Product overview
Description
The LSM6DSV16X is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope with a triple core for processing acceleration and angular rate data on 3 separate channels with dedicated configuration, processing and filtering. The LSM6DSV16X boosts performance at 0.65 mA in high-performance mode and enables always-on low-power features for an optimal motion experience for the consumer.The LSM6DSV16X embeds advanced dedicated features and data filtering for OIS, EIS and motion processing like filtering, finite state machine and MLC with an exportable AI feature for IoT applications.
The LSM6DSV16X embeds Qvar (electric charge variation detection) for user interface functions: tap, double-tap, triple-tap, long press, L/R – R/L swipe.
The LSM6DSV16X embeds an analog hub which is able to connect an external analog input and convert it to a digital signal for processing.
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All features
- Triple core for UI, EIS and OIS data processing
- Power consumption: 0.65 mA in combo high-performance mode
- “Always-on" experience with low power consumption for both accelerometer and gyroscope
- Smart FIFO up to 4.5 kbyte
- Android compliant
- ±2/±4/±8/±16 g full scale
- ±125/±250/±500/±1000/±2000/±4000 dps full scale
- Analog supply voltage: 1.71 V to 3.6 V
- Independent IO supply (extended range: 1.08 V to 3.6 V)
- Compact footprint: 2.5 mm x 3 mm x 0.83 mm
- SPI / I²C & MIPI I3C® v1.1 serial interface with main processor data synchronization
- Auxiliary SPI for OIS data output for gyroscope and accelerometer
- OIS configurable from aux SPI, primary interface (SPI / I²C & MIPI I3C® v1.1)
- EIS dedicated channel on primary interface with dedicated filtering
- Advanced pedometer, step detector and step counter
- Significant motion detection, tilt detection
- Standard interrupts: free-fall, wakeup, 6D/4D orientation, click and double-click
- Programmable finite state machine for accelerometer, gyroscope and external sensor data processing with high rate @ 960 Hz
- Machine learning core with exportable features and filters for AI applications
- Embedded Qvar (electrostatic sensor) for user interface functions (tap, double-tap, triple-tap, long press, L/R – R/L swipe)
- Embedded analog hub for ADC and processing analog input data
- S4S data synchronization
- Embedded temperature sensor
- ECOPACK, RoHS and “Green” compliant
Featured Videos
This video tutorial shows how to easily configure a silicon-embedded advanced pedometer feature, using ST’s new generation of iNEMO™ Inertial Measurement Units (IMU).
LSM6DSOX IMU embeds a Machine Learning Core able to run with only 5 uA, to pre-process and classify information coming from its internal gyro and accelerometer plus up to 4 external sensors to save system-level power since the main MCU can be put in sleep mode for significant amount of time.
A bridge between the sensor on the motherboard and your laptop
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All tools & software
All resources
| Resource title | Version | Latest update |
|---|
Product Specifications (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 2.0 | 22 Dec 2021 | 22 Dec 2021 |
Application Notes (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 2.0 | 24 Feb 2022 | 24 Feb 2022 |
Technical Notes & Articles (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 6.4 | 31 Aug 2021 | 31 Aug 2021 |
Design Notes & Tips (5)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 2.0 | 24 Jan 2022 | 24 Jan 2022 | ||
| 3.1 | 16 Mar 2022 | 16 Mar 2022 | ||
| 3.1 | 16 Mar 2022 | 16 Mar 2022 | ||
| 1.0 | 19 Mar 2021 | 19 Mar 2021 | ||
| 1.1 | 21 Jan 2021 | 21 Jan 2021 |
Presentations (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.0 | 13 Jan 2021 | 13 Jan 2021 |
Brochures (4)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 2.0 | 05 Apr 2022 | 05 Apr 2022 | ||
| 2.1 | 06 Aug 2020 | 06 Aug 2020 | ||
| 12.21 | 09 Dec 2021 | 09 Dec 2021 | ||
| 1.0 | 23 Jun 2020 | 23 Jun 2020 |
EDA Symbols, Footprints and 3D Models
STMicroelectronics - LSM6DSV16X
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
Quality and Reliability
| Part Number | Marketing Status | Package | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|
| LSM6DSV16XTR | Evaluation | VFLGA2.5X3X.86 14L P.5 L.475X.25 | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Order from distributors | Order from ST | Marketing Status | ECCN (US) | ECCN (EU) | Packing Type | Package | Temperature (°C) | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | |||||||||||
| LSM6DSV16XTR | No availability of distributors reported, please contact our sales office | Evaluation | EAR99 | NEC | Tape and Reel | VFLGA2.5X3X.86 14L P.5 L.475X.25 | -40 | 85 | PHILIPPINES | | ||
LSM6DSV16XTR Evaluation
Buy Direct at ST (*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors