LSM6DS3H

NRND

iNEMO 6DoF inertial measurement unit (IMU) supporting OIS / EIS application

Download datasheet Order Direct
Overview
Sample & Buy
Solutions
Documentation
CAD Resources
Tools & Software
Quality & Reliability
eDesignSuite
Get Started
Partner products
Sales Briefcase
  • The LSM6DS3H is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 1.1 mA (up to 1.6 kHz ODR) in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.

    The LSM6DS3H supports main OS requirements, offering real, virtual and batch sensors with 4 kbyte FIFO + flexible 4 kbyte (FIFO or programmable) for dynamic data batching.
    The LSM6DS3H gyroscope supports both OIS/EIS applications. The device can be connected to the camera module through a dedicated auxiliary SPI (Mode 3) while flexibility for the primary interface is available (I2C/SPI).
    ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.
    The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
    The LSM6DS3H has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±245/±500/±1000/±2000 dps.
    High robustness to mechanical shock makes the LSM6DS3H the preferred choice of system designers for the creation and manufacturing of reliable products.
    The LSM6DS3H is available in a plastic land grid array (LGA) package.

    Key Features

    • Power consumption: 0.85 mA in combo normal mode and 1.1 mA in combo high-performance mode up to 1.6 kHz.
    • “Always-on” experience with low power consumption for both accelerometer and gyroscope
    • Interface flexibility: selectable SPI (3/4-wire) or I2C with the main processor
    • Auxiliary SPI (3-wire) to support OIS applications
    • EIS/OIS support
    • Accelerometer ODR up to 6.66 kHz
    • Gyroscope ODR up to 3.33 kHz
    • Smart FIFO
    • ±2/±4/±8/±16 g full scale
    • ±125/±245/±500/±1000/±2000 dps full scale
    • Analog supply voltage: 1.71 V to 3.6 V
    • Independent IOs supply (1.62 V)
    • Compact footprint, 2.5 mm x 3 mm x 0.83 mm
    • SPI/I2C serial interface data synchronization feature
    • Embedded temperature sensor
    • ECOPACK®, RoHS and “Green” compliant

Recommended for you

All tools & software

    • Part number
      Status
      Description
      Type
      Supplier

      Unico-GUI

      Active

      MEMS evaluation kit software package for Linux, Mac OSX and Windows

      Sensor Software Development Tools ST
      Unico-GUI

      Description:

      MEMS evaluation kit software package for Linux, Mac OSX and Windows
    • Part number
      Status
      Description
      Type
      Supplier

      AWS IoT Core

      Active

      AWS IoT Core is a managed cloud service that lets connected devices easily and securely interact with cloud applications and other devices

      Cloud AWS

      AZURE Cloud

      Active

      Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks.

      Cloud Microsoft

      Watson IoT Platform

      Active

      IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices.

      Cloud IBM
      AWS IoT Core

      Description:

      AWS IoT Core is a managed cloud service that lets connected devices easily and securely interact with cloud applications and other devices
      AZURE Cloud

      Description:

      Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks.
      Watson IoT Platform

      Description:

      IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices.
    • Part number
      Status
      Description
      Type
      Supplier

      IMU383ZA

      Active

      High-performance inertial platform.

      Components and Modules ACEINNA

      SensiBLE

      Active

      Ready-to-use BLE System-on-Module packed with sensors, low power ARM® 32-bit Cortex®-M4 CPU and coin battery. Speed up IoT product development today!

      Components and Modules SensiEDGE

      SensiSUB

      Active

      Connecting low-power SUB 1GHZ RF transceiver to the Cloud with fully customisable sensors, ARM® 32-bit Cortex®-M4 CPU and coin battery.

      Components and Modules SensiEDGE
      IMU383ZA

      Description:

      High-performance inertial platform.
      SensiBLE

      Description:

      Ready-to-use BLE System-on-Module packed with sensors, low power ARM® 32-bit Cortex®-M4 CPU and coin battery. Speed up IoT product development today!
      SensiSUB

      Description:

      Connecting low-power SUB 1GHZ RF transceiver to the Cloud with fully customisable sensors, ARM® 32-bit Cortex®-M4 CPU and coin battery.
    • Part number
      Status
      Description
      Type
      Supplier

      AndroidHAL-IIO

      Active

      Android sensor HAL for MEMS motion and environmental sensors (Industrial I/O framework)

      Drivers for MEMS ST

      LinuxDriverIIO

      Active

      Linux device drivers for MEMS motion and environmental sensors (Industrial I/O framework)

      Drivers for MEMS ST
      AndroidHAL-IIO

      Description:

      Android sensor HAL for MEMS motion and environmental sensors (Industrial I/O framework)
      LinuxDriverIIO

      Description:

      Linux device drivers for MEMS motion and environmental sensors (Industrial I/O framework)
    • Part number
      Status
      Description
      Type
      Supplier

      STEVAL-MKI109V3

      Active

      Professional MEMS tool: ST MEMS adapters motherboard based on the STM32F401VE and compatible with all ST MEMS adapters

      MEMS Motion Sensor Eval Boards ST

      STEVAL-MKI176V1

      Active

      LSM6DS3H adapter board for standard DIL24 socket

      MEMS Motion Sensor Eval Boards ST
      STEVAL-MKI109V3

      Description:

      Professional MEMS tool: ST MEMS adapters motherboard based on the STM32F401VE and compatible with all ST MEMS adapters
      STEVAL-MKI176V1

      Description:

      LSM6DS3H adapter board for standard DIL24 socket
    • Part number
      Status
      Description
      Type
      Supplier

      SensiEDGE customization services

      Active

      End-to-end development services: Hardware, Firmware, Software development, Enclosure, Cloud and mobile APPs. Speed up your IoT project with SensiEDGE!

      Engineering Services SensiEDGE

      SensorTile.box customization services

      Active

      Engineering services on theSensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing.

      Engineering Services FAE Technology
      SensiEDGE customization services

      Description:

      End-to-end development services: Hardware, Firmware, Software development, Enclosure, Cloud and mobile APPs. Speed up your IoT project with SensiEDGE!
      SensorTile.box customization services

      Description:

      Engineering services on theSensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing.

EDA Symbols, Footprints and 3D Models

STMicroelectronics - LSM6DS3H

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

Symbols

Symbols

Footprints

Footprints

3D model

3D models

Quality and Reliability

Part Number Marketing Status Package RoHS Compliance Grade Material Declaration**
LSM6DS3HTR
NRND
VFLGA 2.5X3X0.86 14L Ecopack2

LSM6DS3HTR

Package:

VFLGA 2.5X3X0.86 14L

Material Declaration**:

PDF XML

Marketing Status

NRND

Package

VFLGA 2.5X3X0.86 14L

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

Part Number
Order from Distributors
Order from ST
Marketing Status
ECCN (US)
ECCN (EU)
Packing Type
Package
Temperature (°C) Country of Origin
Budgetary Price (US$)*/Qty
min
max
LSM6DS3HTR Available at 1 distributors

Distributor availability ofLSM6DS3HTR

Distributor Name
Region Stock Min. Order Third party link
Newark Element14 AMERICA 500 0 Order Now

Distributor reported inventory date: 2020-12-04

Distributor Name

Newark Element14

Stock

500

Min.Order

0

Region

AMERICA Order Now

Distributor reported inventory date: 2020-12-04

NRND
EAR99 NEC Tape And Reel VFLGA 2.5X3X0.86 14L -40 85 THAILAND 2.093 / 1k

LSM6DS3HTR

Marketing Status

NRND

ECCN (US)

EAR99

Budgetary Price (US$)*/Qty

2.093 / 1k

Distributor availability ofLSM6DS3HTR

Distributor Name
Region Stock Min. Order Third party link
Newark Element14 AMERICA 500 0 Order Now

Distributor reported inventory date: 2020-12-04

Distributor Name

Newark Element14

Stock

500

Min.Order

0

Region

AMERICA Order Now

Distributor reported inventory date: 2020-12-04

ECCN (EU)

NEC

Packing Type

Tape And Reel

Package

VFLGA 2.5X3X0.86 14L

Operating Temperature (°C)

(min)

-40

(max)

85

Budgetary Price (US$)* / Qty

2.093 / 1k

Country of Origin

THAILAND

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors