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The H3LIS331DL is a low-power high-performance 3-axis linear accelerometer belonging to the “nano” family, with digital I2C/SPI serial interface standard output.
The device features ultra-low power operational modes that allow advanced power saving and smart sleep-to-wakeup functions.
The H3LIS331DL has dynamically user-selectable full scales of ±100g/±200g/±400g and it is capable of measuring accelerations with output data rates from 0.5 Hz to 1 kHz.
The H3LIS331DL is available in a small thin plastic land grid array package (LGA) and it is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.Key Features
- Wide supply voltage, 2.16 V to 3.6 V
- Low-voltage compatible IOs, 1.8 V
- Ultra-low power consumption down to 10 μA in low-power mode
- ±100g/±200g/±400g dynamically selectable full scales
- I2C/SPI digital output interface
- 16-bit data output
- Sleep-to-wakeup function
- 10000 g high-shock survivability
- ECOPACK®, RoHS and “Green” compliant
Sample & Buy
| Part Number | Package | Packing Type | Marketing Status | Budgetary Price (US$)* | Quantity | ECCN (US) | Country of Origin | Order from Distributors | Order from ST |
|---|---|---|---|---|---|---|---|---|---|
| H3LIS331DLTR | LLGA 16 3x3x1.0 | Tape And Reel |
Active
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5.5 | 1000 | EAR99 | - | Check Availability | Get sample |
| H3LIS331DL | LLGA 16 3x3x1.0 | Tray |
Active
|
5.5 | 1000 | EAR99 | - | Check Availability |
H3LIS331DL
Package
LLGA 16 3x3x1.0Packing Type
TrayUnit Price (US$)
5.5*(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
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Ecosystems
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Picture Part number Manufacturer Description AWS IoT Core AWS AWS IoT Core is a managed cloud platform that lets connected devices easily and securely interact with cloud applications and other devices. AZURE Cloud Microsoft Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks. Watson IoT Platform IBM IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices. Part NumberAWS IoT Core is a managed cloud platform that lets connected devices easily and securely interact with cloud applications and other devices.
Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks.
IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices.
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Picture Part number Manufacturer Description Accel 3 click MikroElektronika Accel 3 click carries the H3LIS331DL a low-power high-performance 3-axis linear accelerometer. The click is designed to run on a 3.3V power supply. It communicates with the target microcontroller over SPI or I2C interface, with additional functionality provided by the INT pin on the mikroBUS™ line. SensiBLE SensiEDGE Ready-to-use BLE System-on-Module packed with sensors, low power ARM® 32-bit Cortex®-M4 CPU and coin battery. Speed up IoT product development today! SensiSUB SensiEDGE Connecting low-power SUB 1GHZ RF transceiver to the Cloud with fully customisable sensors, ARM® 32-bit Cortex®-M4 CPU and coin battery. Part NumberAccel 3 click carries the H3LIS331DL a low-power high-performance 3-axis linear accelerometer. The click is designed to run on a 3.3V power supply. It communicates with the target microcontroller over SPI or I2C interface, with additional functionality provided by the INT pin on the mikroBUS™ line.
Ready-to-use BLE System-on-Module packed with sensors, low power ARM® 32-bit Cortex®-M4 CPU and coin battery. Speed up IoT product development today!
Connecting low-power SUB 1GHZ RF transceiver to the Cloud with fully customisable sensors, ARM® 32-bit Cortex®-M4 CPU and coin battery.
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Embedded Software
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Picture Part number Manufacturer Description 
X-CUBE-MEMS-XT1 ST Sensor and DSP algorithm software expansion for STM32Cube Part NumberSensor and DSP algorithm software expansion for STM32Cube
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Picture Part number Manufacturer Description AndroidHALInput ST Android sensor HAL for MEMS motion and environmental sensors (Input framework) C-Driver-MEMS ST Standard C platform-independent drivers for MEMS motion and environmental sensors LinuxDriverInput ST Linux device drivers for MEMS motion and environmental sensors (Input framework) Part NumberAndroid sensor HAL for MEMS motion and environmental sensors (Input framework)
Standard C platform-independent drivers for MEMS motion and environmental sensors
Linux device drivers for MEMS motion and environmental sensors (Input framework)
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Evaluation Tools
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Picture Part number Manufacturer Description 
STEVAL-MKI153V1 ST H3LIS331DL 3-axis digital accelerometer adapter board for standard DIL 24 socket, compatible with STEVAL-MKI109V2 Part NumberH3LIS331DL 3-axis digital accelerometer adapter board for standard DIL 24 socket, compatible with STEVAL-MKI109V2
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Support and Applications
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Picture Part number Manufacturer Description Hardware and firmware design SIANA Systems Complete hardware and firmware design for all applications SensiEDGE customization services SensiEDGE End-to-end development services: Hardware, Firmware, Software development, Enclosure, Cloud and mobile APPs. Speed up your IoT project with SensiEDGE! SensorTile.box customization services FAE Technology Engineering services on theSensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing. Part NumberComplete hardware and firmware design for all applications
End-to-end development services: Hardware, Firmware, Software development, Enclosure, Cloud and mobile APPs. Speed up your IoT project with SensiEDGE!
Engineering services on theSensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing.
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| Part Number | Marketing Status | Package | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|
| H3LIS331DL |
Active
|
LLGA 16 3x3x1.0 | Ecopack2 | |
| H3LIS331DLTR |
Active
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LLGA 16 3x3x1.0 | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
