- Power supplied by 13.56 MHz carrier
- Complies with ISO/IEC 14443 Type A
- Complies with NFC Forum Type 4 Tag
- 78 pF tuning capacitor, with automatic antenna tuning for optimized performance
- Automatic CPU frequency adaptation for optimum power consumption
- 7-byte unique identifier (UID) on each die
- Security features
- Secure MCU
- Active shield
- Monitoring of environmental parameters
- Protection mechanism against faults
- Protection against side-channel attacks
- Unique serial number on each die
- NIST 800-90B compliant true random-number generator (TRNG)
- Elliptic curve digital signature algorithm (ECDSA) with SHA-256 for digital signature generation and verification
- Elliptic curve Diffie-Hellman (ECDH) for key establishment
- Symmetric cryptography with AES-CCM for data confidentiality and integrity
- Symmetric cryptography with AES-CTR for data privacy
- Matter services
- Stores Matter onboarding data in NFC Forum Type 4 tag
- Performs commissioning over NFC Transport Layer (NTL):
- Powered either by VCC pin or 13.56 MHz contactless carrier
- SPAKE2+
- Secure storage for certificates and keys needed for Matter commissioning
- Provides Matter signature generation and verification over I²C
- Memory
- More than 3 KB of non-volatile memory is allocated for Matter certificates, keys, and attributes.
- Operating temperature
- From -25°C to +85°C
- Package
- 8 pins UFDFPN8 (2 x 3 mm)
- All packages are ECOPACK2 compliant.
- Contact interface
EDA Symbols, Footprints and 3D Models
The STMicroelectronics team - ST25DA-C
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
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Symbols
Footprints
3D models
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Longevity Commitment | Longevity Starting Date | Material Declaration** |
|---|---|---|---|---|---|---|---|
| ST25DA-C | Evaluation | UFDFPN 8 2x3x0.6 | Industrial | N/A | - | - | |
| ST25DACGEN1-AC7 | Preview | UFDFPN 8 2x3x0.6 | Industrial | Ecopack2 | - | - | |
| ST25DACGEN1-AL6 | Preview | WLCSP 16L DIE K470 0.330 TH | Industrial | Ecopack2 | - | - | |
| TST25DA-C | Proposal | - | Industrial | - | - | - | |
ST25DA-C
Package:
UFDFPN 8 2x3x0.6Material Declaration**:
ST25DACGEN1-AC7
Package:
UFDFPN 8 2x3x0.6Material Declaration**:
ST25DACGEN1-AL6
Package:
WLCSP 16L DIE K470 0.330 THMaterial Declaration**:
TST25DA-C
Package:
-Material Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
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Sample & Buy
| Part Number | Marketing Status | Budgetary Price (US$)*/Qty | Order from ST | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | Free Samples | ESample Max Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | |||||||||||||||
| ST25DACGEN1-AC7 | | | distributors No availability of distributors reported, please contact our sales office |
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| ST25DACGEN1-AL6 | | | distributors No availability of distributors reported, please contact our sales office |
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| ST25DA-C | | | distributors No availability of distributors reported, please contact our sales office |
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| TST25DA-C | | | distributors No availability of distributors reported, please contact our sales office |
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ST25DACGEN1-AC7 Preview
ST25DACGEN1-AL6 Preview
ST25DA-C Evaluation
TST25DA-C Proposal
(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors