These new architectures are pivotal for enabling future mobility trends like digitalization and electrification, ultimately improving vehicle performance, safety, and user experience.
Explore EE Architecture & Software-defined vehicle applications
Products and solutions
Power management ICs (PMICs) and system basis chips (SBCs)
ST offers a wide range of power management ICs (PMICs) and system basis chips (SBCs) tailored for automotive electronic systems.
To enhance system integration, these PMICs—such as the SPSB081 and SPSB100G—feature advanced power management capabilities, including multiple standby modes to reduce power consumption, programmable local and remote wake-up functions, and built-in LIN and CAN-FD communication interfaces.
Automotive PMICs are designed to minimize component count, save space, and incorporate all key functionalities demanded by the market. They provide comprehensive diagnostics, electrical protection, and redundancy (e.g., STPM801), support high current loads (STPM098C), and offer buck/boost conversion (STPM802A). Additional features include sequencing, monitoring, low-power modes, and flexible voltage options (STPM066S, SPSA068, and L5965) to meet diverse application requirements.
Both PMICs and SBCs include an SPI interface for device control and diagnostics, enabling seamless integration with microcontroller-based software development. Furthermore, these devices are equipped with features that comply with functional safety standards, including Automotive Safety Integrity Level (ASIL) requirements
CAN-FD protocol
The CAN-FD protocol (CAN with flexible data-rate) is an extension of the classical CAN (CAN 2.0) protocol. CAN‑FD is the CAN 2.0 successor. It efficiently supports distributed real-time control with a very high level of security. CAN-FD was developed by Bosch and standardized as ISO 11898-1:2015 (suitable for industrial, automotive, and general embedded communications).
STi²Fuse, smart switches for wire harness protection
STi²Fuse is a new family of intelligent fuses designed to replace standard melting fuses in automotive power distribution systems.
These devices enable savings on components and production costs while extending EV range and reducing the vehicle's carbon footprint. Their monitoring, control, and digital interface capabilities help automotive systems comply with ISO 26262 and related Safety Integrity Levels (SIL).
Stellar 32-bit automotive MCUs
The Stellar platform consists of multiple series of automotive microcontrollers built around a versatile Arm®-based architecture. The Stellar P and Stellar G series are designed to support real-time virtualization of multi-ASIL ECUs while the Stellar E series addresses the needs for electrification.
All series boast an extensive array of I/Os and peripherals, making them suitable for modern car ECU solutions. The Stellar P & G product lines include xMemory, build on ST PCM technology, providing over twice the memory density compared to other eNVM technologies. Stellar with xMemory offers more headroom for current and future application needs.