LSM6DSV320X
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Education Design Win
6-axis IMU (inertial measurement unit) with dual accelerometer up to 320 g and embedded AI for activity tracking and high-impact sensing

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Product overview

Key Benefits

High impact tracking

An innovative new mechanical structure for high and low accelerations.

Context identification

Edge AI computing and sensor fusion inside the sensor for spatial orientation.

Efficiency

Compact package with three fully synchronized sensors and adaptive sensor configuration (ASC).

Description

The LSM6DSV320X is a high-end, low-noise, low-power, small IMU, featuring a 3-axis digital low-g accelerometer at 16 g, a 3-axis digital high-g accelerometer at 320 g, and a 3-axis digital gyroscope, which offers the best IMU sensor with an architecture for processing acceleration and angular rate data on four separate channels (user interface, OIS, EIS, and high-g accelerometer data). This IMU enables a new range of applications targeting emergency calls, fall/drop reconstruction, intense movement tracking, concussion monitoring, and so forth.

The device enables edge AI computing, leveraging a finite state machine (FSM) for configurable motion tracking and a machine learning core (MLC) for context awareness with exportable AI features for personal electronics and IoT applications.

The LSM6DSV320X features adaptive self-configuration (ASC) to optimize power consumption. The sensor can automatically adjust its settings in real time upon detecting a specific motion pattern or signal from the MLC, without intervention from the host processor. The digital circuitry also includes ST’s sensor fusion low-power (SFLP) technology for spatial orientation.

The device embeds a dedicated accelerometer sensor with an independent channel and filtering for high-g acceleration detection that perfectly matches shock requirements for sports, concussion detection, shock detection, and a full range of car crash detection applications.

  • All features

    • Quad-channel architecture for UI, EIS, OIS, and high-g data processing
    • "Smart, always-aware" experience for system power optimization
    • Dual accelerometer channels
      • Low-g channel ±2/±4/±8/±16 g full scale
      • High-g channel ±32/±64/±128/±256/±320 g full scale
    • Gyroscope full scale: ±250/±500/±1000/±2000/±4000 dps
    • SPI / I²C & MIPI I3C® v1.1 serial interface with main processor data synchronization
    • Auxiliary SPI & MIPI I3C® v1.1 for OIS data output for gyroscope and accelerometer
    • Programmable finite state machine for accelerometer (high-g & low-g), gyroscope, and external sensor data processing with high rate @ 960 Hz
    • Machine learning core with exportable features and filters for AI applications
    • Embedded adaptive self-configuration (ASC)
    • Embedded sensor fusion low-power (SFLP) algorithm
    • OIS configurable from the auxiliary or primary interface
    • EIS dedicated channel on primary interface with dedicated filtering
    • Advanced pedometer, step detector, and step counter
    • Significant motion detection, tilt detection
    • Standard interrupts: free-fall, wake-up, 6D/4D orientation, click and double click, high-g wake-up and high-g shock
    • Smart FIFO up to 4.5 KB
    • Embedded temperature sensor
    • Independent I/O supply
      • I²C voltage range: 1.62 V to 3.6 V
      • SPI / MIPI I3C® extended voltage range: 1.08 V to 3.6 V
    • Supply current
      • 6-axis configuration @ 0.67 mA in combo high-performance mode
      • 9-axis configuration @ 0.80 mA in combo high-performance mode
    • Compact footprint: 2.5 mm x 3 mm x 0.83 mm
    • ECOPACK and RoHS compliant

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STMicroelectronics - LSM6DSV320X

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Quality and Reliability

Part Number Marketing Status Package RoHS Compliance Grade Longevity Commitment Longevity Starting Date Material Declaration**
LSM6DSV320XTR
Active
LGA 14L 2.5x3x0.86 mm Ecopack2 - -

LSM6DSV320XTR

Package:

LGA 14L 2.5x3x0.86 mm

Material Declaration**:

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Marketing Status

Active

Package

LGA 14L 2.5x3x0.86 mm

RoHS Compliance Grade

Ecopack2

Longevity Commitment

-

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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