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The LSM6DS3 is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 1.25 mA (up to 1.6 kHz ODR) in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.
The LSM6DS3 supports main OS requirements, offering real, virtual and batch sensors with 8 kbyte for dynamic data batching.
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.
The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
The LSM6DS3 has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
High robustness to mechanical shock makes the LSM6DS3 the preferred choice of system designers for the creation and manufacturing of reliable products.
The LSM6DS3 is available in a plastic land grid array (LGA) package.Key Features
- Power consumption: 0.9 mA in combo normal mode and 1.25 mA in combo high-performance mode up to 1.6 kHz.
- “Always-on” experience with low power consumption for both accelerometer and gyroscope
- Smart FIFO up to 8 kbyte based on features set
- Compliant with Android K and L
- Hard, soft ironing for external magnetic sensor corrections
- ±2/±4/±8/±16 g full scale
- ±125/±250/±500/±1000/±2000 dps full scale
- Analog supply voltage: 1.71 V to 3.6 V
- Independent IOs supply (1.62 V)
- Compact footprint, 2.5 mm x 3 mm x 0.83 mm
- SPI/I2C serial interface with main processor data synchronization feature
- Embedded temperature sensor
- ECOPACK®, RoHS and “Green” compliant
Featured Videos
This video tutorial shows how to easily configure a silicon-embedded advanced pedometer feature, using ST’s new generation of iNEMO™ Inertial Measurement Units (IMU).
This video on the SensorTile.box Pro Mode shows you how to use this IoT and wearable sensor development kit to create customized wireless applications using an STM32Cube function pack. Use-case on a Human Activity Recognition algorithm included.
Watch this short tutorial on the Expert mode of the SensorTile.box to learn how to use a graphical wizard to build programs without having to write any code.
Ecosystems
Embedded Software
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Picture Part number Manufacturer Description 
X-CUBE-MEMS-XT1 ST Sensor and DSP algorithm software expansion for STM32Cube 
X-CUBE-MEMS1 ST Sensor and motion algorithm software expansion for STM32Cube Part NumberSensor and DSP algorithm software expansion for STM32Cube
Sensor and motion algorithm software expansion for STM32Cube
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Picture Part number Manufacturer Description AndroidHAL-IIO ST Android sensor HAL for MEMS motion and environmental sensors (Industrial I/O framework) AndroidHALInput ST Android sensor HAL for MEMS motion and environmental sensors (Input framework) C-Driver-MEMS ST Standard C platform-independent drivers for MEMS motion and environmental sensors LinuxDriverIIO ST Linux device drivers for MEMS motion and environmental sensors (Industrial I/O framework) LinuxDriverInput ST Linux device drivers for MEMS motion and environmental sensors (Input framework) Part NumberAndroid sensor HAL for MEMS motion and environmental sensors (Industrial I/O framework)
Android sensor HAL for MEMS motion and environmental sensors (Input framework)
Standard C platform-independent drivers for MEMS motion and environmental sensors
Linux device drivers for MEMS motion and environmental sensors (Industrial I/O framework)
Linux device drivers for MEMS motion and environmental sensors (Input framework)
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Evaluation Tools
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Picture Part number Manufacturer Description 
STEVAL-MKI160V1 ST LSM6DS3 adapter board for standard DIL24 socket Part NumberLSM6DS3 adapter board for standard DIL24 socket
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Picture Part number Manufacturer Description 
STEVAL-WESU1 ST Wearable sensor unit reference design for fast time to market Part NumberWearable sensor unit reference design for fast time to market
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Support and Applications
Quality and Reliability
| Part Number | Marketing Status | Package | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|
| LSM6DS3 |
Preview
|
VFLGA 2.5X3X0.86 14L | Ecopack2 |
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| LSM6DS3TR |
Active
|
VFLGA 2.5X3X0.86 14L | Ecopack2 |
|
LSM6DS3
Package:
VFLGA 2.5X3X0.86 14LMaterial Declaration**:
LSM6DS3TR
Package:
VFLGA 2.5X3X0.86 14LMaterial Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Order from Distributors | Order from ST | Marketing Status | ECCN (US) | ECCN (EU) | Packing Type | Package | Temperature (°C) | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | |||||||||||
| LSM6DS3TR | 4 distributors |
Active
|
EAR99 | NEC | Tape And Reel | VFLGA 2.5X3X0.86 14L | -40 | 85 | PHILIPPINES | 1.771 / 1k | ||
| LSM6DS3 | No availability of distributors reported, please contact our sales office |
Preview
|
EAR99 | NEC | Tray | VFLGA 2.5X3X0.86 14L | -40 | 85 | THAILAND | |||
Marketing Status
ActiveECCN (US)
EAR99Budgetary Price (US$)*/Qty
1.771 / 1kMarketing Status
PreviewECCN (US)
EAR99Budgetary Price (US$)*/Qty
(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
