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The LSM6DSOX is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope boosting performance at 0.55 mA in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.
The LSM6DSOX supports main OS requirements, offering real, virtual and batch sensors with 9 kbytes for dynamic data batching. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
The LSM6DSOX has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
The LSM6DSOX fully supports EIS and OIS applications as the module includes a dedicated configurable signal processing path for OIS and auxiliary SPI, configurable for both the gyroscope and accelerometer. The LSM6DSOX OIS can be configured from the Auxiliary SPI and primary interface (SPI / I²C & MIPI I3CSM).
High robustness to mechanical shock makes the LSM6DSOX the preferred choice of system designers for the creation and manufacturing of reliable products. The LSM6DSOX is available in a plastic land grid array (LGA) package.Key Features
- Power consumption: 0.55 mA in combo high-performance mode
- “Always-on" experience with low power consumption for both accelerometer and gyroscope
- Smart FIFO up to 9 kbyte
- Android compliant
- ±2/±4/±8/±16 g full scale
- ±125/±250/±500/±1000/±2000 dps full scale
- Analog supply voltage: 1.71 V to 3.6 V
- Independent IO supply (1.62 V)
- Compact footprint: 2.5 mm x 3 mm x 0.83 mm
- SPI / I²C & MIPI I3CSM serial interface with main processor data synchronization
- Auxiliary SPI for OIS data output for gyroscope and accelerometer
- OIS configurable from Aux SPI, primary interface (SPI / I²C & MIPI I3CSM)
- Advanced pedometer, step detector and step counter
- Significant Motion Detection, Tilt detection
- Standard interrupts: free-fall, wakeup, 6D/4D orientation, click and double-click
- Programmable finite state machine: accelerometer, gyroscope and external sensors
- Machine Learning Core
- S4S data synchronization
- Embedded temperature sensor
- ECOPACK®, RoHS and “Green” compliant
Ecosystems
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Picture Part number Manufacturer Description AWS IoT Core AWS AWS IoT Core is a managed cloud service that lets connected devices easily and securely interact with cloud applications and other devices AZURE Cloud Microsoft Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks. Watson IoT Platform IBM IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices. Part NumberAWS IoT Core is a managed cloud service that lets connected devices easily and securely interact with cloud applications and other devices
Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks.
IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices.
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Picture Part number Manufacturer Description IMU383ZA ACEINNA High-performance inertial platform. SensiBLE SensiEDGE Ready-to-use BLE System-on-Module packed with sensors, low power ARM® 32-bit Cortex®-M4 CPU and coin battery. Speed up IoT product development today! SensiSUB SensiEDGE Connecting low-power SUB 1GHZ RF transceiver to the Cloud with fully customisable sensors, ARM® 32-bit Cortex®-M4 CPU and coin battery. Part NumberHigh-performance inertial platform.
Ready-to-use BLE System-on-Module packed with sensors, low power ARM® 32-bit Cortex®-M4 CPU and coin battery. Speed up IoT product development today!
Connecting low-power SUB 1GHZ RF transceiver to the Cloud with fully customisable sensors, ARM® 32-bit Cortex®-M4 CPU and coin battery.
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Picture Part number Manufacturer Description 
X-NUCLEO-IKS01A3 ST Motion MEMS and environmental sensor expansion board for STM32 Nucleo Part NumberMotion MEMS and environmental sensor expansion board for STM32 Nucleo
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Embedded Software
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Picture Part number Manufacturer Description 
Unicleo-GUI ST GUI for X-CUBE-MEMS1, motion MEMS and environmental sensor software expansion for STM32Cube Part NumberGUI for X-CUBE-MEMS1, motion MEMS and environmental sensor software expansion for STM32Cube
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Picture Part number Manufacturer Description 
FP-AI-SENSING1 ST STM32Cube function pack for ultra-low power IoT node with artificial intelligence (AI) application based on audio and motion sensing 
FP-SNS-STBOX1 ST STM32Cube function pack for the Pro Mode of the SensorTile.box wireless multi sensor development kit 
X-CUBE-ALGOBUILD ST AlgoBuilder firmware template generator expansion for STM32Cube 
X-CUBE-MEMS1 ST Sensor and motion algorithm software expansion for STM32Cube Part NumberSTM32Cube function pack for ultra-low power IoT node with artificial intelligence (AI) application based on audio and motion sensing
STM32Cube function pack for the Pro Mode of the SensorTile.box wireless multi sensor development kit
AlgoBuilder firmware template generator expansion for STM32Cube
Sensor and motion algorithm software expansion for STM32Cube
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Picture Part number Manufacturer Description AlgoBuilder ST Application for the graphical design of algorithms C-Driver-MEMS ST Standard C platform-independent drivers for MEMS motion and environmental sensors FSM-Examples ST Configuration examples for embedded Finite State Machine feature MLC-Examples ST Configuration examples for embedded Machine Learning Core feature Part NumberApplication for the graphical design of algorithms
Standard C platform-independent drivers for MEMS motion and environmental sensors
Configuration examples for embedded Finite State Machine feature
Configuration examples for embedded Machine Learning Core feature
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Picture Part number Manufacturer Description 
STBLESensor ST BLE sensor application for Android and iOS Part NumberBLE sensor application for Android and iOS
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Evaluation Tools
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Picture Part number Manufacturer Description 
NUCLEO-F401RE ST STM32 Nucleo-64 development board with STM32F401RE MCU, supports Arduino and ST morpho connectivity 
NUCLEO-L073RZ ST STM32 Nucleo-64 development board with STM32L073RZ MCU, supports Arduino and ST morpho connectivity 
NUCLEO-L152RE ST STM32 Nucleo-64 development board with STM32L152RE MCU, supports Arduino and ST morpho connectivity 
NUCLEO-L476RG ST STM32 Nucleo-64 development board with STM32L476RG MCU, supports Arduino and ST morpho connectivity 
STEVAL-MKI109V3 ST Professional MEMS tool: ST MEMS adapters motherboard based on the STM32F401VE and compatible with all ST MEMS adapters 
STEVAL-MKI197V1 ST LSM6DSOX adapter board for a standard DIL24 socket STEVAL-MKIT01V2 ST MEMS sensor sample kit 
STEVAL-MKSBOX1V1 ST SensorTile.box wireless multi sensor development kit with user friendly app for IoT and wearable sensor applications Part NumberSTM32 Nucleo-64 development board with STM32F401RE MCU, supports Arduino and ST morpho connectivity
STM32 Nucleo-64 development board with STM32L073RZ MCU, supports Arduino and ST morpho connectivity
STM32 Nucleo-64 development board with STM32L152RE MCU, supports Arduino and ST morpho connectivity
STM32 Nucleo-64 development board with STM32L476RG MCU, supports Arduino and ST morpho connectivity
Professional MEMS tool: ST MEMS adapters motherboard based on the STM32F401VE and compatible with all ST MEMS adapters
LSM6DSOX adapter board for a standard DIL24 socket
MEMS sensor sample kit
SensorTile.box wireless multi sensor development kit with user friendly app for IoT and wearable sensor applications
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Support and Applications
Quality and Reliability
| Part Number | Marketing Status | Package | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|
| LSM6DSOXTR |
Active
|
VFLGA2.5X3X.86 14L P.5 L.475X.25 | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Order from Distributors | Order from ST | Marketing Status | ECCN (US) | ECCN (EU) | Packing Type | Package | Temperature (°C) | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | |||||||||||
| LSM6DSOXTR | 1 distributors |
Active
|
EAR99 | NEC | Tape And Reel | VFLGA2.5X3X.86 14L P.5 L.475X.25 | -40 | 85 | PHILIPPINES | 2.5 / 1k | ||
Marketing Status
ActiveECCN (US)
EAR99Budgetary Price (US$)*/Qty
2.5 / 1k(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
