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  • The VD56G3 is a global shutter image sensor optimized for near infrared scenes. The sensor captures up to 98 frames per second in a 1124 x 1364 resolution format. The pixel construction of this device minimises crosstalk.

    Key Features

    • Global shutter technology, ST proprietary single layer
    • 3D stacked sensor 40 nm/65 nm
    • 2.61 µm x 2.61 µm BSI pixel with full DTI (deep trench isolation)
    • High-performance with excellent
      • QE (quantum efficiency)
      • MTF (modulation transfer function) up to near IR
      • Perfect PLS (shutter efficiency)
    • Smallest sensor on market with 1.5 Mpixel resolution
      • Compact die size: 3.6 mm x 4.3 mm
      • 1124 pixels x 1364 pixels
      • Very small pixel array, 2.9 mm x 3.6 mm
      • Optical format ¼ inch
    • Operating junction temperature: -30 °C to 85 °C
    • Dual lane transmitter MIPI CSI-2 (copyright© 2005-2010 MIPI Alliance, Inc. Standard for Camera Serial Interface 2 (CSI-2) version 1.0) version 1.3, 1.5 Gbps per lane
    • Fast mode+ I2C control interface
    • Integrated temperature sensor
    • Up to 98 fps (frames per second) at full resolution and 240 fps with VGA resolution
    • Programmable sequences of 4-frame contexts, including frame parameters
    • Automatic dark calibration
    • Dynamic and map-based defective correction
    • Embedded auto-exposure with 336 zone statistics
    • 8 multiple function IO, dynamically programmable with frame contexts (GPIO, strobe pulse, pulse-width modulation, V sync)
    • Up to 8 illumination control outputs synchronized with sensor integration periods and master/slave external frame start
    • Mirror/flip readout
    • Fully sequenceable with frame contexts
    • Crop
    • Binning (x2 and x4)
    • Sub sampling (x2 and x4)

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STMicroelectronics - VD56G3

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

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Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
VD56G3CC/RW
Preview
GOOD DIE Industrial N/A

VD56G3CC/RW

Package:

GOOD DIE

Material Declaration**:

PDF XML

Marketing Status

Preview

Package

GOOD DIE

Grade

Industrial

RoHS Compliance Grade

N/A

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

Part Number
Order from Distributors
Order from ST
Marketing Status
ECCN (US)
ECCN (EU)
Packing Type
Package
Temperature (°C) Country of Origin
Budgetary Price (US$)*/Qty
min
max
VD56G3CC/RW No availability of distributors reported, please contact our sales office
Preview
EAR99 NEC Tape Mounted GOOD DIE -30 85 FRANCE

VD56G3CC/RW

Marketing Status

Preview

ECCN (US)

EAR99

Budgetary Price (US$)*/Qty

ECCN (EU)

NEC

Packing Type

Tape Mounted

Package

GOOD DIE

Operating Temperature (°C)

(min)

-30

(max)

85

Budgetary Price (US$)* / Qty

Country of Origin

FRANCE

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors