Product overview
Description
The HSP051-4M5 and HSP053-4M5 are a 4-channel ESD array with a rail to rail architecture designed specifically for the protection of high speed differential lines.
The device is packaged in μQFN 1.3 mm x 0.8 mm with a 500 μm pitch.
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All features
- Very compact 500 µm pitch package, for easy PCB layout
- Very-large bandwidth: 11.5 GHz (HSP051-4M5), 18 GHz (HSP053-4M5)
- Very-low capacitance: 0.35 pF (HSP051-4M5 - I/O to GND), 0.25 pF (HSP053-4M5 - I/O to GND)
- Low leakage current: < 1 nA
- High integration
- Suitable for high density boards
- Extended operating junction temperature range : -40 °C to 150 °C
- Exceeds IEC 61400-4-2 level standard:
- ±20 kV (HSP051-4M5, contact discharge)
- ±10 kV (HSP053-4M5, contact discharge)
- ±30 kV (HSP051-4M5, air discharge)
- ±25 kV (HSP053-4M5, air discharge)
EDA Symbols, Footprints and 3D Models
STMicroelectronics - HSP051-4M5
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3D models
All resources
| Resource title | Version | Latest update |
|---|
SPICE models (1)
| Resource title | Version | Latest update | |||
|---|---|---|---|---|---|
| ZIP | 1.0 | 12 Aug 2022 | 12 Aug 2022 |
CAD Symbol & Footprint models (2)
| Resource title | Version | Latest update | |||
|---|---|---|---|---|---|
| ZIP | 1.1 | 18 Jun 2021 | 18 Jun 2021 | ||
| ZIP | 1.1 | 18 Jun 2021 | 18 Jun 2021 |