Overview
Product selector
Resources
Tools & Software
Solutions
eDesignSuite
Get Started

The key for the next essential step towards a more energy-efficient world lies in the use of new materials, such as wide bandgap semiconductors (WBG) which allow for increased power efficiency, smaller size, lighter weight, lower system cost or all of these together. STMicroelectronics offers broadest product and technology portfolio of silicon carbide (MOSFETs) and gallium-nitride-based (e-mode HEMT) devices, covering bare die, discretes, and modules belong to the STPOWER family.

  • Silicon carbide (SiC) has an energy bandgap of 3 electronvolt (eV) and a much higher thermal conductivity compared to silicon. SiC-based MOSFETs are best suited for high voltage, high power applications and are operated at higher frequencies with respect to silicon. Also, the device parameters such as for example the on-resistance RDS(on) are more stable as a function of temperature. This translates into tighter design margins, allowing extra performance to be achieved. SiC MOSFETs is ideal for Industrial and Automotive applications such as traction inverters, on-board chargers & fast charging stations, DC-DC converters, SMPS/high-end PFCs, auxiliary power supplies, UPS/Solar/Welding and Industrial drives across 650V, 750V, 1200V and 1700V clusters.
  • Gallium Nitride on silicon substrate (GaN/Si), the other member of the WBG family, has an even higher energy bandgap 3.4 electronvolt (eV) and substantially higher electron mobility than SiC itself. Compared to silicon (Si), the breakdown field is ten times higher and the electron mobility is double. Both the output charge and gate charge are ten times lower than with Si, and the reverse recovery charge is almost zero which is key for high frequency operations especially in bridge topologies. GaN lends itself to be used in a large variety of is the technology of choice in modern resonant topologies allowing designers to attain far higher efficiencies. By virtue of its properties the GaN HeMT (High electron Mobility Transistor) will be widely used in electric vehicles but also in industrial, telecom, and specific consumer applications across both the 100V and the 650V clusters.

STPOWER SiC and GaN power transistors represent the natural evolution from silicon-based products towards the need for better efficiency, reduced equipment form factor therefore compliance with the noble goal of making our environment greener and more “enjoyable”.


New 650 V, 22 mΩ typ (at 150 °C) SiC power MOSFET

ST has extended its portfolio of SiC MOSFETs with the introduction of the 22 mΩ typ (at 150 °C), 650 V SCTW100N65G2AG which increases the electrical efficiency of EVs and hybrid vehicles. When used in the EV/HEV main inverter, it increases the efficiency by up to 3% compared with an equivalent IGBT solution, translating into longer battery life and a lighter power unit. ST’s SiC MOSFETs also feature the industry’s highest junction-temperature rating of 200°C and show a very small variation of the on-state resistance even at high temperatures. This leads to higher system efficiency, which reduces cooling requirements and PCB form factors simplifying thermal management.
The new 650 V SiC MOSFET is currently sampling to lead customers and will soon complete the qualification to AEC-Q101.