Space ASIC
Rad-hard and rad-capable technologies
We bring established expertise in radiation-hardened ASICs for the space industry.
Our space technology platforms include libraries, IP, tools, and methods developed by our radiation-hardening experts.
We also offer differentiated radiation-capable technologies, including mixed-signal CMOS, SiGe, power, and integrated passive devices, for selected ASIC and foundry customers.
Our ESCC- and QML-certified facility in Rennes, France, is a key part of our space and hi-rel supply chain. Through our partner network, we support customers across development, prototyping, and production.
This offer is designed for prime contractors, payload and subsystem suppliers, and fabless chip makers looking for foundry services and support for ASSP and standard product development.
Rad-hard technologies
Rad-hard technologies include dedicated rad-hard libraries and hard IP, and may also involve specific tools and hardening methodologies.
Rad-capable technologies
Rad-capable technologies include built-in features that support the design of rad-hard products, as demonstrated by analysis, targeted radiation testing, and flight heritage.
High-volume manufacturing in our proprietary wafer fabs, backed by proven quality and long-term continuity.
Our portfolio
| Technology | Scope | Key features | Status |
|---|---|---|---|
| 28 nm FD-SOI | Digital, analog, RF | Available rad-hard platform and rad-hard IP | Flying LEO, GEO |
| 65 nm | Digital, analog | Available rad-hard platform and rad-hard IPAvailable rad-hard platform and rad-hard IP | QML-V Flying GEO |
| BiCMOS55X | RF, digital | fT=385 GHz – fMAX=500 GHz | Flying LEO |
| BiCMOS9MW | RF, digital | fT=220 GHz – fMAX=280 GHz | Flying LEO |
| HCMOS9A | Digital, analog | | Flying GEO |
| BCD6s SOI | Power ICs | Up to 190 V | Flying GEO |
| Integrated Passive Device | RF filters | | Flying GEO |
| CMOS | Image sensors and readout integrated circuits (ROICs) | Large pixels, IR, front-side illumination (FSI), back-side illumination (BSI), stitchingLarge pixels, IR, front-side illumination (FSI), back-side illumination (BSI), stitching | Flying GEO |
Our portfolio
Digital, analog
Available rad-hard platform and rad-hard IPAvailable rad-hard platform and rad-hard IP
QML-V Flying GEO
Image sensors and readout integrated circuits (ROICs)
Large pixels, IR, front-side illumination (FSI), back-side illumination (BSI), stitchingLarge pixels, IR, front-side illumination (FSI), back-side illumination (BSI), stitching
Flying GEO
ST’s hardening expertise
For more than 45 years, we have built deep expertise in products hardened by design, by process, and with dedicated libraries and hardened macrocells for space, communications, and automotive applications.
Pioneers.
45+
years of experience in hardening
Robust.
1,000+
rad tests on cells and chips
Reliable.
100+ billion
cumulative flying hours without failure
Proprietary tools and methods
Our proprietary tools and methodologies are built on thousands of radiation tests across a wide range of technologies and products. They are fully deployed in our 65 nm and 28 nm FD-SOI rad-hard libraries, helping optimize performance, power dissipation, and die size for specific mission profiles.
Proprietary tools and methods*
- Radiation sensors
- TID-aware aging models
- Multiscale fault injection simulator
- SEU Montecarlo code
- Ultraselective hardening (CPU, SoC)
Rad-hard IP and libraries*
- SERDES, ADC, DAC, PLL
- Arm®: A53, R52 rad-hard macrocells
* deployed for space in 65 nm and 28 nm FD-SOI
Space packaging and qualification
ST offers a complete supply chain through its ASIC production and Foundry+ services.
Produced in Europe
All traditional space products are assembled at our ESCC- and QML-certified facility in Rennes, France. For new space requirements, assembly in standard plastic packages is carried out at facilities in Europe and Asia.
Advanced packaging for space ICs
Our Rennes facility supports both flip-chip and wire bonding assembly.
The recently updated flip-chip line is compatible with ceramic and organic substrates for traditional and new space applications. It also includes top-side cooling package options for improved thermal management and supports low to medium production volumes.
We have also upgraded our wire bonding line for hermetic ceramic packages to increase capacity and support higher-density ASICs, up to CQFP352 and CLGA625.
Quality assurance
With decades of experience in space products and technologies, we have built deep expertise in space quality assurance.
This is reflected in our triple ESCC, QML, and JAN certification.
This expertise helps us extend our certified capability domains to the technologies and packages needed for advanced space ASICs and ASSPs.
Space ASIC and Foundry+ customers can benefit from our ESCC and QML capability domains to support formal agency qualification or customized qualification based on specific mission profiles.
Value-added services, working models, and ecosystem
28 nm FD-SOI, 65 nm CMOS, and 130 nm and 55 nm BiCMOS (SiGe) are well suited to new developments. Some design partners have already used these technologies to create rad-hard components for space applications.
We also support other radiation-capable technologies for space ASICs and Foundry+. Most of these technologies are available through our low-cost prototyping and multiproject wafer services, subject to certain restrictions.
We offer flexible engagement models, from pure foundry to full ASIC solutions.
Learn more about our products for space applications.
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