LSM6DS3H

iNEMO 6DoF inertial measurement unit (IMU) supporting OIS / EIS application

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The LSM6DS3H is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 1.1 mA (up to 1.6 kHz ODR) in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.

The LSM6DS3H supports main OS requirements, offering real, virtual and batch sensors with 4 kbyte FIFO + flexible 4 kbyte (FIFO or programmable) for dynamic data batching.

The LSM6DS3H gyroscope supports both OIS/EIS applications. The device can be connected to the camera module through a dedicated auxiliary SPI (Mode 3) while flexibility for the primary interface is available (I²C/SPI).

ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.

The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.

The LSM6DS3H has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±245/±500/±1000/±2000 dps.

High robustness to mechanical shock makes the LSM6DS3H the preferred choice of system designers for the creation and manufacturing of reliable products.

The LSM6DS3H is available in a plastic land grid array (LGA) package.

Key Features

Power consumption: 0.85 mA in combo normal mode and 1.1 mA in combo high-performance mode up to 1.6 kHz.
“Always-on” experience with low power consumption for both accelerometer and gyroscope
Interface flexibility: selectable SPI (3/4-wire) or I²C with the main processor
Auxiliary SPI (3-wire) to support OIS applications
EIS/OIS support
Accelerometer ODR up to 6.66 kHz
Gyroscope ODR up to 3.33 kHz
Smart FIFO
±2/±4/±8/±16 g full scale
±125/±245/±500/±1000/±2000 dps full scale
Analog supply voltage: 1.71 V to 3.6 V
Independent IOs supply (1.62 V)
Compact footprint, 2.5 mm x 3 mm x 0.83 mm
SPI/I²C serial interface data synchronization feature
Embedded temperature sensor
ECOPACK^®, RoHS and “Green” compliant

Resources

Technical Documentation

Product Specifications

	Description	Version	Size
	DS11273: iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope	5.0	1 MB

Application Notes

	Description	Version	Size
	AN4844: LSM6DS3H: always-on 3D accelerometer and 3D gyroscope	4.0	2 MB

Technical Notes & Articles

	Description	Version	Size
	TN0018: Surface mounting guidelines for MEMS sensors in an LGA package	6.0	214 KB

Design Notes & Tips

Description	Version	Size
DT0105: 1-point or 3-point tumble sensor calibration	1.0	148 KB
DT0060: Exploiting the gyroscope to update tilt measure and e-compass	2.0	657 KB
DT0064: Noise analysis and identification in MEMS sensors, Allan, Time, Hadamard, Overlapping, Modified, Total variance	1.0	616 KB
DT0106: Residual linear acceleration by gravity subtraction to enable dead-reckoning	1.0	192 KB

Publications and Collaterals

Brochures

	Description	Version	Size
	MEMS and Sensors Smart Motion tracking, IoT and enhanced user experience	1.0	1 MB
	Sensor & motion algorithm software pack for STM32Cube	1.0	544 KB

White Papers

	Description	Version	Size
	Optical Image Stabilization (OIS) - white paper	1.0	3 MB

Tools and Software

Ecosystems

Cloud

Part Number	Manufacturer	Description
AWS IoT Core	AWS	AWS IoT Core is a managed cloud platform that lets connected devices easily and securely interact with cloud applications and other devices.
AZURE Cloud	Microsoft	Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks.
Watson IoT Platform	IBM	IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices.

Embedded Software

MEMS and Sensors Software

Part Number	Manufacturer	Description
AndroidHAL-IIO	ST	Android sensor HAL for MEMS motion and environmental sensors (Industrial I/O framework)
LinuxDriverIIO	ST	Linux device drivers for MEMS motion and environmental sensors (Industrial I/O framework)

Evaluation Tools

Product Evaluation Tools

Part Number	Manufacturer	Description
STEVAL-MKI176V1	ST	LSM6DS3H adapter board for standard DIL24 socket

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Sample & Buy

Part Number	Package	Packing Type	Marketing Status	Unit Price (US$) *	Quantity	ECCN (US)	Country of Origin	More info	Order from ST	Order from Distributors
LSM6DS3H	VFLGA 2.5X3X0.86 14L	Tray	Preview : Product is in design stage	-	-	EAR99	-	MORE INFO		No availability reported, please contact our Sales office
LSM6DS3HTR	VFLGA 2.5X3X0.86 14L	Tape And Reel	Active : Product is in volume production	2.093	1000	EAR99	-	MORE INFO	Buy Direct Add to cart	DISTRIBUTOR AVAILABILITY

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors

Quality & Reliability

Part Number	Marketing Status	Package	RoHS Compliance Grade	Material Declaration**
LSM6DS3H	Preview	VFLGA 2.5X3X0.86 14L	Ecopack2
LSM6DS3HTR	Active	VFLGA 2.5X3X0.86 14L	Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.