VD55G1

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Design Win

Advanced Global Shutter 2D imaging sensor with 800x700 resolution, in compact size

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Product overview

Description

The VD55G1 is an advanced global shutter with 2.16 μm pixel. It has a small die size of 2.7 x 2.2 mm².

  • All features

    • Compact global shutter technology (40 nm/65 nm)
      • High performance 2.16 μm x 2.16 μm BSI deep CDTI pixel
    • Smallest global shutter 804x704 pixels with a 5.9 mm2 footprint
      • Die size of only 2.7 mm x 2.2 mm; smaller than VGA equivalents
      • Small pixel array size of 1.73 mm x 1.73 mm
      • Optical format 1/10" with 600x600 crop
    • Disruptive streaming modes, with ST in-pixel, enabling features with a single frame only for ultralow latency and power
      • Differential mode: ultrafast change tracking, event-like image
      • Background removal, without host processing
      • Spatial HDR, enabling 90dB+, without frame ghosting or latency
    • Autonomous auto wake-up mode, with always-on scene change detection. Host can be fully off, with only VD55G1 consuming
      • 1.0 mW at 1 Hz
      • 1.5 mW at 5 Hz
      • 2.7 mW at 10 Hz
    • Very low power consumption
      • 800x700 (full IQ, 5 msec exposure) 7 mW at 10 fps 35 mW at 48 fps
      • 640x480 (full IQ, 5 msec exposure) 6 mW at 10 fps 29 mW at 48 fps
      • Power consumption scaling with features/framerate and software standby
    • High frame rate: 170 fps at 800x700, 260 fps at VGA and 460 fps at 320x240
    • Disruptive I3C interface
      • 10x faster control interface, fully backward compatible with I²C
      • I3C image output in parallel of CSI-2 (10 fps at 320x240 or 5 fps at 400x400)
    • Advanced raw ISP
      • Dynamic defective pixel correction
      • Smart noise pixel control (3 dB to 9 dB noise reduction)
      • Embedded multi auto exposure. Independent auto exposure per context
      • Different exposure for each pixel on the same frame (up to 3 exposures per frame)
      • Piece wise linear gamma (PWL), one setup per context, 4 points x/y per setup
      • Crop, analog, and digital binning (x2 and x4) and subsampling (x2 and x4)
      • Mirror/flip readout
    • Flexible camera module system
      • Programmable sequences of 4-frame contexts, including illumination control
      • Up to 4-LED control outputs, synchronized on sensor integration periods with flexible timings and PWM (pulse-width modulation) control
      • Master/slave with external frame start
      • 1024 bits OTP available for the user/host
      • Integrated temperature sensor with ± 2°C accuracy [25°C; 85°C]
      • 1.2 Gb/s single lane transmitter MIPI CSI-2, with support down to 400 Mb/s
    • Operating junction temperature: -30°C to 85°C
    • High optical performance: QE peak >= 90% and MTF 940 nm at 55% Nyquist/2, dynamic range of 65 dB

EDA Symbols, Footprints and 3D Models

STMicroelectronics - VD55G1

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Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
VD55G1CC/RW
Preview
GOOD DIE Industrial N/A
VD55G1CC1/RW
Target
GOOD DIE Industrial N/A
VD55G1CCB0/RW
Preview
GOOD DIE Industrial N/A

VD55G1CC/RW

Package:

GOOD DIE

Material Declaration**:

PDF XML

Marketing Status

Preview

Package

GOOD DIE

Grade

Industrial

RoHS Compliance Grade

N/A

VD55G1CC1/RW

Package:

GOOD DIE

Material Declaration**:

PDF XML

Marketing Status

Target

Package

GOOD DIE

Grade

Industrial

RoHS Compliance Grade

N/A

VD55G1CCB0/RW

Package:

GOOD DIE

Material Declaration**:

PDF XML

Marketing Status

Preview

Package

GOOD DIE

Grade

Industrial

RoHS Compliance Grade

N/A

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

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Part Number
Marketing Status
Budgetary Price (US$)*/Qty
Order from ST
Order from distributors
Package
Packing Type
RoHS
Country of Origin
ECCN (US)
ECCN (EU)
Temperature (°C)
Operating Temperature (°C) (min)
min
max
VD55G1CCB0/RW
Available at distributors

Distributor availability of VD55G1CCB0/RW

Distributor Name
Region Stock Min. Order Third party link

Distributor reported inventory date:

No availability of distributors reported, please contact our sales office
GOOD DIE Tape Mounted FRANCE EAR99 NEC -30 85

-30

VD55G1CC1/RW
Available at distributors

Distributor availability of VD55G1CC1/RW

Distributor Name
Region Stock Min. Order Third party link

Distributor reported inventory date:

No availability of distributors reported, please contact our sales office
GOOD DIE Tape Mounted FRANCE - - -30 85

-30

VD55G1CC/RW
Available at distributors

Distributor availability of VD55G1CC/RW

Distributor Name
Region Stock Min. Order Third party link

Distributor reported inventory date:

No availability of distributors reported, please contact our sales office
GOOD DIE Tape Mounted FRANCE EAR99 NEC -30 85

-30

VD55G1CCB0/RW Preview

Budgetary Price (US$)*/Qty:
-
Package:
GOOD DIE
Packing Type:
Tape Mounted
RoHS:
-
Country of Origin:
FRANCE
ECCN (US):
EAR99
ECCN (EU):
NEC

Part Number:

VD55G1CCB0/RW

Operating Temperature (°C)

Min:

-30

Max:

85

VD55G1CC1/RW Target

Budgetary Price (US$)*/Qty:
-
Package:
GOOD DIE
Packing Type:
Tape Mounted
RoHS:
-
Country of Origin:
FRANCE
ECCN (US):
-
ECCN (EU):
-

Part Number:

VD55G1CC1/RW

Operating Temperature (°C)

Min:

-30

Max:

85

VD55G1CC/RW Preview

Budgetary Price (US$)*/Qty:
-
Package:
GOOD DIE
Packing Type:
Tape Mounted
RoHS:
-
Country of Origin:
FRANCE
ECCN (US):
EAR99
ECCN (EU):
NEC

Part Number:

VD55G1CC/RW

Operating Temperature (°C)

Min:

-30

Max:

85

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(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors