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The LSM6DS3H is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 1.1 mA (up to 1.6 kHz ODR) in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.
The LSM6DS3H supports main OS requirements, offering real, virtual and batch sensors with 4 kbyte FIFO + flexible 4 kbyte (FIFO or programmable) for dynamic data batching.
The LSM6DS3H gyroscope supports both OIS/EIS applications. The device can be connected to the camera module through a dedicated auxiliary SPI (Mode 3) while flexibility for the primary interface is available (I2C/SPI).
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.
The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
The LSM6DS3H has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±245/±500/±1000/±2000 dps.
High robustness to mechanical shock makes the LSM6DS3H the preferred choice of system designers for the creation and manufacturing of reliable products.
The LSM6DS3H is available in a plastic land grid array (LGA) package.Key Features
- Power consumption: 0.85 mA in combo normal mode and 1.1 mA in combo high-performance mode up to 1.6 kHz.
- “Always-on” experience with low power consumption for both accelerometer and gyroscope
- Interface flexibility: selectable SPI (3/4-wire) or I2C with the main processor
- Auxiliary SPI (3-wire) to support OIS applications
- EIS/OIS support
- Accelerometer ODR up to 6.66 kHz
- Gyroscope ODR up to 3.33 kHz
- Smart FIFO
- ±2/±4/±8/±16 g full scale
- ±125/±245/±500/±1000/±2000 dps full scale
- Analog supply voltage: 1.71 V to 3.6 V
- Independent IOs supply (1.62 V)
- Compact footprint, 2.5 mm x 3 mm x 0.83 mm
- SPI/I2C serial interface data synchronization feature
- Embedded temperature sensor
- ECOPACK®, RoHS and “Green” compliant
Sample & Buy
| Part Number | Package | Packing Type | Marketing Status | Budgetary Price (US$)* | Quantity | ECCN (US) | Country of Origin | Order from Distributors | Order from ST |
|---|---|---|---|---|---|---|---|---|---|
| LSM6DS3H | VFLGA 2.5X3X0.86 14L | Tray |
Preview
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- | - | EAR99 | - | No availability of distributors reported, please contact our sales office | |
| LSM6DS3HTR | VFLGA 2.5X3X0.86 14L | Tape And Reel |
Active
|
2.093 | 1000 | EAR99 | - | Check Availability | Buy now |
LSM6DS3H
Package
VFLGA 2.5X3X0.86 14LPacking Type
TrayUnit Price (US$)
*(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
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Ecosystems
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Picture Part number Manufacturer Description AWS IoT Core AWS AWS IoT Core is a managed cloud platform that lets connected devices easily and securely interact with cloud applications and other devices. AZURE Cloud Microsoft Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks. Watson IoT Platform IBM IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices. Part NumberAWS IoT Core is a managed cloud platform that lets connected devices easily and securely interact with cloud applications and other devices.
Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks.
IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices.
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Embedded Software
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Picture Part number Manufacturer Description AndroidHAL-IIO ST Android sensor HAL for MEMS motion and environmental sensors (Industrial I/O framework) LinuxDriverIIO ST Linux device drivers for MEMS motion and environmental sensors (Industrial I/O framework) Part NumberAndroid sensor HAL for MEMS motion and environmental sensors (Industrial I/O framework)
Linux device drivers for MEMS motion and environmental sensors (Industrial I/O framework)
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Evaluation Tools
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Picture Part number Manufacturer Description 
STEVAL-MKI176V1 ST LSM6DS3H adapter board for standard DIL24 socket Part NumberLSM6DS3H adapter board for standard DIL24 socket
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Support and Applications
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Picture Part number Manufacturer Description SensorTile.box customization services FAE Technology Engineering services on theSensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing. Part NumberEngineering services on theSensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing.
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| Part Number | Marketing Status | Package | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|
| LSM6DS3H |
Preview
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VFLGA 2.5X3X0.86 14L | Ecopack2 | |
| LSM6DS3HTR |
Active
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VFLGA 2.5X3X0.86 14L | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
