CATEGORIES

SLLIMM compact

Illustration of an integrated circuit (IC) chip

The SLLIMM compact series are intelligent power modules (IPMs) integrating a complete 3-phase inverter stage in a slim dual-in-line package measuring 32.8 × 18.8 × 3.6 mm. Each module combines 600 V short-circuit-rugged IGBTs with plus freewheeling diodes and dedicated high-side and low-side gate drivers, targeting low-to-medium power motor drive applications operating at up to 20 kHz in hard-switching circuitries.

Each module includes a complete set of protection and control features: internal bootstrap diode, undervoltage lockout (UVLO), shutdown input with fault output, and a temperature sensor output for thermal monitoring. A dedicated comparator provides additional fault protection.

Illustration of an integrated circuit (IC) chip

The top-side cooling direct bonded copper (DBC) substrate enables efficient thermal dissipation , while high-side reference outputs and zig-zag signal-side leads simplify bootstrap circuit layout and PCB routing, reducing the effort required for board design.

Applications

The SLLIMM compact series is suited to enhance efficiency in the following low-and medium-power motor drive applications.

Icon of a washing machine
  • Dryer
  • Multi-function food processor and blenders
  • Cordless and corded vacuum cleaners
  • Washing Machines
Icon of a wall-mounted air conditioner with airflow arrows pointing downward.
  • Air conditioner (window/wall/portable)
Icon of a factory building with a tall chimney and multiple windows.
  • AC Motor Drives
  • Servo Motor Drives
  • Fans
  • PMSM / BLDC Motor Control
  • Pumps and Compressors

Benefits

  • Complete 3-phase inverter in a single package: IGBTs, freewheeling diodes, gate drivers, internal bootstrap diodes, protection, and temperature sensing all integrated, reducing external component count and board space.
  • Top-side cooling DBC substrate: efficient thermal dissipation and insulation; supports compact end-product designs.
  • Simplified PCB layout: high-side reference outputs and zig-zag signal leads reduce routing complexity for the bootstrap circuit.
  • Built-in protection features: UVLO, shutdown/fault I/O, temperature sensor output, and fault comparator reduce external protection circuitry.
  • Pin-to-pin compatible with leading industrial IPM footprints: facilitates direct board-level substitution.
  • Optimized conduction and switching energy loss balance: targeted at hard-switching applications up to 20 kHz.