MEMS for Automotive & Industrial

Automotive and industrial markets have particularly stringent quality and reliability requirements. For them, ST offers a dedicated supply chain from design and manufacturing up to testing and qualification for the MEMS devices dedicated to those segments.

ST’s broad portfolio of automotive-grade MEMS sensors are qualified according to the AEC-Q100 standard and includes both low-g and high-g digital accelerometers, digital 3-axis gyroscopes, and 6-axis system-in-packages that combine a 3D digital accelerometer and a 3D digital gyroscope. ST’s automotive-grade MEMS offering covers all the key applications, including sensors for non-safety applications, such as navigation and telematics, sensors for passive safety applications such as airbags, and sensors for the most demanding active-safety applications such as electronic stability control (ESC) and other applications related to vehicle dynamics.

The golden flow

Sensors for automotive and industrial applications are subjected to ST’s "golden flow", which implies specific material codification, rigorous monitoring of front-end equipment, dedicated defect-detection control plan and extensive final test versus temperature. This flow includes cold and hot analysis as well as extended quality control and reliability monitoring that ensure pieces meet the required DPPM (defect parts per million) level.

For automotive devices, ST performs a specific electrical wafer sorting (EWS) based on automotive standards and an additional qualification step in compliance with the AEC-Q100 standards. All products are provided with PPAP (production parts approval program) level-3 documentation as additional guarantee of quality.

Suited for harsh environments

In addition, MEMS devices targeting automotive and industrial markets use two types of packages: Leadframe and Ceramic.


Leadframes provide superior thermal conductivity to assure the appropriate heat dissipation properties required by specific applications.

Ceramic packages

Ceramic packages, with their lower Coefficients of Thermal Expansion, ensure high dimensional stability of the package when exposed to high temperatures. This stability minimizes the stresses to the sensing die, which helps improve reliability and performance. These ceramic packages allow exposure to even higher operating temperatures than the ones permitted by the organic FR4 packages.