-
This device offers high thermal performance during operation of up to 20 ARMS, thanks to a junction temperature of up to 150 °C.
Its D²PAK package allows modern SMD designs as well as compact back to back configuration.
The combination of noise immunity and low gate triggering current allows to design strong and compact control circuits.Key Features
- High junction temperature: Tj = 150 °C
- High noise immunity dV/dt = 400 V/µs up to 150 °C
- Gate triggering current IGT = 10 mA
- Peak off-state voltage VDRM/VRRM = 600 V
- High turn on current rise dI/dt = 100 A/µs
- ECOPACK®2 compliant component
Featured Videos
The STEVAL-DPSTPFC1 3.6 kW bridgeless totem pole boost circuit achieves a digital power factor correction (PFC) with inrush current limiter (ICL). It helps you to design an innovative topology with the latest ST power kit devices: a silicon carbide MOSFET (SCTW35N65G2V), a thyristor SCR (TN3050H-12WY), an isolated FET driver (STGAP2S) and a 32-bit MCU (STM32F334).
All resources
Product Specifications (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 29 Aug 2017 |
29 Aug 2017
|
Application Notes (4)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 13 Sep 2018 |
13 Sep 2018
|
|||
| 03 Apr 2020 |
03 Apr 2020
|
|||
| 15 Jan 2019 |
15 Jan 2019
|
|||
| 03 Jun 2020 |
03 Jun 2020
|
Technical Notes & Articles (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 25 Aug 2020 |
25 Aug 2020
|
Flyers (5 of 6)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 28 Sep 2020 |
28 Sep 2020
|
|||
| 29 Nov 2019 |
29 Nov 2019
|
|||
| 18 Nov 2020 |
18 Nov 2020
|
|||
| 11 Jun 2020 |
11 Jun 2020
|
|||
| 25 May 2018 |
25 May 2018
|
|||
| 02 Nov 2020 |
02 Nov 2020
|
Brochures (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 23 Mar 2020 |
23 Mar 2020
|
EDA Symbols, Footprints and 3D Models
STMicroelectronics - TN2010H-6G
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
All resources
HW Model, CAD Libraries & SVD (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| ZIP | 23 Sep 2019 |
23 Sep 2019
|
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|---|
| TN2010H-6G |
Active
|
D2PAK | Industrial | Ecopack2 | |
| TN2010H-6G-TR |
Active
|
D2PAK | Industrial | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Order from Distributors | Order from ST | Marketing Status | ECCN (US) | ECCN (EU) | Packing Type | Package | Temperature (°C) | Junction Temperature (°C) (max) | Country of Origin | Budgetary Price (US$)*/Qty | More info | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | |||||||||||||
| TN2010H-6G | 2 distributors | Buy Direct |
Active
|
EAR99 | NEC | Tube | D2PAK | - | - | 150 | CHINA | 0.54 / 10 | ||
| TN2010H-6G-TR | 4 distributors | Buy Direct |
Active
|
EAR99 | NEC | Tape And Reel | D2PAK | - | - | 150 | CHINA | 0.54 / 10 | ||
(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors
