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High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 2MBytes of Flash memory, 1376 KB SRAM, 260 MHz CPU, L1 cache, graphic accelerations, external memory interfaces, SMPS and large set of peripherals

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Product overview


STM32H7B3xI devices are based on the high-performance Arm® Cortex®-M7 32-bit RISC core operating at up to 280 MHz. The Cortex® -M7 core features a floating point unit (FPU) which supports Arm® double-precision (IEEE 754 compliant) and single-precision data-processing instructions and data types. STM32H7B3xI devices support a full set of DSP instructions and a memory protection unit (MPU) to enhance application security.

STM32H7B3xI devices incorporate high-speed embedded memories with a dual-bank flash memory of 2 Mbytes, around 1.4 Mbyte of RAM (including 192 Kbytes of TCM RAM, 1.18 Mbytes of user SRAM and 4 Kbytes of backup SRAM), as well as an extensive range of enhanced I/Os and peripherals connected to four APB buses, three AHB buses, a 32-bit multi-AHB bus matrix and a multi layer AXI interconnect supporting internal and external memory access.

All the devices offer two ADCs, two DACs (one dual and one single DAC), two ultra-low power comparators, a low-power RTC, 12 general-purpose 16-bit timers, two PWM timers for motor control, three low-power timers, a true random number generator (RNG), and a cryptographic acceleration cell and a HASH processor. The devices support nine digital filters for external sigma delta modulators (DFSDM). They also feature standard and advanced communication interfaces.

  • All features

    • Includes ST state-of-the-art patented technology
    • Core
      • 32-bit Arm® Cortex®-M7 core with double-precision FPU and L1 cache: 16 Kbytes of data and 16 Kbytes of instruction cache allowing to fill one cache line in a single access from the 128-bit embedded flash memory; frequency up to 280 MHz, MPU, 599 DMIPS/ 2.14 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
    • Memories
      • 2 Mbytes of flash memory with read while write support, plus 1 Kbyte of OTP
      • ~1.4 Mbytes of RAM: 192 Kbytes of TCM RAM (inc. 64 Kbytes of ITCM RAM + 128 Kbytes of DTCM RAM for time critical routines), 1.18 Mbytes of user SRAM, and 4 Kbytes of SRAM in Backup domain
      • 2x Octo-SPI memory interfaces with on-the-fly decryption, I/O multiplexing and support for serial PSRAM/NOR, Hyper RAM/flash frame formats, running up to 140 MHz in SRD mode and up to 110 MHz in DTR mode
      • Flexible external memory controller with up to 32-bit data bus:
        • SRAM, PSRAM, NOR flash memory clocked up to 125 MHz in Synchronous mode
        • 8/16-bit NAND flash memory
      • CRC calculation unit
    • Security
      • ROP, PC-ROP, active tamper, secure firmware upgrade support, Secure access mode
    • General-purpose input/outputs
      • Up to 168 I/O ports with interrupt capability
        • Fast I/Os capable of up to 133 MHz
        • Up to 164 5 V-tolerant I/Os
    • Low-power consumption
      • Stop: down to 32 µA with full RAM retention
      • Standby: 2.8 µA (Backup SRAM OFF, RTC/LSE ON, PDR OFF)
      • VBAT: 0.8 µA with RTC and LSE ON
    • Clock management
      • Internal oscillators: 64 MHz HSI, 48 MHz RC, 4 MHz CSI, 32 kHz LSI
      • External oscillators: 4-50 MHz HSE, 32.768 kHz LSE
      • 3× PLLs (1 for the system clock, 2 for kernel clocks) with fractional mode
    • Reset and power management
      • 2 separate power domains, which can be independently clock gated to maximize power efficiency:
        • CPU domain (CD) for Arm® Cortex® core and its peripherals , which can be independently switched in Retention mode
        • mart run domain (SRD) for reset and clock control, power management and some peripherals
      • 1.62 to 3.6 V application supply and I/Os
      • POR, PDR, PVD and BOR
      • Dedicated USB power embedding a 3.3 V internal regulator to supply the internal PHYs
      • Dedicated MMC power supply
      • High power efficiency SMPS step-down converter regulator to directly supply VCORE or an external circuitry
      • Embedded regulator (LDO) with configurable scalable output to supply the digital circuitry
      • Voltage scaling in Run and Stop mode
      • Backup regulator (~0.9 V)
      • Low-power modes: Sleep, Stop and Standby
      • VBAT battery operating mode with charging capability
      • CPU and domain power state monitoring pins
    • Interconnect matrix
    • 5 DMA controllers to unload the CPU
      • 1× high-speed general-purpose master direct memory access controller (MDMA)
      • 2× dual-port DMAs with FIFO and request router capabilities
      • 1× basic DMA with request router capabilities
      • 1x basic DMA dedicated to DFSDM
    • Up to 35 communication peripherals
      • 4× I2C FM+ interfaces (SMBus/PMBus)
      • 5× USART/5x UARTs (ISO7816 interface, LIN, IrDA, modem control) and 1x LPUART
      • 6× SPIs, including 4 with muxed full-duplex I2S audio class accuracy via internal audio PLL or external clock and 1 x SPI/I2S in LP domain (up to 125 MHz)
      • 2x SAIs (serial audio interface)
      • SPDIFRX interface
      • SWPMI single-wire protocol master I/F
      • MDIO Slave interface
      • 2× SD/SDIO/MMC interfaces (up to 133 MHz)
      • 2× CAN controllers: 2 with CAN FD, 1 with time-triggered CAN (TT-CAN)
      • 1× USB OTG interfaces (1HS/FS)
      • HDMI-CEC
      • 8- to 14-bit camera interface up to 80 MHz
      • 8-/16-bit parallel synchronous data input/output slave interface (PSSI)
    • 11 analog peripherals
      • 2× ADCs with 16-bit max. resolution (up to 24 channels, up to 3.6 MSPS)
      • 1× analog and 1x digital temperature sensors
      • 1× 12-bit single-channel DAC (in SRD domain) + 1× 12-bit dual-channel DAC
      • 2× ultra-low-power comparators
      • 2× operational amplifiers (8 MHz bandwidth)
      • 2× digital filters for sigma delta modulator (DFSDM), 1x with 8 channels/8 filters and 1x in SRD domain with 2 channels/1 filter
    • Graphics
      • LCD-TFT controller up to XGA resolution
      • Chrom-ART graphical hardware Accelerator (DMA2D) to reduce CPU load
      • Hardware JPEG Codec
      • Chrom-GRC™ (GFXMMU)
    • Up to 19 timers and 2 watchdogs
      • 2× 32-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input (up to 280 MHz)
      • 2× 16-bit advanced motor control timers (up to 280 MHz)
      • 10× 16-bit general-purpose timers (up to 280 MHz)
      • 3× 16-bit low-power timers (up to 280 MHz)
      • 2× watchdogs (independent and window)
      • 1× SysTick timer
      • RTC with sub-second accuracy and hardware calendar
    • Cryptographic acceleration
      • AES chaining modes: ECB,CBC,CTR,GCM,CCM for 128, 192 or 256
      • HASH (MD5, SHA-1, SHA-2), HMAC
      • 2x OTFDEC AES-128 in CTR mode for Octo-SPI memory encryption/decryption
      • 1x 32-bit, NIST SP 800-90B compliant , true random generator
    • Debug mode
      • SWD & JTAG interfaces
      • 4 Kbytes Embedded Trace Buffer
    • 96-bit unique ID

Circuit Diagram

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