Product overview
Description
The VD55G1 is an advanced global shutter with 2.16 μm pixel. It has a small die size of 2.7 x 2.2 mm².
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All features
- Compact global shutter technology (40 nm/65 nm)
- High performance 2.16 μm x 2.16 μm BSI deep CDTI pixel
- Smallest global shutter 804x704 pixels with a 5.9 mm2 footprint
- Die size of only 2.7 mm x 2.2 mm; smaller than VGA equivalents
- Small pixel array size of 1.73 mm x 1.73 mm
- Optical format 1/10" with 600x600 crop
- Disruptive streaming modes, with ST in-pixel, enabling features with a single frame only for ultralow latency and power
- Differential mode: ultrafast change tracking, event-like image
- Background removal, without host processing
- Spatial HDR, enabling 90dB+, without frame ghosting or latency
- Autonomous auto wake-up mode, with always-on scene change detection. Host can be fully off, with only VD55G1 consuming
- 1.0 mW at 1 Hz
- 1.5 mW at 5 Hz
- 2.7 mW at 10 Hz
- Very low power consumption
- 800x700 (full IQ, 5 msec exposure)
7 mW at 10 fps 35 mW at 48 fps - 640x480 (full IQ, 5 msec exposure)
6 mW at 10 fps 29 mW at 48 fps - Power consumption scaling with features/framerate and software standby
- 800x700 (full IQ, 5 msec exposure)
- High frame rate: 170 fps at 800x700, 260 fps at VGA and 460 fps at 320x240
- Disruptive I3C interface
- 10x faster control interface, fully backward compatible with I²C
- I3C image output in parallel of CSI-2 (10 fps at 320x240 or 5 fps at 400x400)
- Advanced raw ISP
- Dynamic defective pixel correction
- Smart noise pixel control (3 dB to 9 dB noise reduction)
- Embedded multi auto exposure. Independent auto exposure per context
- Different exposure for each pixel on the same frame (up to 3 exposures per frame)
- Piece wise linear gamma (PWL), one setup per context, 4 points x/y per setup
- Crop, analog, and digital binning (x2 and x4) and subsampling (x2 and x4)
- Mirror/flip readout
- Flexible camera module system
- Programmable sequences of 4-frame contexts, including illumination control
- Up to 4-LED control outputs, synchronized on sensor integration periods with flexible timings and PWM (pulse-width modulation) control
- Master/slave with external frame start
- 1024 bits OTP available for the user/host
- Integrated temperature sensor with ± 2°C accuracy [25°C; 85°C]
- 1.2 Gb/s single lane transmitter MIPI CSI-2, with support down to 400 Mb/s
- Operating junction temperature: -30°C to 85°C
- High optical performance: QE peak >= 90% and MTF 940 nm at 55% Nyquist/2, dynamic range of 65 dB
- Compact global shutter technology (40 nm/65 nm)
EDA Symbols, Footprints and 3D Models
STMicroelectronics - VD55G1
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Symbols
Footprints
3D models
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|---|
| VD55G1CC/RW | Preview | GOOD DIE | Industrial | N/A | |
| VD55G1CC1/RW | Target | GOOD DIE | Industrial | N/A | |
| VD55G1CCB0/RW | Preview | GOOD DIE | Industrial | N/A |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
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| Part Number | Marketing Status | Budgetary Price (US$)*/Qty | Order from ST | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Temperature (°C) | Operating Temperature (°C) (min) | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | |||||||||||||
| VD55G1CCB0/RW | | | distributors No availability of distributors reported, please contact our sales office | GOOD DIE | Tape Mounted | FRANCE | EAR99 | NEC | -30 | 85 | -30 | |||
| VD55G1CC1/RW | | | distributors No availability of distributors reported, please contact our sales office | GOOD DIE | Tape Mounted | FRANCE | - | - | -30 | 85 | -30 | |||
| VD55G1CC/RW | | | distributors No availability of distributors reported, please contact our sales office | GOOD DIE | Tape Mounted | FRANCE | EAR99 | NEC | -30 | 85 | -30 | |||
VD55G1CCB0/RW Preview
Budgetary Price (US$)*/Qty:
-
distributors
No availability of distributors reported, please contact our sales office
Package:
GOOD DIE
Packing Type:
Tape Mounted
RoHS:
-
Country of Origin:
FRANCE
ECCN (US):
EAR99
ECCN (EU):
NEC
VD55G1CC1/RW Target
Budgetary Price (US$)*/Qty:
-
distributors
No availability of distributors reported, please contact our sales office
Package:
GOOD DIE
Packing Type:
Tape Mounted
RoHS:
-
Country of Origin:
FRANCE
ECCN (US):
-
ECCN (EU):
-
VD55G1CC/RW Preview
Budgetary Price (US$)*/Qty:
-
distributors
No availability of distributors reported, please contact our sales office
Package:
GOOD DIE
Packing Type:
Tape Mounted
RoHS:
-
Country of Origin:
FRANCE
ECCN (US):
EAR99
ECCN (EU):
NEC
Don't show this again
(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors