Product overview
Description
The LSM6DSO32 is a system-in-package featuring a 3D digital accelerometer and 3D digital gyroscope boosting power performance to 0.55 mA in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer. The LSM6DSO32 supports main OS requirements, offering real, virtual and batch sensors with 9 kbytes for dynamic data batching. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.The LSM6DSO32 has a full-scale acceleration range of ±4/±8/±16±32 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
High robustness to mechanical shock makes the LSM6DSO32 the preferred choice of system designers for the creation and manufacturing of reliable products. The LSM6DSO32 is available in a plastic land grid array (LGA) package.
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All features
- Power consumption: 0.55 mA in combo high-performance mode
- “Always-on" experience with low power consumption for both accelerometer and gyroscope
- Smart FIFO up to 9 kbytes
- ±4/±8/±16/±32 g full scale
- ±125/±250/±500/±1000/±2000 dps full scale
- Analog supply voltage: 1.71 V to 3.6 V
- Independent IO supply (1.62 V)
- Compact footprint: 2.5 mm x 3 mm x 0.83 mm
- SPI / I²C & MIPI I3CSM serial interface with main processor data synchronization
- Advanced pedometer, step detector and step counter
- Significant Motion Detection, Tilt detection
- Standard interrupts: free-fall, wakeup, 6D/4D orientation, click and double-click
- Programmable finite state machine: accelerometer, gyroscope and external sensors
- Embedded temperature sensor
- ECOPACK, RoHS and “Green” compliant
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All tools & software
All resources
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Product Specifications (1)
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| 16 Mar 2020 |
16 Mar 2020
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Application Notes (2)
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Technical Notes & Articles (1)
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18 Jan 2021
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Design Notes & Tips (5)
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Application Notes for related Tools & Software (1)
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| 18 Jun 2019 |
18 Jun 2019
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Presentations (1)
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| 13 Jan 2021 |
13 Jan 2021
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Flyers (3)
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Brochures (4)
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EDA Symbols, Footprints and 3D Models
STMicroelectronics - LSM6DSO32
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
Quality and Reliability
| Part Number | Marketing Status | Package | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|
| LSM6DSO32TR |
Active
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VFLGA2.5X3X.86 14L P.5 L.475X.25 | Ecopack2 |
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LSM6DSO32TR
Package:
VFLGA2.5X3X.86 14L P.5 L.475X.25Material Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Order from Distributors | Order from ST | Marketing Status | ECCN (US) | ECCN (EU) | Packing Type | Package | Temperature (°C) | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | |||||||||||
| LSM6DSO32TR | No availability of distributors reported, please contact our sales office |
Active
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EAR99 | NEC | Tape And Reel | VFLGA2.5X3X.86 14L P.5 L.475X.25 | -40 | 85 | PHILIPPINES | 1.75 / 1k | ||
Marketing Status
ActiveECCN (US)
EAR99Budgetary Price (US$)*/Qty
1.75 / 1k(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
