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STM32WB55VG

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Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0 32MHz with 1 Mbyte of Flash memory, Bluetooth 5, 802.15.4, USB, LCD, AES-256

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  • The STM32WB55xx multiprotocol wireless and ultra-low-power devices embed a powerful and ultra-low-power radio compliant with the Bluetooth® Low Energy SIG specification v5.0 and with IEEE 802.15.4-2011. They contain a dedicated Arm® Cortex® -M0+ for performing all the real-time low layer operation.

    The STM32WB55xx devices are designed to be extremely low-power and are based on the high-performance Arm® Cortex®-M4 32-bit RISC core operating at a frequency of up to 64 MHz. The Cortex®-M4 core features a Floating point unit (FPU) single precision that supports all Arm® single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) that enhances application security.
    Enhanced inter-processor communication is provided by the IPCC with six bidirectional channels. The HSEM provides hardware semaphores used to share common resources between the two processors.
    The STM32WB55xx devices embed high-speed memories (Flash memory up to 1 Mbyte, up to 256 Kbyte of SRAM), a Quad-SPI Flash memory interface (available on all packages) and an extensive range of enhanced I/Os and peripherals.
    Direct data transfer between memory and peripherals and from memory to memory is supported by fourteen DMA channels with a full flexible channel mapping by the DMAMUX peripheral.
    The STM32WB55xx devices embed several mechanisms for embedded Flash memory and SRAM: readout protection, write protection and proprietary code readout protection. Portions of the memory can be secured for Cortex® -M0+ exclusive access.
    The two AES encryption engines, PKA and RNG enable lower layer MAC and upper layer cryptography. A customer key storage feature may be used to keep the keys hidden.
    The devices offer one fast 16-bit ADC and two ultra-low-power comparators associated with a high accuracy reference voltage generator
    The STM32WB55xx devices embed a low-power RTC, one advanced 16-bit timer, one general-purpose 32-bit timer, two general-purpose 16-bit timers, and two 16-bit low-power timers.
    In addition, up to 18 capacitive sensing channels are available. The devices also embed an integrated LCD driver up to 8x40 or 4x44, with internal step-up converter.
    They also feature standard and advanced communication interfaces:
    The STM32WB55xx operate in the -40 to +105 °C (+125 °C junction) temperature range from a 1.71 to 3.6 V power supply. A comprehensive set of power-saving modes enables the design of low-power applications.
    The STM32WB55xx integrate a high efficiency SMPS step-down converter with automatic bypass mode capability when the VDD falls below VBORx (x=1, 2, 3, 4) voltage level (default is 2.0 V). It includes independent power supplies for analog input for ADC and comparators, as well as a 3.3 V dedicated supply input for USB.
    A VBAT dedicated supply allows the devices to back up the LSE 32.768KHz oscillator, the RTC and the backup registers, thus enabling the STM32WB55xx to supply these functions even if the main VDD is not present through a CR2032-like battery, a Supercap or a small rechargeable battery.
    The STM32WB55xx family offers three packages, from 48 to 100 pins.

    主な特徴

    • Includes ST state-of-the-art patented technology
    • Radio
      • 2.4 GHz
      • RF transceiver supporting Bluetooth® 5 specification, IEEE 802.15.4-2011 PHY and MAC, supporting Thread and ZigBee® 3.0
      • RX Sensitivity: -96 dBm (Bluetooth® Low Energy at 1 Mbps), -100 dBm (802.15.4)
      • Programmable output power up to +6 dBm with 1 dB steps
      • Integrated balun to reduce BOM
      • Support for 2 Mbps
      • Dedicated Arm® 32-bit Cortex® M0 + CPU for real-time Radio layer
      • Accurate RSSI to enable power control
      • Suitable for systems requiring compliance with radio frequency regulations ETSI EN 300 328, EN 300 440, FCC CFR47 Part 15 and ARIB STD-T66
      • Support for external PA
    • Ultra-low-power platform
      • 1.71 V to 3.6 V power supply
      • – 40 °C to 85 / 105 °C temperature ranges
      • 13 nA shutdown mode
      • 600 nA Standby mode + RTC + 32 KB RAM
      • 2.1 μA Stop mode + RTC + 256 KB RAM
      • Active-mode MCU: < 53 μA / MHz when RF and SMPS On
      • Radio: Rx 4.5 mA / Tx at 0 dBm 5.2 mA
    • Core: Arm® 32-bit Cortex®-M4 CPU with FPU, adaptive real-time accelerator (ART Accelerator™) allowing 0-wait-state execution from Flash memory, frequency up to 64 MHz, MPU, 80 DMIPS and DSP instructions
    • Supply and reset management
      • High efficiency embedded SMPSstep-down converter with intelligent bypass mode
      • Ultra-safe, low-power BOR (brownout reset) with five selectable thresholds
      • Ultra-low-power POR/PDR
      • Programmable voltage detector (PVD)
      • VBAT mode with RTC and backup registers
    • Clock sources
      • 32 MHz crystal oscillator with integrated trimming capacitors (Radio and CPU clock)
      • 32 kHz crystal oscillator for RTC (LSE)
      • Internal low-power 32 kHz (±5%) RC (LSI1)
      • Internal low-power 32 kHz (stability ±500 ppm) RC (LSI2)
      • Internal multispeed 100 kHz to 48 MHz oscillator, auto-trimmed by LSE (better than ±0.25% accuracy)
      • High speed internal 16 MHz factory trimmed RC (±1%)
      • 2x PLL for system clock, USB, SAI and ADC
    • Memories
      • Up to 1 MB Flash memory with sector protection (PCROP) against R/W operations, enabling authentic Bluetooth® Low Energy and 802.15.4 SW stack
      • Up to 256 KB SRAM, including 64 KB with hardware parity check
      • 20x32-bit backup register
      • Boot loader supporting, USART, SPI, I2C and USB interfaces
      • OTA (Over the air) Bluetooth® Low Energy and 802.15.4 update
      • Quad SPI memory interface with XIP
    • Rich analog peripherals (down to 1.62 V)
      • 12-bit ADC 4.26Msps, up to 16-bit with hardware oversampling, 200 μA/Msps
      • 2x ultra-low-power comparator
      • Accurate 2.5 V or 2.048 V reference voltage buffered output
    • System peripherals
      • Inter processor communication controller (IPCC) for communication with Bluetooth® Low Energy and 802.15.4
      • HW semaphores for resources sharing between CPUs
      • 2x DMA controllers (7x channels each) supporting ADC, SPI, I2C, USART, QSPI, SAI, AES, Timers
      • 1x USART (ISO 7816, IrDA, SPI Master, Modbus and Smartcard mode)
      • 1x LPUART (low power)
      • 2x SPI 32 Mbit/s
      • 2x I2C (SMBus/PMBus)
      • 1x SAI (dual channel high quality audio)
      • 1x USB 2.0 FS device, crystal-less, BCD and LPM
      • Touch sensing controller, up to 18 sensors
      • LCD 8x40 with step-up converter
      • 1x 16-bit, four channels advanced timer
      • 2x 16-bits, two channels timer
      • 1x 32-bits, four channels timer
      • 2x 16-bits ultra-low-power timer
      • 1x independent Systick
      • 1x independent watchdog
      • 1x window watchdog
    • Security and ID
      • Secure firmware installation (SFI) for Bluetooth® Low Energy and 802.15.4 SW stack
      • 3x hardware encryption AES maximum 256-bit for the application, the Bluetooth® Low Energy and IEEE802.15.4
      • Customer key storage / key manager services
      • HW public key authority (PKA)
      • Cryptographic algorithms: RSA, Diffie-Helman, ECC over GF(p)
      • True random number generator (RNG)
      • Sector protection against R/W operation (PCROP)
      • CRC calculation unit
      • 96-bit unique ID
      • 64-bit unique ID. Possibility to derive 802.15.5 64-bit and Bluetooth® Low Energy 48-bit EUI
    • Up to 72 fast I/Os, 70 of them 5 V-tolerant
    • Development support
      • Serial wire debug (SWD), JTAG for the Application processor
      • Application cross trigger with input and output
      • Embedded Trace Macrocell™ for application
    • All packages are ECOPACK®2 compliant
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STM32WB55VGF7TR - - -40 105
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STM32WB55VGY7TR WLCSP 100L DIE 495 PITCH 0.4 Tape And Reel -40 105
Preview
5.2002 10000 5A992C
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STM32WB55VGQ7TR - - -40 105
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STM32WB55VGY7 - - -40 105
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STM32WB55VGQ6TR - - -40 85
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STM32WB55VGQ7 UFBGA 7X7 129 B P 0.5 Tray -40 105
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- - 5A992C
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STM32WB55VGQ6 UFBGA 7X7 129 B P 0.5 Tray -40 85
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- - 5A992C
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STM32WB55VGY6TR WLCSP 100L DIE 495 PITCH 0.4 Tape And Reel -40 85
Preview
4.86 10000 5A992C
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STM32WB55VGY6 - - -40 85
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STM32WB55VGF6 - - -40 85
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STM32WB55VGF6TR THIN WLCSP 100 DIE 495 P0.4 Tape And Reel -40 85
Preview
- - 5A992C
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No availability of distributors reported, please contact our sales office

STM32WB55VGF7TR

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-

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-
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*

Operating Temperature (°C)

(最小値)

-40

(max)

105

製品ステータス

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Unit Price (US$)

-

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-

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-

Country of Origin

-

STM32WB55VGY7TR

パッケージ

WLCSP 100L DIE 495 PITCH 0.4

梱包タイプ

Tape And Reel
More Info

Unit Price (US$)

5.2002*

Operating Temperature (°C)

(最小値)

-40

(max)

105

製品ステータス

Preview

Unit Price (US$)

5.2002

数量

10000

ECCN (US)

5A992C

Country of Origin

-

STM32WB55VGQ7TR

パッケージ

-

梱包タイプ

-
More Info

Unit Price (US$)

*

Operating Temperature (°C)

(最小値)

-40

(max)

105

製品ステータス

Proposal

Unit Price (US$)

-

数量

-

ECCN (US)

-

Country of Origin

-

STM32WB55VGY7

パッケージ

-

梱包タイプ

-
More Info

Unit Price (US$)

*

Operating Temperature (°C)

(最小値)

-40

(max)

105

製品ステータス

Proposal

Unit Price (US$)

-

数量

-

ECCN (US)

-

Country of Origin

-

STM32WB55VGQ6TR

パッケージ

-

梱包タイプ

-
More Info

Unit Price (US$)

*

Operating Temperature (°C)

(最小値)

-40

(max)

85

製品ステータス

Proposal

Unit Price (US$)

-

数量

-

ECCN (US)

-

Country of Origin

-

STM32WB55VGQ7

パッケージ

UFBGA 7X7 129 B P 0.5

梱包タイプ

Tray
More Info

Unit Price (US$)

*

Operating Temperature (°C)

(最小値)

-40

(max)

105

製品ステータス

Preview

Unit Price (US$)

-

数量

-

ECCN (US)

5A992C

Country of Origin

-

STM32WB55VGQ6

パッケージ

UFBGA 7X7 129 B P 0.5

梱包タイプ

Tray
More Info

Unit Price (US$)

*

Operating Temperature (°C)

(最小値)

-40

(max)

85

製品ステータス

Preview

Unit Price (US$)

-

数量

-

ECCN (US)

5A992C

Country of Origin

-

STM32WB55VGY6TR

パッケージ

WLCSP 100L DIE 495 PITCH 0.4

梱包タイプ

Tape And Reel
More Info

Unit Price (US$)

4.86*

Operating Temperature (°C)

(最小値)

-40

(max)

85

製品ステータス

Preview

Unit Price (US$)

4.86

数量

10000

ECCN (US)

5A992C

Country of Origin

-

STM32WB55VGY6

パッケージ

-

梱包タイプ

-
More Info

Unit Price (US$)

*

Operating Temperature (°C)

(最小値)

-40

(max)

85

製品ステータス

Proposal

Unit Price (US$)

-

数量

-

ECCN (US)

-

Country of Origin

-

STM32WB55VGF6

パッケージ

-

梱包タイプ

-
More Info

Unit Price (US$)

*

Operating Temperature (°C)

(最小値)

-40

(max)

85

製品ステータス

Proposal

Unit Price (US$)

-

数量

-

ECCN (US)

-

Country of Origin

-

STM32WB55VGF6TR

パッケージ

THIN WLCSP 100 DIE 495 P0.4

梱包タイプ

Tape And Reel
More Info

Unit Price (US$)

*

Operating Temperature (°C)

(最小値)

-40

(max)

85

製品ステータス

Preview

Unit Price (US$)

-

数量

-

ECCN (US)

5A992C

Country of Origin

-

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

ビデオ

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MadeForSTM32™ - the new STM32 quality label
MadeForSTM32™ - the new STM32 quality label

MadeForSTM32™ is a new quality label delivered by ST, which is granted after an evaluation process. It helps engineers identify third party solutions with the highest level of integration and quality for the STM32 microcontrollers' ecosystem. MadeForSTM32™ is offered to members of the ST Partner Program who want to go one step further in our collaboration, with the overall objective of contributing to a high-quality STM32 ecosystem.

Why pick the STM32WB for your next design? (ST at embedded world)
Why pick the STM32WB for your next design? (ST at embedded world)

We asked Nathalie the following questions: - Why is the STM32WB the best product for 2.4GHz design? - How can the STM32WB accelerate customer development? - How can STM32WB help tackle hidden system cost? - Can we see a quick demo?

How to develop with the STM32WB
How to develop with the STM32WB

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      Prevas has many years of experience in supporting various industries with solutions in connected devices.

      Life Science, product development of medical technology products

      With 30 years of experience from development in life science, Prevas is a skilled partner in the development of medical technology products

      Migration

      Witekio's experts bring their knowledge and experience of embedded and IoT software systems to handle and control all migration stakes.

      Optimization

      Witekio expert engineers have developed a strong knowledge in complex technical software matters and can help optimize any specific performance aspects of your software.

      Project management expertise

      Witekio teams are experienced in project management and help you choose and run methodologies most adapted to your project, be it Agile or Kanban, software factory, continuous integration.

      SensiEDGE customization services

      End-to-end development services: Hardware, Firmware, Software development, Enclosure, Cloud and mobile APPs. Speed up your IoT project with SensiEDGE!

      SensorTile.box customization services

      Engineering services on theSensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing.

      Smart Products - from idea to certified product

      Prevas has high experience in advanced electronic design from many successful projects

      Software system design and development

      Witekio helps innovators build the best software system for their device: choose the right technologies, build a stable and scalable architecture, develop all software layers.

      Support and Maintenance

      Support to get all product examples running on the off the shelf supported hardware is included for all customers at no cost.

      System security

      Witekio experts secure all the software layers of embedded and IoT systems

      Tech consulting and UX

      Witekio helps innovators ensure their device will meet its market by defining customer journey, prioritizing features, building roadmap and software system architecture.

      Technical expertise

      As a 17 years embedded and IoT software expert, Witekio helps innovators choose the right technologies for their innovative devices: OS, frameworks, apps, connectivity, cloud solutions.

      Test, verification, quality and security

      Efficient test and verification are important issues for success and Prevas addresses those issues with our processes and solutions.

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技術文書

    • 概要 バージョン サイズ アクション
      		DS11929
      Multiprotocol wireless 32-bit MCU Arm®-based Cortex®-M4 with FPU, Bluetooth® 5 and 802.15.4 radio solution       		4.0
      2.53 MB
      		PDF
      DS11929

      Multiprotocol wireless 32-bit MCU Arm®-based Cortex®-M4 with FPU, Bluetooth® 5 and 802.15.4 radio solution

      PDF
    • 概要 バージョン サイズ アクション
      		AN5289
      Building wireless applications with STM32WB Series microcontrollers       		1.0
      3.45 MB
      		PDF
      		AN4312
      Design with surface sensors for touch sensing applications on MCUs       		5.0
      1.83 MB
      		PDF
      		AN5165
      Development of RF hardware using STM32WB microcontrollers       		3.0
      2.63 MB
      		PDF
      		AN1709
      EMC design guide for STM8, STM32 and Legacy MCUs       		3.1
      862.41 KB
      		PDF
      		AN3960
      ESD considerations for touch sensing applications on MCUs       		4.0
      312.5 KB
      		PDF
      		AN1181
      Electrostatic discharge sensitivity measurement       		1.6
      49.01 KB
      		PDF
      		AN4776
      General-purpose timer cookbook for STM32 microcontrollers       		3.0
      2 MB
      		PDF
      		AN5042
      HSE trimming for RF applications using the STM32WB Series       		3.0
      755.14 KB
      		PDF
      		AN4750
      Handling of soft errors in STM32 applications       		2.1
      410.84 KB
      		PDF
      		AN4803
      High-speed SI simulations using IBIS and board-level simulations using HyperLynx® SI on STM32 MCUs and MPUs       		2.0
      2.1 MB
      		PDF
      		AN5292
      How to build a Bluetooth® Low Energy mesh application for STM32WBx5 microcontrollers       		1.0
      1.6 MB
      		PDF
      		AN2834
      How to get the best ADC accuracy in STM32 microcontrollers       		3.1
      1.08 MB
      		PDF
      		AN4229
      How to implement a vocoder solution using STM32 microcontrollers       		1.1
      466 KB
      		PDF
      		AN4221
      I2C protocol used in the STM32 bootloader       		7.0
      714.89 KB
      		PDF
      		AN4299
      Improve conducted noise robustness for touch sensing applications on MCUs       		5.0
      626.39 KB
      		PDF
      		AN3236
      Increase the number of touchkeys for touch sensing applications on MCUs       		5.0
      177.24 KB
      		PDF
      		AN5027
      Interfacing PDM digital microphones using STM32 MCUs and MPUs       		2.0
      1.83 MB
      		PDF
      		AN5156
      Introduction to STM32 microcontrollers security       		2.0
      3.07 MB
      		PDF
      		AN5129
      Low cost PCB antenna for 2.4GHz radio: meander design for STM32WB Series       		4.0
      2.05 MB
      		PDF
      		AN4838
      Managing memory protection unit (MPU) in STM32 MCUs       		3.0
      219.78 KB
      		PDF
      		AN5290
      Minimal BOM for STM32WB Series microcontrollers       		2.0
      325.46 KB
      		PDF
      		AN4635
      Minimization of power consumption using LPUART for STM32 microcontrollers       		4.0
      1.46 MB
      		PDF
      		AN2867
      Oscillator design guide for STM8AF/AL/S and STM32 microcontrollers       		11.0
      2.79 MB
      		PDF
      		AN5247
      Over-the-air application and wireless firmware update for STM32WB Series microcontrollers       		2.0
      1.26 MB
      		PDF
      		AN4760
      Quad-SPI interface (QUADSPI) on STM32 microcontrollers       		2.0
      2.82 MB
      		PDF
      		AN4286
      SPI protocol used in the STM32 bootloader       		6.0
      584.82 KB
      		PDF
      		AN5185
      ST firmware upgrade services for STM32WB Series       		3.0
      317.11 KB
      		PDF
      		AN5224
      STM32 DMAMUX: the DMA request router       		3.0
      255.91 KB
      		PDF
      		AN4899
      STM32 GPIO configuration for hardware settings and low-power consumption       		1.1
      651.9 KB
      		PDF
      		AN4013
      STM32 cross-series timer overview       		7.0
      755.18 KB
      		PDF
      		AN2606
      STM32 microcontroller system memory boot mode       		38.0
      3.89 MB
      		PDF
      		AN5155
      STM32Cube MCU Package examples for STM32WB Series       		1.0
      315.96 KB
      		PDF
      		AN5071
      STM32WB ultra-low-power features overview       		2.0
      459.71 KB
      		PDF
      		AN5270
      STM32WBx5 Bluetooth® Low Energy (BLE) wireless interface       		3.0
      1.77 MB
      		PDF
      		AN4310
      Sampling capacitor selection guide for touch sensing applications on MCUs       		4.0
      140.79 KB
      		PDF
      		AN5036
      Thermal management guidelines for STM32 applications       		3.0
      4.84 MB
      		PDF
      		AN4316
      Tuning a touch sensing application on MCUs       		4.0
      1.64 MB
      		PDF
      		AN3155
      USART protocol used in the STM32 bootloader       		10.0
      657.26 KB
      		PDF
      		AN3156
      USB DFU protocol used in the STM32 bootloader       		9.0
      404.56 KB
      		PDF
      		AN5246
      Usage of SMPS on STM32WB Series microcontrollers       		2.0
      404.63 KB
      		PDF
      		AN4759
      Using the hardware real-time clock (RTC) in low-power modes with STM32 microcontrollers       		4.0
      1.25 MB
      		PDF
      		AN4655
      Virtually increasing the number of serial communication peripherals in STM32 applications       		1.1
      338.99 KB
      		PDF
      AN5289

      Building wireless applications with STM32WB Series microcontrollers

      PDF
      AN4312

      Design with surface sensors for touch sensing applications on MCUs

      PDF
      AN5165

      Development of RF hardware using STM32WB microcontrollers

      PDF
      AN1709

      EMC design guide for STM8, STM32 and Legacy MCUs

      PDF
      AN3960

      ESD considerations for touch sensing applications on MCUs

      PDF
      AN1181

      Electrostatic discharge sensitivity measurement

      PDF
      AN4776

      General-purpose timer cookbook for STM32 microcontrollers

      PDF
      AN5042

      HSE trimming for RF applications using the STM32WB Series

      PDF
      AN4750

      Handling of soft errors in STM32 applications

      PDF
      AN4803

      High-speed SI simulations using IBIS and board-level simulations using HyperLynx® SI on STM32 MCUs and MPUs

      PDF
      AN5292

      How to build a Bluetooth® Low Energy mesh application for STM32WBx5 microcontrollers

      PDF
      AN2834

      How to get the best ADC accuracy in STM32 microcontrollers

      PDF
      AN4229

      How to implement a vocoder solution using STM32 microcontrollers

      PDF
      AN4221

      I2C protocol used in the STM32 bootloader

      PDF
      AN4299

      Improve conducted noise robustness for touch sensing applications on MCUs

      PDF
      AN3236

      Increase the number of touchkeys for touch sensing applications on MCUs

      PDF
      AN5027

      Interfacing PDM digital microphones using STM32 MCUs and MPUs

      PDF
      AN5156

      Introduction to STM32 microcontrollers security

      PDF
      AN5129

      Low cost PCB antenna for 2.4GHz radio: meander design for STM32WB Series

      PDF
      AN4838

      Managing memory protection unit (MPU) in STM32 MCUs

      PDF
      AN5290

      Minimal BOM for STM32WB Series microcontrollers

      PDF
      AN4635

      Minimization of power consumption using LPUART for STM32 microcontrollers

      PDF
      AN2867

      Oscillator design guide for STM8AF/AL/S and STM32 microcontrollers

      PDF
      AN5247

      Over-the-air application and wireless firmware update for STM32WB Series microcontrollers

      PDF
      AN4760

      Quad-SPI interface (QUADSPI) on STM32 microcontrollers

      PDF
      AN4286

      SPI protocol used in the STM32 bootloader

      PDF
      AN5185

      ST firmware upgrade services for STM32WB Series

      PDF
      AN5224

      STM32 DMAMUX: the DMA request router

      PDF
      AN4899

      STM32 GPIO configuration for hardware settings and low-power consumption

      PDF
      AN4013

      STM32 cross-series timer overview

      PDF
      AN2606

      STM32 microcontroller system memory boot mode

      PDF
      AN5155

      STM32Cube MCU Package examples for STM32WB Series

      PDF
      AN5071

      STM32WB ultra-low-power features overview

      PDF
      AN5270

      STM32WBx5 Bluetooth® Low Energy (BLE) wireless interface

      PDF
      AN4310

      Sampling capacitor selection guide for touch sensing applications on MCUs

      PDF
      AN5036

      Thermal management guidelines for STM32 applications

      PDF
      AN4316

      Tuning a touch sensing application on MCUs

      PDF
      AN3155

      USART protocol used in the STM32 bootloader

      PDF
      AN3156

      USB DFU protocol used in the STM32 bootloader

      PDF
      AN5246

      Usage of SMPS on STM32WB Series microcontrollers

      PDF
      AN4759

      Using the hardware real-time clock (RTC) in low-power modes with STM32 microcontrollers

      PDF
      AN4655

      Virtually increasing the number of serial communication peripherals in STM32 applications

      PDF
    • 概要 バージョン サイズ アクション
      		TN1163
      Description of WLCSP for microcontrollers and recommendations for its use       		4.0
      1.07 MB
      		PDF
      		TN1204
      Tape and reel shipping media for STM32 microcontrollers in BGA packages       		2.1
      745.74 KB
      		PDF
      		TN1205
      Tape and reel shipping media for STM8 and STM32 microcontrollers in FPN packages       		3.0
      753.31 KB
      		PDF
      		TN1206
      Tape and reel shipping media for STM8 and STM32 microcontrollers in QFP packages       		3.0
      830.98 KB
      		PDF
      		TN1207
      Tape and reel shipping media for STM8 and STM32 microcontrollers in SO packages       		1.0
      755.03 KB
      		PDF
      		TN1208
      Tape and reel shipping media for STM8 and STM32 microcontrollers in TSSOP and SSOP packages       		1.0
      743.08 KB
      		PDF
      TN1163

      Description of WLCSP for microcontrollers and recommendations for its use

      PDF
      TN1204

      Tape and reel shipping media for STM32 microcontrollers in BGA packages

      PDF
      TN1205

      Tape and reel shipping media for STM8 and STM32 microcontrollers in FPN packages

      PDF
      TN1206

      Tape and reel shipping media for STM8 and STM32 microcontrollers in QFP packages

      PDF
      TN1207

      Tape and reel shipping media for STM8 and STM32 microcontrollers in SO packages

      PDF
      TN1208

      Tape and reel shipping media for STM8 and STM32 microcontrollers in TSSOP and SSOP packages

      PDF
    • 概要 バージョン サイズ アクション
      		RM0434
      Multiprotocol wireless 32-bit MCU Arm®-based Cortex®-M4 with FPU, Bluetooth® Low-Energy and 802.15.4 radio solution       		4.0
      16.78 MB
      		PDF
      RM0434

      Multiprotocol wireless 32-bit MCU Arm®-based Cortex®-M4 with FPU, Bluetooth® Low-Energy and 802.15.4 radio solution

      PDF
    • 概要 バージョン サイズ アクション
      		PM0214
      STM32 Cortex®-M4 MCUs and MPUs programming manual       		8.0
      2.94 MB
      		PDF
      PM0214

      STM32 Cortex®-M4 MCUs and MPUs programming manual

      PDF
    • 概要 バージョン サイズ アクション
      		ES0394
      STM32WB55Cx/Rx/Vx device errata       		4.0
      306.43 KB
      		PDF
      ES0394

      STM32WB55Cx/Rx/Vx device errata

      PDF
    • 概要 バージョン サイズ アクション
      		AN4841
      Digital signal processing for STM32 microcontrollers using CMSIS       		2.0
      1.38 MB
      		PDF
      		AN4865
      Low-power timer (LPTIM) applicative use-cases on STM32 microcontrollers       		4.0
      241.34 KB
      		PDF
      		AN4635
      Minimization of power consumption using LPUART for STM32 microcontrollers       		4.0
      1.46 MB
      		PDF
      		AN4571
      STM32 BLE toolbox for Android       		1.0
      997.46 KB
      		PDF
      		AN4502
      STM32 SMBus/PMBus™ embedded software expansion for STM32Cube™       		3.0
      1.34 MB
      		PDF
      		AN4657
      STM32 in-application programming (IAP) using the USART       		1.0
      635.73 KB
      		PDF
      		AN5155
      STM32Cube MCU Package examples for STM32WB Series       		1.0
      315.96 KB
      		PDF
      		AN5054
      Secure programming using STM32CubeProgrammer       		2.0
      2.89 MB
      		PDF
      		AN3406
      Using an STM32W108-based board and Wireshark for IEEE 802.15.4 packet analysis       		1.5
      250.88 KB
      		PDF
      AN4841

      Digital signal processing for STM32 microcontrollers using CMSIS

      PDF
      AN4865

      Low-power timer (LPTIM) applicative use-cases on STM32 microcontrollers

      PDF
      AN4635

      Minimization of power consumption using LPUART for STM32 microcontrollers

      PDF
      AN4571

      STM32 BLE toolbox for Android

      PDF
      AN4502

      STM32 SMBus/PMBus™ embedded software expansion for STM32Cube™

      PDF
      AN4657

      STM32 in-application programming (IAP) using the USART

      PDF
      AN5155

      STM32Cube MCU Package examples for STM32WB Series

      PDF
      AN5054

      Secure programming using STM32CubeProgrammer

      PDF
      AN3406

      Using an STM32W108-based board and Wireshark for IEEE 802.15.4 packet analysis

      PDF

HWモデル、CADライブラリ & SVD

    • 概要 バージョン サイズ アクション
      		STM32WB IBIS files 1.0
      1.45 MB
      		ZIP

      STM32WB IBIS files

      ZIP
    • 概要 バージョン サイズ アクション
      		STM32WB BSDL files 1.0
      16.24 KB
      		ZIP

      STM32WB BSDL files

      ZIP

プレゼンテーション & トレーニング資料

    • 概要 バージョン サイズ アクション
      		New STM32WB Series MCU with built-in Bluetooth™ 5 and IEEE 802.15.4 1.0
      1.74 MB
      		PDF
      		STM32 Development Boards Portfolio 1.0
      3.08 MB
      		PDF

      New STM32WB Series MCU with built-in Bluetooth™ 5 and IEEE 802.15.4

      PDF

      STM32 Development Boards Portfolio

      PDF

関連資料

    • 概要 バージョン サイズ アクション
      		Get ready for the largest IoT development ecosystem 17.4
      350.08 KB
      		PDF
      		STM32 Nucleo boards - Unified scalable offering 17.6
      913.03 KB
      		PDF
      		STM32Trust An ecosystem for embedded security 1.0
      1.08 MB
      		PDF
      		STM32WB Wireless Series Bluetooth™ 5 and IEEE 802.15.4 18.3
      261.53 KB
      		PDF

      Get ready for the largest IoT development ecosystem

      PDF

      STM32 Nucleo boards - Unified scalable offering

      PDF

      STM32Trust An ecosystem for embedded security

      PDF

      STM32WB Wireless Series Bluetooth™ 5 and IEEE 802.15.4

      PDF
    • 概要 バージョン サイズ アクション
      		STM32 32-bit MCU family - Leading supplier of Arm® Cortex®-M microcontrollers 17.3
      1.34 MB
      		PDF

      STM32 32-bit MCU family - Leading supplier of Arm® Cortex®-M microcontrollers

      PDF

品質 & 信頼性

    • 概要 バージョン サイズ アクション
      		Full Thread Device interoperability Certificate 1.0
      32.59 KB
      		PDF
      		Minimal Thread Device Interoperability Certification 1.0
      32.32 KB
      		PDF
      		STM32WB55 Bluetooth 5 certifications using Qualified Design Listing 1.1
      220.55 KB
      		PDF

      Full Thread Device interoperability Certificate

      PDF

      Minimal Thread Device Interoperability Certification

      PDF

      STM32WB55 Bluetooth 5 certifications using Qualified Design Listing

      PDF
製品型番 製品ステータス パッケージ グレード RoHSコンプライアンスグレード 材料宣誓書**
STM32WB55VGF6
Proposal
- インダストリアル -
STM32WB55VGF6TR
Preview
THIN WLCSP 100 DIE 495 P0.4 インダストリアル Ecopack2
STM32WB55VGF7TR
Proposal
- インダストリアル -
STM32WB55VGQ6
Preview
UFBGA 7X7 129 B P 0.5 インダストリアル Ecopack2
STM32WB55VGQ6TR
Proposal
- インダストリアル -
STM32WB55VGQ7
Preview
UFBGA 7X7 129 B P 0.5 インダストリアル Ecopack2
STM32WB55VGQ7TR
Proposal
- インダストリアル -
STM32WB55VGY6
Proposal
- インダストリアル -
STM32WB55VGY6TR
Preview
WLCSP 100L DIE 495 PITCH 0.4 インダストリアル Ecopack2
STM32WB55VGY7
Proposal
- インダストリアル -
STM32WB55VGY7TR
Preview
WLCSP 100L DIE 495 PITCH 0.4 インダストリアル Ecopack2

STM32WB55VGF6

Package:

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-

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Industrial

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-

STM32WB55VGF6TR

Package:

THIN WLCSP 100 DIE 495 P0.4

Material Declaration**:

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Package

THIN WLCSP 100 DIE 495 P0.4

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Ecopack2

STM32WB55VGF7TR

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Material Declaration**:

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-

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Industrial

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-

STM32WB55VGQ6

Package:

UFBGA 7X7 129 B P 0.5

Material Declaration**:

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Package

UFBGA 7X7 129 B P 0.5

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Industrial

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STM32WB55VGQ6TR

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Material Declaration**:

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Industrial

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-

STM32WB55VGQ7

Package:

UFBGA 7X7 129 B P 0.5

Material Declaration**:

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UFBGA 7X7 129 B P 0.5

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Ecopack2

STM32WB55VGQ7TR

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STM32WB55VGY6

Package:

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Material Declaration**:

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-

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Industrial

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-

STM32WB55VGY6TR

Package:

WLCSP 100L DIE 495 PITCH 0.4

Material Declaration**:

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Package

WLCSP 100L DIE 495 PITCH 0.4

Grade

Industrial

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Ecopack2

STM32WB55VGY7

Package:

-

Material Declaration**:

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Package

-

Grade

Industrial

RoHS Compliance Grade

-

STM32WB55VGY7TR

Package:

WLCSP 100L DIE 495 PITCH 0.4

Material Declaration**:

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Preview

Package

WLCSP 100L DIE 495 PITCH 0.4

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.