STSAFE-S320

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Design Win

Mobile secure element for Android

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Product overview

Description

The STSAFS320WSBCS01 system on chip is a top-class embedded secure element (eSE) able to manage Java® Card applets from different stakeholders (such as the user, original equipment manufacturer (OEM), hardware integrator, or service provider).

The device is compliant with Java® Card 3.0.5 with enhanced mechanisms of memory management, security, and data management.

It also supports the GlobalPlatform® Card Specifications v.2.3 and related amendments: GlobalPlatform ® Amendment C – Contactless Services v1.3 (support of the "Cumulative Delete" and "Get Status" sections) GlobalPlatform ® Amendment D – Secure Channel Protocol SCP03 v1.1.1 GlobalPlatform ® Amendment F – Secure Channel Protocol ‘11’ v1.2.1 GlobalPlatform ® Amendment H – Executable Load file Upgrade v1.1 GlobalPlatform ® Access Control v1.1 GlobalPlatform ® APDU communication over I²C/SPI based on the GlobalPlatform ® “APDU Transport over I2C/SPI” specification v1.0 GlobalPlatform ® SE Configuration v2.0

The STSAFS320WSBCS01 is integrated with Android™ applications “Keymint” and “Weaver”. It can also host STMicroelectronics applications for secure storage.

It provides state-of-the-art security of the provided functionality, resistant to recent EMVCo/JIL Hardware-related Attacks Subgroup (JHAS)-identified vulnerabilities.

Moreover, the STSAFS320WSBCS01 ensures a high level of security and isolation between applications, and Common Criteria EAL5+ certification is ongoing.

  • All features

    • Hardware features
      • Arm® Cortex®-M35P 32-bit RISC core cadenced at 70 MHz
      • Operating temperature range: –30 °C to 85 °C
      • High-stress memory (HSM):
        • Endurance of 200 000 erase/write cycles
        • Configured to enhance specific object endurance: 10 million write cycles for specific data
        • Provides a total of 1 gigabyte of updated data
        • 15 years' data retention
      • Available in a 24-ball wafer-level chip-scale package (WLCSP24)
      • External interfaces:
        • ISO/IEC 7816-3 (ST Reserved test feature)
        • Slave serial peripheral interface (SPI) up to 10 MHz
        • Slave I²C interface up to 1 Mb/s
      • Class C (1.8 V), Class B (3 V) and 3.3 V supply voltage ranges
      • ESD protection greater than 4 kV (HBM)
    • Software features
      • Java® Card 3.0.5 Classic operating system
      • GlobalPlatform® 2.3 support
      • Support for GlobalPlatform® SCP03 and SCP11
      • Support for GlobalPlatform® executable load file (ELF) upgrade
      • Dynamic memory management
      • APDU communication over I²C/SPI based on the GlobalPlatform® “APDU Transport over I2C/SPI” specification
      • Firmware upgrade mechanism

EDA Symbols, Footprints and 3D Models

STMicroelectronics - STSAFE-S320

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Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
STSAFE-S320
Active
WLCSP DIE K460 24 B Industrial N/A

STSAFE-S320

Package:

WLCSP DIE K460 24 B

Material Declaration**:

Marketing Status

Active

Package

WLCSP DIE K460 24 B

Grade

Industrial

RoHS Compliance Grade

N/A

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

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STSAFE-S320 Available at distributors

Distributor availability of STSAFE-S320

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Active
3A991.a.2 NEC Tape and Reel WLCSP DIE K460 24 B - - FRANCE

STSAFE-S320 Active

Package:
WLCSP DIE K460 24 B
ECCN (US):
3A991.a.2
Budgetary Price (US$)*/Qty:
-

Part Number:

STSAFE-S320

ECCN (EU):

NEC

Packing Type:

Tape and Reel

Operating Temperature (°C)

Min:

-

Max:

-

Country of Origin:

FRANCE

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(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors