STM32MP157C

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MPU with Arm Dual Cortex-A7 650 MHz, Arm Cortex-M4 real-time coprocessor, 3D GPU, TFT/MIPI DSI displays, FD-CAN, Secure boot and Cryptography

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Product overview

Description

The STM32MP157C/F devices are based on the high-performance dual-core Arm® Cortex®-A7 32-bit RISC core operating at up to 800 MHz. The Cortex-A7 processor includes a 32-Kbyte L1 instruction cache for each CPU, a 32-Kbyte L1 data cache for each CPU and a 256-Kbyte level2 cache. The Cortex-A7 processor is a very energy-efficient application processor designed to provide rich performance in high-end wearables, and other low-power embedded and consumer applications. It provides up to 20% more single thread performance than the Cortex-A5 and provides similar performance than the Cortex-A9. The Cortex-A7 incorporates all features of the high-performance Cortex-A15 and Cortex-A17 processors, including virtualization support in hardware, NEON™, and 128-bit AMBA®4 AXI bus interface.
The STM32MP157C/F devices also embed a Cortex® -M4 32-bit RISC core operating at up to 209 MHz frequency. Cortex-M4 core features a floating point unit (FPU) single precision which supports Arm® single-precision data-processing instructions and data types. The Cortex® -M4 supports a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.
The STM32MP157C/F devices also embed a 3D graphic processing unit (Vivante® - OpenGL® ES 2.0) running at up to 533 MHz, with performances up to 26 Mtriangle/s, 133 Mpixel/s.
The STM32MP157C/F devices provide an external SDRAM interface supporting external memories up to 8-Gbit density (1 Gbyte), 16 or 32-bit LPDDR2/LPDDR3 or DDR3/DDR3L up to 533 MHz.
The STM32MP157C/F devices incorporate high-speed embedded memories with 708 Kbytes of Internal SRAM (including 256 Kbytes of AXI SYSRAM, 3 banks of 128 Kbytes each of AHB SRAM, 64 Kbytes of AHB SRAM in backup domain and 4 Kbytes of SRAM in backup domain), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, a 32-bit multi-AHB bus matrix and a 64-bit multi layer AXI interconnect supporting internal and external memories access.
All the devices offer two ADCs, two DACs, a low-power RTC, 12 general-purpose 16-bit timers, two PWM timers for motor control, five low-power timers, a true random number generator (RNG), and a cryptographic acceleration cell. The devices support six digital filters for external sigma delta modulators (DFSDM). They also feature standard and advanced communication interfaces.
  • All features

    • Includes ST state-of-the-art patented technology
    • Core
      • 32-bit dual-core Arm® Cortex®-A7
        • L1 32-Kbyte I / 32-Kbyte D for each core
        • 256-Kbyte unified level 2 cache
        • Arm® NEON™ and Arm® TrustZone®
      • 32-bit Arm® Cortex®-M4 with FPU/MPU
        • Up to 209 MHz (Up to 703 CoreMark®)
    • Memories
      • External DDR memory up to 1 Gbyte
        • up to LPDDR2/LPDDR3-1066 16/32-bit
        • up to DDR3/DDR3L-1066 16/32-bit
      • 708 Kbytes of internal SRAM: 256 Kbytes of AXI SYSRAM + 384 Kbytes of AHB SRAM + 64 Kbytes of AHB SRAM in Backup domain and 4 Kbytes of SRAM in Backup domain
      • Dual mode Quad-SPI memory interface
      • Flexible external memory controller with up to 16-bit data bus: parallel interface to connect external ICs and SLC NAND memories with up to 8-bit ECC
    • Security/safety
      • Secure boot, TrustZone® peripherals, active tamper
      • Cortex®-M4 resources isolation
    • Reset and power management
      • 1.71 V to 3.6 V I/Os supply (5 V-tolerant I/Os)
      • POR, PDR, PVD and BOR
      • On-chip LDOs (RETRAM, BKPSRAM, DSI 1.2 V, USB 1.8 V, 1.1 V)
      • Backup regulator (~0.9 V)
      • Internal temperature sensors
      • Low-power modes: Sleep, Stop and Standby
      • DDR memory retention in Standby mode
      • Controls for PMIC companion chip
    • Low-power consumption
      • Total current consumption down to 2 µA (Standby mode, no RTC, no LSE, no BKPSRAM, no RETRAM)
    • Clock management
      • Internal oscillators: 64 MHz HSI oscillator, 4 MHz CSI oscillator, 32 kHz LSI oscillator
      • External oscillators: 8-48 MHz HSE oscillator, 32.768 kHz LSE oscillator
      • 6 × PLLs with fractional mode
    • General-purpose input/outputs
      • Up to 176 I/O ports with interrupt capability
        • Up to 8 secure I/Os
        • Up to 6 Wakeup, 3 tampers, 1 active tamper
    • Interconnect matrix
      • 2 bus matrices
        • 64-bit Arm® AMBA® AXI interconnect, up to 266 MHz
        • 32-bit Arm® AMBA® AHB interconnect, up to 209 MHz
    • 3 DMA controllers to unload the CPU
      • 48 physical channels in total
      • 1 × high-speed general-purpose master direct memory access controller (MDMA)
      • 2 × dual-port DMAs with FIFO and request router capabilities for optimal peripheral management
    • Up to 37 communication peripherals
      • 6 × I2C FM+ (1 Mbit/s, SMBus/PMBus)
      • 4 × UART + 4 × USART (12.5 Mbit/s, ISO7816 interface, LIN, IrDA, SPI slave)
      • 6 × SPI (50 Mbit/s, including 3 with full duplex I2S audio class accuracy via internal audio PLL or external clock)
      • 4 × SAI (stereo audio: I2S, PDM, SPDIF Tx)
      • SPDIF Rx with 4 inputs
      • HDMI-CEC interface
      • MDIO Slave interface
      • 3 × SDMMC up to 8-bit (SD / e•MMC™/ SDIO)
      • 2 × CAN controllers supporting CAN FD protocol, out of which one supports time-triggered CAN (TTCAN)
      • 2 × USB 2.0 high-speed Host+ 1 × USB 2.0 full-speed OTG simultaneously
        • or 1 × USB 2.0 high-speed Host+ 1 × USB 2.0 high-speed OTG simultaneously
      • 10/100M or Gigabit Ethernet GMAC
        • IEEE 1588v2 hardware, MII/RMII/GMII/RGMII
      • 8- to 14-bit camera interface up to 140 Mbyte/s
    • 6 analog peripherals
      • 2 × ADCs with 16-bit max. resolution (12 bits up to 4.5 Msps, 14 bits up to 4 Msps, 16 bits up to 3.6 Msps)
      • 1 × temperature sensor
      • 2 × 12-bit D/A converters (1 MHz)
      • 1 × digital filters for sigma delta modulator (DFSDM) with 8 channels/6 filters
      • Internal or external ADC/DAC reference VREF+
    • Graphics
      • 3D GPU: Vivante® - OpenGL® ES 2.0
        • Up to 26 Mtriangle/s, 133 Mpixel/s
      • LCD-TFT controller, up to 24-bit // RGB888
        • up to WXGA (1366 × 768) @60 fps or up to Full HD (1920 × 1080) @30 fps
        • Pixel clock up to 90 MHz
        • Two layers with programmable colour LUT
      • MIPI® DSI 2 data lanes up to 1 Gbps each
    • Up to 29 timers and 3 watchdogs
      • 2 × 32-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input
      • 2 × 16-bit advanced motor control timers
      • 10 × 16-bit general-purpose timers (including 2 basic timers without PWM)
      • 5 × 16-bit low-power timers
      • RTC with sub-second accuracy and hardware calendar
      • 2 × 4 Cortex®-A7 system timers (secure, non-secure, virtual, hypervisor)
      • 1 × SysTick M4 timer
      • 3 × watchdogs (2 × independent and window)
    • Hardware acceleration
      • AES 128, 192, 256, TDES
      • HASH (MD5, SHA-1, SHA224, SHA256), HMAC
      • 2 × true random number generator (3 oscillators each)
      • 2 × CRC calculation unit
    • Debug mode
      • Arm® CoreSight™ trace and debug: SWD and JTAG interfaces
      • 8-Kbyte embedded trace buffer
    • 3072-bit fuses including 96-bit unique ID, up to 1184-bit available for user
    • All packages are ECOPACK2 compliant

Circuit Diagram

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      A proactive offer designed to assist our customers in mitigating risk

      STM32 3rd-party Embedded Software Prevas
      Cyber Security Intelligence

      Description:

      A proactive offer designed to assist our customers in mitigating risk

      Enea Linux

      Active

      Commercial embedded Linux distribution for STM32MPU, with use case driven profiles for real-time, networking, and Carrier Grade Linux.

      STM32 3rd-party Embedded Software ENEA
      Enea Linux

      Description:

      Commercial embedded Linux distribution for STM32MPU, with use case driven profiles for real-time, networking, and Carrier Grade Linux.

      Enea OSE

      Active

      Enea OSE: high-performance RTOS, optimized for multi-processor systems requiring true deterministic real-time behavior and high availability.

      STM32 3rd-party Embedded Software ENEA
      Enea OSE

      Description:

      Enea OSE: high-performance RTOS, optimized for multi-processor systems requiring true deterministic real-time behavior and high availability.

      FreeRTOS Kernel

      Active

      The FreeRTOS kernel is an open source real time operating system and the de-facto standard solution for microcontrollers and small microprocessors

      STM32 3rd-party Embedded Software AWS
      FreeRTOS Kernel

      Description:

      The FreeRTOS kernel is an open source real time operating system and the de-facto standard solution for microcontrollers and small microprocessors

      FullMetalUpdate

      Active

      Witekio's FullMetalUpdate is the first fully integrated solution for OTA update open-source.

      STM32 3rd-party Embedded Software Witekio
      FullMetalUpdate

      Description:

      Witekio's FullMetalUpdate is the first fully integrated solution for OTA update open-source.

      Industrial Linux

      Active

      Industrial Longevity Open-Source Operating Systems

      STM32 3rd-party Embedded Software Prevas
      Industrial Linux

      Description:

      Industrial Longevity Open-Source Operating Systems

      J1939

      Active

      SAE J1939 protocol stack

      STM32 3rd-party Embedded Software emotas
      J1939

      Description:

      SAE J1939 protocol stack

      Prevas Simple Connect

      Active

      A communication infrastructure that provides a secure instant communication between clients and devices connected through the Internet.

      STM32 3rd-party Embedded Software Prevas
      Prevas Simple Connect

      Description:

      A communication infrastructure that provides a secure instant communication between clients and devices connected through the Internet.

      ProvenCore

      Active

      Proven OS kernel to secure IoT endpoints and mobile devices.

      STM32 3rd-party Embedded Software Prove & Run
      ProvenCore

      Description:

      Proven OS kernel to secure IoT endpoints and mobile devices.

      ProvenCore-M

      Active

      High security operating system for STM32 Arm Cortex-M microcontrollers.

      STM32 3rd-party Embedded Software Prove & Run
      ProvenCore-M

      Description:

      High security operating system for STM32 Arm Cortex-M microcontrollers.

      Qt for Device Creation

      Active

      Qt for Device Creation provides the Qt development framework for embedded platforms. It also supports various reference hardware through custom BSPs.

      STM32 3rd-party Embedded Software Qt
      Qt for Device Creation

      Description:

      Qt for Device Creation provides the Qt development framework for embedded platforms. It also supports various reference hardware through custom BSPs.

      STM32CubeMP1

      Active

      STM32CubeMP1 Package for STM32MP1 series (HAL, Low-Layer APIs and CMSIS, OpenAMP for Inter processor communication, and examples running on ST boards)

      STM32Cube MCU & MPU Packages ST
      STM32CubeMP1

      Description:

      STM32CubeMP1 Package for STM32MP1 series (HAL, Low-Layer APIs and CMSIS, OpenAMP for Inter processor communication, and examples running on ST boards)

      STM32MP1Dev

      Active

      STM32MP1 OpenSTLinux Developer Package

      STM32 MPU OpenSTLinux Distribution ST
      STM32MP1Dev

      Description:

      STM32MP1 OpenSTLinux Developer Package

      STM32MP1Distrib

      Active

      STM32MP1 OpenSTLinux Distribution Package

      STM32 MPU OpenSTLinux Distribution ST
      STM32MP1Distrib

      Description:

      STM32MP1 OpenSTLinux Distribution Package

      STM32MP1DroidDev

      Active

      STM32MP1 OpenSTAndroid Developer Package

      STM32 MPU OpenSTDroid Distribution --
      STM32MP1DroidDev

      Description:

      STM32MP1 OpenSTAndroid Developer Package

      STM32MP1DroidDis

      Active

      STM32MP1 Android Distribution Package

      STM32 MPU OpenSTDroid Distribution --
      STM32MP1DroidDis

      Description:

      STM32MP1 Android Distribution Package

      STM32MP1DroidSta

      Active

      STM32MP1 OpenSTAndroid Starter Package

      STM32 MPU OpenSTDroid Distribution --
      STM32MP1DroidSta

      Description:

      STM32MP1 OpenSTAndroid Starter Package

      STM32MP1Starter

      Active

      STM32MP1 OpenSTLinux Starter Package

      STM32 MPU OpenSTLinux Distribution --
      STM32MP1Starter

      Description:

      STM32MP1 OpenSTLinux Starter Package

      Storyboard

      Active

      Embedded GUI Development Software to create optimized GUIs for MCUs and MPUs.

      STM32 3rd-party Embedded Software Crank Software
      Storyboard

      Description:

      Embedded GUI Development Software to create optimized GUIs for MCUs and MPUs.

      Timesys BSP Lifecycle Maintenance

      Active

      Lowers the long-term maintenance costs associated with keeping your product line updated and secure - by up to 60%.

      STM32 3rd-party Embedded Software Timesys
      Timesys BSP Lifecycle Maintenance

      Description:

      Lowers the long-term maintenance costs associated with keeping your product line updated and secure - by up to 60%.

      Timesys Embedded Linux Development Support

      Active

      Unlimited BSP / SDK development support on a per-project basis for developers/teams using either Yocto Project or Timesys Factory build systems.

      STM32 3rd-party Embedded Software Timesys
      Timesys Embedded Linux Development Support

      Description:

      Unlimited BSP / SDK development support on a per-project basis for developers/teams using either Yocto Project or Timesys Factory build systems.

      Timesys Security Vulnerability and Patch Notification

      Active

      Automated, tailored notification that significantly reduces the time and costs associated with maintaining software security.

      STM32 3rd-party Embedded Software Timesys
      Timesys Security Vulnerability and Patch Notification

      Description:

      Automated, tailored notification that significantly reduces the time and costs associated with maintaining software security.

      UNISON Busses

      Active

      UNISON RTOS provides the possibility to work with the core serial busses.

      STM32 3rd-party Embedded Software RoweBots
      UNISON Busses

      Description:

      UNISON RTOS provides the possibility to work with the core serial busses.

      UNISON File System

      Active

      UNISON FATFS and UNISON Power Safe FAT File System

      STM32 3rd-party Embedded Software RoweBots
      UNISON File System

      Description:

      UNISON FATFS and UNISON Power Safe FAT File System

      UNISON Kernel

      Active

      UNISON Real Time Operating System Kernel

      STM32 3rd-party Embedded Software RoweBots
      UNISON Kernel

      Description:

      UNISON Real Time Operating System Kernel

      UNISON TCP/IP IPv6/IPv4 Networking Stack

      Active

      Complete networking server with or without IPv6 and other network components.

      STM32 3rd-party Embedded Software RoweBots
      UNISON TCP/IP IPv6/IPv4 Networking Stack

      Description:

      Complete networking server with or without IPv6 and other network components.

      UNISON USB

      Active

      UNISON USB Embedded Host Server, Embedded Device Server, OTG Server.

      STM32 3rd-party Embedded Software RoweBots
      UNISON USB

      Description:

      UNISON USB Embedded Host Server, Embedded Device Server, OTG Server.

      UNISON Wireless

      Active

      Supports various wireless modules.

      STM32 3rd-party Embedded Software RoweBots
      UNISON Wireless

      Description:

      Supports various wireless modules.

      X-CUBE-STL

      Active

      Functional safety package for STM32 microcontrollers in systems implementing safety functions up to IEC 61508 safety integrity level SIL2/SIL3

      STM32Cube Expansion Packages ST
      X-CUBE-STL

      Description:

      Functional safety package for STM32 microcontrollers in systems implementing safety functions up to IEC 61508 safety integrity level SIL2/SIL3
    • Part number
      Status
      Description
      Type
      Supplier

      STM32MP157A-DK1

      NRND

      Discovery kit with STM32MP157A MPU

      STM32 Discovery Kits ST
      STM32MP157A-DK1

      Description:

      Discovery kit with STM32MP157A MPU

      STM32MP157A-EV1

      NRND

      Evaluation board with STM32MP157A MPU

      STM32 Eval Boards ST
      STM32MP157A-EV1

      Description:

      Evaluation board with STM32MP157A MPU

      STM32MP157C-DK2

      NRND

      Discovery kit with STM32MP157C MPU

      STM32 Discovery Kits ST
      STM32MP157C-DK2

      Description:

      Discovery kit with STM32MP157C MPU

      STM32MP157C-EV1

      NRND

      Evaluation board with STM32MP157C MPU

      STM32 Eval Boards ST
      STM32MP157C-EV1

      Description:

      Evaluation board with STM32MP157C MPU

      STM32MP157D-DK1

      Active

      Discovery kit with STM32MP157D MPU

      STM32 Discovery Kits ST
      STM32MP157D-DK1

      Description:

      Discovery kit with STM32MP157D MPU

      STM32MP157D-EV1

      Active

      Evaluation board with STM32MP157D MPU

      STM32 Eval Boards ST
      STM32MP157D-EV1

      Description:

      Evaluation board with STM32MP157D MPU

      STM32MP157F-DK2

      Active

      Discovery kit with STM32MP157F MPU

      STM32 Discovery Kits ST
      STM32MP157F-DK2

      Description:

      Discovery kit with STM32MP157F MPU

      STM32MP157F-EV1

      Active

      Evaluation board with STM32MP157F MPU

      STM32 Eval Boards ST
      STM32MP157F-EV1

      Description:

      Evaluation board with STM32MP157F MPU
    • Part number
      Status
      Description
      Type
      Supplier

      ARM Lauterbach Front-End debugger

      Active

      TRACE32 can be used as debug front-end for various virtual targets, core simulators, target servers such as GDB.

      STM32 IDEs Lauterbach
      ARM Lauterbach Front-End debugger

      Description:

      TRACE32 can be used as debug front-end for various virtual targets, core simulators, target servers such as GDB.

      ARM Lauterbach Instruction Set Simulator

      Active

      The TRACE32 Instruction Set Simulator is available for nearly all processor architectures supported by TRACE32. An intensive use of this tool requires a TRACE32 Simulator License.

      STM32 IDEs Lauterbach
      ARM Lauterbach Instruction Set Simulator

      Description:

      The TRACE32 Instruction Set Simulator is available for nearly all processor architectures supported by TRACE32. An intensive use of this tool requires a TRACE32 Simulator License.

      ARM Lauterbach PowerView debugger

      Active

      PowerView provides an integrated debug environment and a universal interface for the entire tool family

      STM32 IDEs Lauterbach
      ARM Lauterbach PowerView debugger

      Description:

      PowerView provides an integrated debug environment and a universal interface for the entire tool family

      Arm Keil MDK

      Active

      Complete software development solution for all STM32 devices. Includes C/C++ Compiler, IDE/Debugger, CMSIS, RTOS, middleware

      STM32 IDEs Arm Keil
      Arm Keil MDK

      Description:

      Complete software development solution for all STM32 devices. Includes C/C++ Compiler, IDE/Debugger, CMSIS, RTOS, middleware

      Arm tool: ARM Development Studio

      Active

      Comprehensive embedded toolchain for any Arm-based device: Eclipse-based IDE/debugger, C/C++ Compiler, CMSIS, performance analyzer, graphics debugger.

      STM32 IDEs ARM Development Solutions
      Arm tool: ARM Development Studio

      Description:

      Comprehensive embedded toolchain for any Arm-based device: Eclipse-based IDE/debugger, C/C++ Compiler, CMSIS, performance analyzer, graphics debugger.

      Candera CGI Studio

      Active

      Candera CGI Studio enables the creation of brilliant 2D/3D GUI solutions without the need for coding or having community/professional support

      Candera
      Candera CGI Studio

      Description:

      Candera CGI Studio enables the creation of brilliant 2D/3D GUI solutions without the need for coding or having community/professional support

      IAR C-RUN for Arm

      Active

      Run-time analysis tool; add-on product to IAR Embedded Workbench for Arm

      STM32 Performance and Debuggers IAR Systems
      IAR C-RUN for Arm

      Description:

      Run-time analysis tool; add-on product to IAR Embedded Workbench for Arm

      IAR C-STAT

      Active

      Static analysis tool; add-on product to IAR Embedded Workbench

      STM32 Utilities IAR Systems
      IAR C-STAT

      Description:

      Static analysis tool; add-on product to IAR Embedded Workbench

      IAR Embedded Workbench for Arm

      Active

      Integrated Development Environment

      STM32 IDEs IAR Systems
      IAR Embedded Workbench for Arm

      Description:

      Integrated Development Environment

      IAR Embedded Workbench for Arm - Functional Safety

      Active

      Integrated Development Environment

      STM32 IDEs IAR Systems
      IAR Embedded Workbench for Arm - Functional Safety

      Description:

      Integrated Development Environment

      IAR Visual State

      Active

      State-machine modelling tool

      STM32 Utilities IAR Systems
      IAR Visual State

      Description:

      State-machine modelling tool

      Qt Development Tools

      Active

      Tools to develop, debug and deploy HMI on embedded platforms.

      STM32 IDEs Qt
      Qt Development Tools

      Description:

      Tools to develop, debug and deploy HMI on embedded platforms.

      Remedy Bootloader Package

      Active

      Remedy Bootloader - Easy Updates and Advanced Protection.

      STM32 Programmers RoweBots
      Remedy Bootloader Package

      Description:

      Remedy Bootloader - Easy Updates and Advanced Protection.

      ST-MCU-FINDER-PC

      Active

      STM32 and STM8 product finder for desktops

      STM32 Utilities ST
      ST-MCU-FINDER-PC

      Description:

      STM32 and STM8 product finder for desktops

      STM32CubeMX

      Active

      STM32Cube initialization code generator

      STM32 Configurators and Code Generators ST
      STM32CubeMX

      Description:

      STM32Cube initialization code generator

      STM32CubeMonitor

      Active

      STM32CubeMonitor-RF installers

      STM32 Performance and Debuggers ST
      STM32CubeMonitor

      Description:

      STM32CubeMonitor-RF installers

      STM32MP157GPUTK

      Active

      STM32MP157 GPU tool kit

      STM32 Utilities ST
      STM32MP157GPUTK

      Description:

      STM32MP157 GPU tool kit

      Storyboard Designer

      Active

      Development Tools to create optimized GUIs.

      STM32 IDEs Crank Software
      Storyboard Designer

      Description:

      Development Tools to create optimized GUIs.

      System Workbench for Linux (SW4Linux)

      Active

      SW4Linux IDE integrated in CubeIDE offers a unique environment based on Eclipse that greatly facilitates the development of asymmetric applications on the STM32MP1 SoC, either bare metal or with FreeRtos on the Cortex-M and Linux on the Cortex-A for asymmetric real-time applications.

      STM32 IDEs AC6
      System Workbench for Linux (SW4Linux)

      Description:

      SW4Linux IDE integrated in CubeIDE offers a unique environment based on Eclipse that greatly facilitates the development of asymmetric applications on the STM32MP1 SoC, either bare metal or with FreeRtos on the Cortex-M and Linux on the Cortex-A for asymmetric real-time applications.

      Timesys TimeStorm IDE

      Active

      Comprehensive Eclipse-based IDE for embedded Linux application and system-level development that runs on Linux or Windows10 environments.

      STM32 IDEs Timesys
      Timesys TimeStorm IDE

      Description:

      Comprehensive Eclipse-based IDE for embedded Linux application and system-level development that runs on Linux or Windows10 environments.

EDA Symbols, Footprints and 3D Models

STMicroelectronics - STM32MP157C

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

Symbols

Symbols

Footprints

Footprints

3D model

3D models

Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
STM32MP157CAA3
Active
LFBGA 448 18x18x1.7 P 0.8 mm Industrial Ecopack2
STM32MP157CAA3T
Active
LFBGA 448 18x18x1.7 P 0.8 mm Industrial Ecopack2
STM32MP157CAB3
Active
LFBGA 354 16x16x1.7 P 0.8 mm Industrial Ecopack2
STM32MP157CAB3T
Active
LFBGA 354 16x16x1.7 P 0.8 mm Industrial Ecopack2
STM32MP157CAC3
Active
TFBGA 361 12x12x1.2 P 0.5 mm Industrial Ecopack2
STM32MP157CAC3T
Active
TFBGA 361 12x12x1.2 P 0.5 mm Industrial Ecopack2
STM32MP157CAD3
Active
TFBGA 257 10x10x1.2 P 0.5 mm Industrial Ecopack2
STM32MP157CAD3T
Active
TFBGA 257 10x10x1.2 P 0.5 mm Industrial Ecopack2

STM32MP157CAA3

Package:

LFBGA 448 18x18x1.7 P 0.8 mm

Material Declaration**:

PDF XML

Marketing Status

Active

Package

LFBGA 448 18x18x1.7 P 0.8 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP157CAA3T

Package:

LFBGA 448 18x18x1.7 P 0.8 mm

Material Declaration**:

Marketing Status

Active

Package

LFBGA 448 18x18x1.7 P 0.8 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP157CAB3

Package:

LFBGA 354 16x16x1.7 P 0.8 mm

Material Declaration**:

Marketing Status

Active

Package

LFBGA 354 16x16x1.7 P 0.8 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP157CAB3T

Package:

LFBGA 354 16x16x1.7 P 0.8 mm

Material Declaration**:

Marketing Status

Active

Package

LFBGA 354 16x16x1.7 P 0.8 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP157CAC3

Package:

TFBGA 361 12x12x1.2 P 0.5 mm

Material Declaration**:

PDF XML

Marketing Status

Active

Package

TFBGA 361 12x12x1.2 P 0.5 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP157CAC3T

Package:

TFBGA 361 12x12x1.2 P 0.5 mm

Material Declaration**:

PDF XML

Marketing Status

Active

Package

TFBGA 361 12x12x1.2 P 0.5 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP157CAD3

Package:

TFBGA 257 10x10x1.2 P 0.5 mm

Material Declaration**:

Marketing Status

Active

Package

TFBGA 257 10x10x1.2 P 0.5 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP157CAD3T

Package:

TFBGA 257 10x10x1.2 P 0.5 mm

Material Declaration**:

Marketing Status

Active

Package

TFBGA 257 10x10x1.2 P 0.5 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

Part Number
Order from Distributors
Order from ST
Marketing Status
ECCN (US)
ECCN (EU)
Packing Type
Package
Temperature (°C) Junction Temperature (°C) (min)
Budgetary Price (US$)*/Qty
More info
min
max
STM32MP157CAC3 Available at 2 distributors

Distributor availability ofSTM32MP157CAC3

Distributor Name
Region Stock Min. Order Third party link
DIGIKEY WORLDWIDE 869 1 Order Now
AVNET AMERICA 126 0 Order Now

Distributor reported inventory date: 2021-07-27

Distributor Name

DIGIKEY

Stock

869

Min.Order

1

Region

WORLDWIDE Order Now

AVNET

Stock

126

Min.Order

0

Region

AMERICA Order Now

Distributor reported inventory date: 2021-07-27

Buy Direct
Active
5A992C 5A002A4 Tray TFBGA 361 12x12x1.2 P 0.5 mm -40 125 -40 10.274 / 10k
MORE INFO

Junction Temperature (°C) (max):

125

Unit Price (US$):

10.274

Country of Origin:

SOUTH KOREA

STM32MP157CAD3 Available at 1 distributors

Distributor availability ofSTM32MP157CAD3

Distributor Name
Region Stock Min. Order Third party link
Farnell Element14 EUROPE 89 1 Order Now

Distributor reported inventory date: 2021-07-27

Distributor Name

Farnell Element14

Stock

89

Min.Order

1

Region

EUROPE Order Now

Distributor reported inventory date: 2021-07-27

Buy Direct
Active
5A992C 5A002A4 Tray TFBGA 257 10x10x1.2 P 0.5 mm -40 125 -40 9.944 / 10k
MORE INFO

Junction Temperature (°C) (max):

125

Unit Price (US$):

9.944

Country of Origin:

SOUTH KOREA

STM32MP157CAC3T No availability of distributors reported, please contact our sales office
Active
5A992C 5A002A4 Tape And Reel TFBGA 361 12x12x1.2 P 0.5 mm -40 125 -40 10.274 / 10k
MORE INFO

Junction Temperature (°C) (max):

125

Unit Price (US$):

10.274

Country of Origin:

SOUTH KOREA

STM32MP157CAA3 Available at 1 distributors

Distributor availability ofSTM32MP157CAA3

Distributor Name
Region Stock Min. Order Third party link
Farnell Element14 EUROPE 200 1 Order Now

Distributor reported inventory date: 2021-07-27

Distributor Name

Farnell Element14

Stock

200

Min.Order

1

Region

EUROPE Order Now

Distributor reported inventory date: 2021-07-27

Buy Direct
Active
5A992C 5A002A4 Tray LFBGA 448 18x18x1.7 P 0.8 mm -40 125 -40 11.242 / 10k
MORE INFO

Junction Temperature (°C) (max):

125

Unit Price (US$):

11.242

Country of Origin:

SOUTH KOREA

STM32MP157CAB3T No availability of distributors reported, please contact our sales office
Active
5A992C 5A002A4 Tape And Reel LFBGA 354 16x16x1.7 P 0.8 mm -40 125 -40 10.362 / 10k
MORE INFO

Junction Temperature (°C) (max):

125

Unit Price (US$):

10.362

Country of Origin:

SOUTH KOREA

STM32MP157CAB3 No availability of distributors reported, please contact our sales office Buy Direct
Active
5A992C 5A002A4 Tray LFBGA 354 16x16x1.7 P 0.8 mm -40 125 -40 10.362 / 10k
MORE INFO

Junction Temperature (°C) (max):

125

Unit Price (US$):

10.362

Country of Origin:

SOUTH KOREA

STM32MP157CAD3T No availability of distributors reported, please contact our sales office
Active
5A992C 5A002A4 Tape And Reel TFBGA 257 10x10x1.2 P 0.5 mm -40 125 -40 9.944 / 10k
MORE INFO

Junction Temperature (°C) (max):

125

Unit Price (US$):

9.944

Country of Origin:

SOUTH KOREA

STM32MP157CAA3T No availability of distributors reported, please contact our sales office
Active
5A992C 5A002A4 Tape And Reel LFBGA 448 18x18x1.7 P 0.8 mm -40 125 -40 11.242 / 10k
MORE INFO

Junction Temperature (°C) (max):

125

Unit Price (US$):

11.242

Country of Origin:

SOUTH KOREA

STM32MP157CAC3

Marketing Status

Active

ECCN (US)

5A992C

Budgetary Price (US$)*/Qty

10.274 / 10k

Distributor availability ofSTM32MP157CAC3

Distributor Name
Region Stock Min. Order Third party link
DIGIKEY WORLDWIDE 869 1 Order Now
AVNET AMERICA 126 0 Order Now

Distributor reported inventory date: 2021-07-27

Distributor Name

DIGIKEY

Stock

869

Min.Order

1

Region

WORLDWIDE Order Now

AVNET

Stock

126

Min.Order

0

Region

AMERICA Order Now

Distributor reported inventory date: 2021-07-27

ECCN (EU)

5A002A4

Packing Type

Tray

Package

TFBGA 361 12x12x1.2 P 0.5 mm

Operating Temperature (°C)

(min)

-40

(max)

125

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Budgetary Price (US$)* / Qty

10.274 / 10k

Country of Origin

SOUTH KOREA

STM32MP157CAD3

Marketing Status

Active

ECCN (US)

5A992C

Budgetary Price (US$)*/Qty

9.944 / 10k

Distributor availability ofSTM32MP157CAD3

Distributor Name
Region Stock Min. Order Third party link
Farnell Element14 EUROPE 89 1 Order Now

Distributor reported inventory date: 2021-07-27

Distributor Name

Farnell Element14

Stock

89

Min.Order

1

Region

EUROPE Order Now

Distributor reported inventory date: 2021-07-27

ECCN (EU)

5A002A4

Packing Type

Tray

Package

TFBGA 257 10x10x1.2 P 0.5 mm

Operating Temperature (°C)

(min)

-40

(max)

125

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Budgetary Price (US$)* / Qty

9.944 / 10k

Country of Origin

SOUTH KOREA

STM32MP157CAC3T

Marketing Status

Active

ECCN (US)

5A992C

Budgetary Price (US$)*/Qty

10.274 / 10k

ECCN (EU)

5A002A4

Packing Type

Tape And Reel

Package

TFBGA 361 12x12x1.2 P 0.5 mm

Operating Temperature (°C)

(min)

-40

(max)

125

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Budgetary Price (US$)* / Qty

10.274 / 10k

Country of Origin

SOUTH KOREA

STM32MP157CAA3

Marketing Status

Active

ECCN (US)

5A992C

Budgetary Price (US$)*/Qty

11.242 / 10k

Distributor availability ofSTM32MP157CAA3

Distributor Name
Region Stock Min. Order Third party link
Farnell Element14 EUROPE 200 1 Order Now

Distributor reported inventory date: 2021-07-27

Distributor Name

Farnell Element14

Stock

200

Min.Order

1

Region

EUROPE Order Now

Distributor reported inventory date: 2021-07-27

ECCN (EU)

5A002A4

Packing Type

Tray

Package

LFBGA 448 18x18x1.7 P 0.8 mm

Operating Temperature (°C)

(min)

-40

(max)

125

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Budgetary Price (US$)* / Qty

11.242 / 10k

Country of Origin

SOUTH KOREA

STM32MP157CAB3T

Marketing Status

Active

ECCN (US)

5A992C

Budgetary Price (US$)*/Qty

10.362 / 10k

ECCN (EU)

5A002A4

Packing Type

Tape And Reel

Package

LFBGA 354 16x16x1.7 P 0.8 mm

Operating Temperature (°C)

(min)

-40

(max)

125

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Budgetary Price (US$)* / Qty

10.362 / 10k

Country of Origin

SOUTH KOREA

STM32MP157CAB3

Marketing Status

Active

ECCN (US)

5A992C

Budgetary Price (US$)*/Qty

10.362 / 10k

ECCN (EU)

5A002A4

Packing Type

Tray

Package

LFBGA 354 16x16x1.7 P 0.8 mm

Operating Temperature (°C)

(min)

-40

(max)

125

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Budgetary Price (US$)* / Qty

10.362 / 10k

Country of Origin

SOUTH KOREA

STM32MP157CAD3T

Marketing Status

Active

ECCN (US)

5A992C

Budgetary Price (US$)*/Qty

9.944 / 10k

ECCN (EU)

5A002A4

Packing Type

Tape And Reel

Package

TFBGA 257 10x10x1.2 P 0.5 mm

Operating Temperature (°C)

(min)

-40

(max)

125

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Budgetary Price (US$)* / Qty

9.944 / 10k

Country of Origin

SOUTH KOREA

STM32MP157CAA3T

Marketing Status

Active

ECCN (US)

5A992C

Budgetary Price (US$)*/Qty

11.242 / 10k

ECCN (EU)

5A002A4

Packing Type

Tape And Reel

Package

LFBGA 448 18x18x1.7 P 0.8 mm

Operating Temperature (°C)

(min)

-40

(max)

125

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Budgetary Price (US$)* / Qty

11.242 / 10k

Country of Origin

SOUTH KOREA

(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors