ST4SIM-200M

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eSIM System on chip for M2M Industrial - eSIM GSMA SGP.02 v3.2 / GP v2.3 / ETSI Rel14 / Javacrd 3.0.4 Classic Edition

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  • The ST4SIM-200M is an STMicroelectronics top-class GSMA embedded SIM (eSIM or eUICC) product designed for all industrial devices.

    It is compliant with the GSM Association (GSMA) remote provisioning specification SGP.02 v3.2.
    The ST4SIM-200M can remotely manage profiles of different MNOs while ensuring the appropriate security level to all eUICC stakeholders (user, MNO, OEM, hardware integrator, service provider, and so on).
    The ST4SIM-200M can include an embedded secure element to store credential and/or independent applications directly managed by the MCU (or by another OEM element).
    The ST4SIM-200M provides a secure and interoperable Java Card environment compliant with Java Card v3.0.4 classic. Moreover, the ST4SIM-200M integrates the most advanced UICC features compliant with GlobalPlatform, ETSI, 3GPP, 3GPP2 specifications.
    The ST4SIM-200M integrates a dynamic memory management with Java Card garbage collection mechanism optimizing the usage of the memory.
    The ST4SIM-200M is based on the ST33G1M2M, an industrial grade hardware solution (JEDEC) supporting severe conditions. This solution is a tamper-resistant secure element certified by Common Criteria EAL5+, with a powerful 32-bit Arm SecurCore SC300 RISC core.

    Key Features

      • Remote SIM provisioning compliant with GSMA M2M and SIMalliance specifications
      • Bootstrap connectivity profile
      • Up to 7 profiles (depending on memory size)
      • Compliant with 2G / 3G / 4G (LTE) / CDMA / NB-IoT / CAT–M networks
      • Network access applications supported: SIM / USIM / ISIM / CSIM
      • Secure element access control (ARF / PKCS#15)
      • OTA capability over SMS, CAT-TP & HTTPS (including DNS)
      • Multi-interfaces able to combine eSIM + eSE
    • Hardware
      • Product available on ST33G1M2M
      • ST33 product based on a 32-bit Arm SecurCore SC300 RISC core
      • Supply voltage: Class A (5 V), Class B (3 V), Class C (1.8 V)
      • Asynchronous serial I/O port ISO/IEC 7816-3 compatible (T=0 protocol)
      • Serial Peripheral Interface (SPI), depending on packages
      • Industrial qualification (JEDEC JESD47)
      • Operating temperature: -40°C to +105°C
      • Common Criteria EAL5+
    • ECOPACK-compliant packages
      • D16 micromodule
      • DFN8 with wettable flanks (MFF2)
      • WLCSP
    • Security
      • Symmetric cryptography DES / 3DES / AES
      • Asymmetric cryptography RSA (up to 2048 bits)
      • HTTPS remote management TLS v1.0, v1.1 and v1.2
      • Elliptic curve cryptography (up to 521 bits) including preloaded curve NIST P-256 and brainpoolP256r1
      • Authentication algorithm: MILENAGE, TUAK, CAVE
    • Software standard compliancy
      • GSMA SGP.02 v3.2
      • SIMalliance interoperable profile v2.1
      • Java Card™ v3.0.4 Classic
      • GlobalPlatform® card specification v2.2, including GP amendments A, B, C, D and E
      • ETSI, 3GPP and 3GPP2 release 12 (for further information, contact your local STMicroelectronics sales office)
      • Power saving features (PSM and eDRX) defined by ETSI release 13
    • Certification
      • GlobalPlatform-certified "Muse eUICC-i2 v1" compliant with GSMA SGP.02 v3.2

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ST4SIM-200M
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DICE Not Applicable NEC - No availability of distributors reported, please contact our sales office

ST4SIM-200M

Marketing Status

Active

Unit Price (US$)

-

Budgetary Price (US$)*/Qty

Package

DICE

Packing Type

Not Applicable

ECCN (EU)

NEC

Country of Origin

-

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

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00 Files selected for download

Technical Documentation

    • Description Version Size Action
      DB4082
      eSIM system-on-chip solution for M2M industrial applications
      2.0
      458.55 KB
      PDF
      DB4082

      eSIM system-on-chip solution for M2M industrial applications

Presentations & Training Material

    • Description Version Size Action
      Overview presentation of ST4SIM product family 1.0
      486.66 KB
      PDF

      Overview presentation of ST4SIM product family

Publications and Collaterals

    • Description Version Size Action
      ST4SIM secure solutions for cellular connectivity 1.0
      364.62 KB
      PDF

      ST4SIM secure solutions for cellular connectivity

    • Description Version Size Action
      Brochure Secure MCUs - Secure Solutions 1.2
      1.11 MB
      PDF
      ST’s solutions for mobile devices 2.0
      2.13 MB
      PDF

      Brochure Secure MCUs - Secure Solutions

      ST’s solutions for mobile devices

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
ST4SIM-200M
Active
DICE Industrial N/A

ST4SIM-200M

Package:

DICE

Material Declaration**:

Marketing Status

Active

Package

DICE

Grade

Industrial

RoHS Compliance Grade

N/A

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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