Teseo III, the latest generation of ST's GNSS ICs, offers reduced power consumption and carrier-phase tracking, allowing higher accuracy for automotive applications.
Compliant with ST's Automotive Grade qualification which includes, in addition to AEC-Q100 (Grade 3 and 2) requirements, a set of production flow methodologies targeting zero defects per million, Teseo III GNSS receiver ICs fulfill the high quality and service level requirements of the automotive market. They are the ideal solution for in-dash navigation, smart antenna, car-to-car, V2X and OEM telematics applications.
Our product offering includes standalone positioning chips (SAL) and configurable system-on-chips (SOCs), supporting multiple global navigation systems such as GPS, BeiDou, Galileo, GLONASS and QZSS. The standalone devices are offered with GNSS firmware embedded, to perform all positioning operations including tracking, acquisition, navigation and data output. The SoCs offer power processing and spare memory to enable customers and partners to easily and efficiently merge their code or specific IPs with ST's GNSS library to create a highly optimized platform.
Both solutions come with different package options and memory size, and are compatible with the TESEO-DRAW sensor fusion firmware for dead-reckoning and assisted navigation.
To configure and evaluate Teseo GNSS ICs
For Teseo GNSS ICs and MEMS sensors
Teseo Draw merges GNSS signals with sensors data