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H3LIS331DL
Low power High-g 3-axis accelerometer, SPI/I2C digital output MEMS motion sensor, user-selectable full scales of ±100g/±200g/±400g
Download Datasheet
The H3LIS331DL is a low-power high-performance 3-axis linear accelerometer belonging to the “nano” family, with digital I2C/SPI serial interface standard output.
The device features ultra-low power operational modes that allow advanced power saving and smart sleep-to-wakeup functions.
The H3LIS331DL has dynamically user-selectable full scales of ±100g/±200g/±400g and it is capable of measuring accelerations with output data rates from 0.5 Hz to 1 kHz.
The H3LIS331DL is available in a small thin plastic land grid array package (LGA) and it is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.
Key Features
- Wide supply voltage, 2.16 V to 3.6 V
- Low-voltage compatible IOs, 1.8 V
- Ultra-low power consumption down to 10 μA in low-power mode
- ±100g/±200g/±400g dynamically selectable full scales
- I2C/SPI digital output interface
- 16-bit data output
- Sleep-to-wakeup function
- 10000 g high-shock survivability
- ECOPACK®, RoHS and “Green” compliant
Resources
Technical Documentation
| Description | Version | Size | |
|---|---|---|---|
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DS9012: MEMS motion sensor: low-power high-g 3-axis digital accelerometer | 3.0 | 804.23 KB |
| Description | Version | Size | |
|---|---|---|---|
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TN0018: Surface mounting guidelines for MEMS sensors in an LGA package | 6.0 | 214.31 KB |
| Description | Version | Size | |
|---|---|---|---|
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DT0105: 1-point or 3-point tumble sensor calibration | 1.0 | 148.7 KB |
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DT0053: 6-point tumble sensor calibration | 1.0 | 464.9 KB |
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DT0076: Compensating for accelerometer installation error: zeroing pitch and roll for a reference orientation | 1.0 | 490.58 KB |
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DT0126: Low-power application design with ST's MEMS accelerometers | 1.0 | 184.68 KB |
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DT0106: Residual linear acceleration by gravity subtraction to enable dead-reckoning | 1.0 | 192.08 KB |
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DT0127: ST's MEMS accelerometer sensor testing & self-test | 1.1 | 409.32 KB |
Publications and Collaterals
| Description | Version | Size | |
|---|---|---|---|
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Industrial MEMS motion sensors | 1.0 | 1.36 MB |
| Description | Version | Size | |
|---|---|---|---|
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MEMS and Sensors Smart Motion tracking, IoT and enhanced user experience | 1.0 | 1.91 MB |
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Sensor & motion algorithm software pack for STM32Cube | 1.0 | 544.58 KB |
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Sensors for industrial and multi-segment solutions | 1.0 | 1.77 MB |
| Description | Version | Size | |
|---|---|---|---|
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AUTO - International Journal of THE FIA, March 2013: Size matters. ST’s high-g accelerometer revolutionizes crash safety in Formula One racing | 1.0 | 378.27 KB |
| Description | Version | Size | |
|---|---|---|---|
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Capacitive MEMS accelerometer for condition monitoring | 1.0 | 3.35 MB |
Tools and Software
| Part Number | Manufacturer | Description |
|---|---|---|
| AWS IoT Core | AWS | AWS IoT Core is a managed cloud platform that lets connected devices easily and securely interact with cloud applications and other devices. |
| AZURE Cloud | Microsoft | Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks. |
| Watson IoT Platform | IBM | IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices. |
| Part Number | Manufacturer | Description |
|---|---|---|
| Accel 3 click | MikroElektronika | Accel 3 click carries the H3LIS331DL a low-power high-performance 3-axis linear accelerometer. The click is designed to run on a 3.3V power supply. It communicates with the target microcontroller over SPI or I2C interface, with additional functionality provided by the INT pin on the mikroBUS™ line. |
| SensiBLE | SensiEDGE | Ready-to-use BLE System-on-Module packed with sensors, low power ARM® 32-bit Cortex®-M4 CPU and coin battery. Speed up IoT product development today! |
| SensiSUB | SensiEDGE | Connecting low-power SUB 1GHZ RF transceiver to the Cloud with fully customisable sensors, ARM® 32-bit Cortex®-M4 CPU and coin battery. |
| Part Number | Manufacturer | Description |
|---|---|---|
| X-CUBE-MEMS-XT1 | ST | Sensor and DSP algorithm software expansion for STM32Cube |
| Part Number | Manufacturer | Description |
|---|---|---|
| AndroidHALInput | ST | Android sensor HAL for MEMS motion and environmental sensors (Input framework) |
| C-Driver-MEMS | ST | Standard C platform-independent drivers for MEMS motion and environmental sensors |
| LinuxDriverInput | ST | Linux device drivers for MEMS motion and environmental sensors (Input framework) |
| Part Number | Manufacturer | Description |
|---|---|---|
| STEVAL-MKI153V1 | ST | H3LIS331DL 3-axis digital accelerometer adapter board for standard DIL 24 socket, compatible with STEVAL-MKI109V2 |
| Part Number | Manufacturer | Description |
|---|---|---|
| Hardware and firmware design | SIANA Systems | Complete hardware and firmware design for all applications |
| SensiEDGE customization services | SensiEDGE | End-to-end development services: Hardware, Firmware, Software development, Enclosure, Cloud and mobile APPs. Speed up your IoT project with SensiEDGE! |
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Sample & Buy
| Part Number | Package | Packing Type | Marketing Status | Unit Price (US$) * | Quantity | ECCN (US) | Country of Origin | More info | Order from ST | Order from Distributors |
|---|---|---|---|---|---|---|---|---|---|---|
| H3LIS331DLTR | LLGA 16 3x3x1.0 | Tape And Reel | Active : Product is in volume production | 5.5 | 1000 | EAR99 | - | MORE INFO | Free Sample Add to cart | DISTRIBUTOR AVAILABILITY |
| H3LIS331DL | LLGA 16 3x3x1.0 | Tray | Active : Product is in volume production | 5.5 | 1000 | EAR99 | - | MORE INFO | DISTRIBUTOR AVAILABILITY |
(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
Quality & Reliability
| Part Number | Marketing Status | Package | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|
| H3LIS331DLTR | Active | LLGA 16 3x3x1.0 | Ecopack2 |
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| H3LIS331DL | Active | LLGA 16 3x3x1.0 | Ecopack2 |
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(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
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No availability reported, please contact our Sales office
Active: In Production.
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