STHVUP64

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64 channels ±100 V, ±0.2/0.4 A, 3/5-level RTZ, TR switch, high-speed ultrasound pulser with integrated transmit beamformer

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Product overview

Description

The STHVUP64 is monolithic, high-voltage and high-speed pulse generator features 64 independent channels integrating a 64-channel beamformer for pulse generation in multi-channel medical ultrasound applications targeted at low power ultra-portable system.

A pure analog section provides each channel two half-bridges (two high-voltage P-channel and two high-voltage N-channel MOSFETs), a clamping-to-ground circuit and a transmitting/receiving switch structure which guarantees an effective isolation during the transmission phase. Each channel features also integrated high-voltage level translators, noise blocking diodes and an anti-leakage circuit.

Through a dedicated bit, channels can be programmed as a 3-level output or as a 5-level output. In 3-level mode, the two half-bridges are driven in parallel to provide a default peak current of 400 mA. However, it is also possible to program a low-consumption mode to decrease the overall power consumption: in this case, only one half-bridge is used and the output current lowers down to 200 mA. In 5-level mode, the two half-bridges can be driven independently, and each half-bridge has a current capability of 200 mA. The clamp circuit, used to force the XDCR<63:0> output pins down to GND, has a resistance of 45 Ω and a peak current capability of 0.32 A. The 64 independent T/R switches can be used in a multiplexing configuration.

The STHVUP64 also includes some global blocks: thermal protection circuits, undervoltage checks on VDDP3V3, VDDM3V3 and DVDD, a power-on-reset (POR) on DVDD and a global self-biased high-voltage MOSFET gate driver with internal check of the correct value and of the HV supplies.

All functions are managed by a digital core working at a maximum clock frequency of 200 MHz. This block manages the delay profiles used in the beamformer, the waveform generation and the various global settings and grants that all the device operations are performed in the correct sequence.

  • All features

    • 0 to 200 V output signal peak-to-peak
    • Gate drivers self-biased architecture, no filtering capacitors required
    • Pulsed wave (PW) and continuous wave (CW) mode operations:3 or 5-level output waveformHigh Impedance stateProgrammable ±200 mA or ±400 mA source and sink current in 3-level configuration±200 mA source and sink current in 5-level configuration
    • Fully integrated real clamping-to-ground function45 Ω clamp resistance
    • Fully integrated transmitting/receiving switches (TR_SW)45 Ω ON-resistance18 pF ON-capacitance3 pF OFF-capacitance at LVOUT pinCompliant with receiver multiplexing function
    • Auxiliary integrated circuitsNoise blocking diodesThermal protectionUndervoltage protection and bias supply checks
    • Programmable power management to optimize the performances in case of ultra-portable applications
    • Beamforming in transmission modeProgrammable single channel delay for beam steering and beam focusingClock frequency up to 200 MHz5 ns delay resolution From 5 ns to 20 us delay range @ 200 MHz3 us minimum delay table writing time
    • Embedded memory to store transmission patterns32 states for waveform definitionWaveform compression algorithm
    • Easy driving controlControl through standard Quad Serial Peripheral Interface (QSPI) Few input signals to drive several devices Single Interrupt as alert signalSingle Trigger to manage transmitting (TX) and receiving (RX) phases, fully automatic and programmableAnti-glitch on trigger signal during TX phase
    • Checksum control
    • Very low package thermal resistance
    • Latch-up free due to HV SOI technology
    • Just a few passive components needed
    • Small package: BGA 10mm x 10mm with 196 balls and 0.65mm pitch

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STMicroelectronics - STHVUP64

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Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
STHVUP64
Preview
FCBGA196 10x10x1.4 0.65P 0.35B Industrial Ecopack2

STHVUP64

Package:

FCBGA196 10x10x1.4 0.65P 0.35B

Material Declaration**:

Marketing Status

Preview

Package

FCBGA196 10x10x1.4 0.65P 0.35B

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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STHVUP64 Available at distributors

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EAR99 NEC Tray FCBGA196 10x10x1.4 0.65P 0.35B - - SOUTH KOREA

STHVUP64 Preview

Package:
FCBGA196 10x10x1.4 0.65P 0.35B
ECCN (US):
EAR99
Budgetary Price (US$)*/Qty:
-

Part Number:

STHVUP64

ECCN (EU):

NEC

Packing Type:

Tray

Operating Temperature (°C)

Min:

-

Max:

-

Country of Origin:

SOUTH KOREA

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(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors