The LSM6DS3H is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 1.1 mA (up to 1.6 kHz ODR) in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.
The LSM6DS3H supports main OS requirements, offering real, virtual and batch sensors with 4 kbyte FIFO + flexible 4 kbyte (FIFO or programmable) for dynamic data batching.
The LSM6DS3H gyroscope supports both OIS/EIS applications. The device can be connected to the camera module through a dedicated auxiliary SPI (Mode 3) while flexibility for the primary interface is available (I2C/SPI).
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.
The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
The LSM6DS3H has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±245/±500/±1000/±2000 dps.
High robustness to mechanical shock makes the LSM6DS3H the preferred choice of system designers for the creation and manufacturing of reliable products.
The LSM6DS3H is available in a plastic land grid array (LGA) package.
|DS11273: iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope||5.0||1 MB|
|AN4844: LSM6DS3H: always-on 3D accelerometer and 3D gyroscope||4.0||2 MB|
|TN0018: Surface mounting guidelines for MEMS sensors in an LGA package||6.0||214 KB|
|DT0105: 1-point or 3-point tumble sensor calibration||1.0||148 KB|
|DT0060: Exploiting the gyroscope to update tilt measure and e-compass||2.0||657 KB|
|DT0064: Noise analysis and identification in MEMS sensors, Allan, Time, Hadamard, Overlapping, Modified, Total variance||1.0||616 KB|
|DT0106: Residual linear acceleration by gravity subtraction to enable dead-reckoning||1.0||192 KB|
|MEMS and Sensors Smart Motion tracking, IoT and enhanced user experience||1.0||1 MB|
|Sensor & motion algorithm software pack for STM32Cube||1.0||544 KB|
|Optical Image Stabilization (OIS) - white paper||1.0||3 MB|
|AWS IoT Core||AWS||AWS IoT Core is a managed cloud platform that lets connected devices easily and securely interact with cloud applications and other devices.|
|AZURE Cloud||Microsoft||Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks.|
|Watson IoT Platform||IBM||IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices.|
|STEVAL-MKI176V1||ST||LSM6DS3H adapter board for standard DIL24 socket|
|Part Number||Package||Packing Type||Marketing Status||Unit Price (US$) *||Quantity||ECCN (US)||Country of Origin||More info||Order from ST||Order from Distributors|
|LSM6DS3H||VFLGA 2.5X3X0.86 14L||Tray||Preview : Product is in design stage||-||-||EAR99||-||MORE INFO||No availability reported, please contact our Sales office|
|LSM6DS3HTR||VFLGA 2.5X3X0.86 14L||Tape And Reel||Active : Product is in volume production||2.093||1000||EAR99||-||MORE INFO||Buy Direct Add to cart||DISTRIBUTOR AVAILABILITY|
|Part Number||Marketing Status||Package||RoHS Compliance Grade||Material Declaration**|
|LSM6DS3H||Preview||VFLGA 2.5X3X0.86 14L||Ecopack2|
|LSM6DS3HTR||Active||VFLGA 2.5X3X0.86 14L||Ecopack2|
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.