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The STM32WB55xx multiprotocol wireless and ultra-low-power devices embed a powerful and ultra-low-power radio compliant with the Bluetooth® Low Energy SIG specification v5.0 and with IEEE 802.15.4-2011. They contain a dedicated Arm® Cortex® -M0+ for performing all the real-time low layer operation.
The STM32WB55xx devices are designed to be extremely low-power and are based on the high-performance Arm® Cortex®-M4 32-bit RISC core operating at a frequency of up to 64 MHz. The Cortex®-M4 core features a Floating point unit (FPU) single precision that supports all Arm® single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) that enhances application security.
Enhanced inter-processor communication is provided by the IPCC with six bidirectional channels. The HSEM provides hardware semaphores used to share common resources between the two processors.
The STM32WB55xx devices embed high-speed memories (Flash memory up to 1 Mbyte, up to 256 Kbyte of SRAM), a Quad-SPI Flash memory interface (available on all packages) and an extensive range of enhanced I/Os and peripherals.
Direct data transfer between memory and peripherals and from memory to memory is supported by fourteen DMA channels with a full flexible channel mapping by the DMAMUX peripheral.
The STM32WB55xx devices embed several mechanisms for embedded Flash memory and SRAM: readout protection, write protection and proprietary code readout protection. Portions of the memory can be secured for Cortex® -M0+ exclusive access.
The two AES encryption engines, PKA and RNG enable lower layer MAC and upper layer cryptography. A customer key storage feature may be used to keep the keys hidden.
The devices offer one fast 12-bit ADC and two ultra-low-power comparators associated with a high accuracy reference voltage generator.
The STM32WB55xx devices embed a low-power RTC, one advanced 16-bit timer, one general-purpose 32-bit timer, two general-purpose 16-bit timers, and two 16-bit low-power timers.
In addition, up to 18 capacitive sensing channels are available. The devices also embed an integrated LCD driver up to 8x40 or 4x44, with internal step-up converter.
They also feature standard and advanced communication interfaces, namely one USART (ISO 7816, IrDA, Modbus and Smartcard mode), one Low Power UART (LPUART), two I2C (SMBus/PMBus), two SPI (up to 32 MHz), one serial audio interface (SAI) with two channels and three PDMs, one USB 2.0 FS device with embedded crystal-less oscillator, supporting BCD and LPM, and one Quad-SPI with execute-in-place (XIP) capability.
The STM32WB55xx operate in the -40 to +105 °C (+125 °C junction) temperature range from a 1.71 to 3.6 V power supply. A comprehensive set of power-saving modes enables the design of low-power applications.
The STM32WB55xx include independent power supplies for analog input for ADC.
The STM32WB55xx integrate a high efficiency SMPS step-down converter with automatic bypass mode capability when the VDD falls below VBORx (x=1, 2, 3, 4) voltage level (default is 2.0 V). It includes independent power supplies for analog input for ADC and comparators, as well as a 3.3 V dedicated supply input for USB.
A VBAT dedicated supply allows the devices to back up the LSE 32.768KHz oscillator, the RTC and the backup registers, thus enabling the STM32WB55xx to supply these functions even if the main VDD is not present through a CR2032-like battery, a Supercap or a small rechargeable battery.
The STM32WB55xx offers three packages, from 48 to 100 pins.主な特徴
- Includes ST state-of-the-art patented technology
- Radio
- 2.4 GHz
- RF transceiver supporting Bluetooth® 5 specification, IEEE 802.15.4-2011 PHY and MAC, supporting Thread and ZigBee® 3.0
- RX Sensitivity: -96 dBm (Bluetooth® Low Energy at 1 Mbps), -100 dBm (802.15.4)
- Programmable output power up to +6 dBm with 1 dB steps
- Integrated balun to reduce BOM
- Support for 2 Mbps
- Dedicated Arm® 32-bit Cortex® M0 + CPU for real-time Radio layer
- Accurate RSSI to enable power control
- Suitable for systems requiring compliance with radio frequency regulations ETSI EN 300 328, EN 300 440, FCC CFR47 Part 15 and ARIB STD-T66
- Support for external PA
- Available integrated passive device (IPD) companion chip for optimized matching solution MLPF-WB55-01E3
- Ultra-low-power platform
- 1.71 V to 3.6 V power supply
- – 40 °C to 85 / 105 °C temperature ranges
- 13 nA shutdown mode
- 600 nA Standby mode + RTC + 32 KB RAM
- 2.1 µA Stop mode + RTC + 256 KB RAM
- Active-mode MCU: < 53 µA / MHz when RF and SMPS On
- Radio: Rx 4.5 mA / Tx at 0 dBm 5.2 mA
- Core: Arm® 32-bit Cortex®-M4 CPU with FPU, adaptive real-time accelerator (ART Accelerator™) allowing 0-wait-state execution from Flash memory, frequency up to 64 MHz, MPU, 80 DMIPS and DSP instructions
- Performance benchmark
- 1.25 DMIPS/MHz (Drystone 2.1)
- 219.48 Coremark® (3.43 Coremark/MHz @64 MHz)
- Energy benckmark
- 303 ULPMark™ CP score
- Supply and reset management
- High efficiency embedded SMPSstep-down converter with intelligent bypass mode
- Ultra-safe, low-power BOR (brownout reset) with five selectable thresholds
- Ultra-low-power POR/PDR
- Programmable voltage detector (PVD)
- VBAT mode with RTC and backup registers
- Clock sources
- 32 MHz crystal oscillator with integrated trimming capacitors (Radio and CPU clock)
- 32 kHz crystal oscillator for RTC (LSE)
- Internal low-power 32 kHz (±5%) RC (LSI1)
- Internal low-power 32 kHz (stability ±500 ppm) RC (LSI2)
- Internal multispeed 100 kHz to 48 MHz oscillator, auto-trimmed by LSE (better than ±0.25% accuracy)
- High speed internal 16 MHz factory trimmed RC (±1%)
- 2x PLL for system clock, USB, SAI and ADC
- Memories
- Up to 1 MB Flash memory with sector protection (PCROP) against R/W operations, enabling authentic Bluetooth® Low Energy and 802.15.4 SW stack
- Up to 256 KB SRAM, including 64 KB with hardware parity check
- 20x32-bit backup register
- Boot loader supporting, USART, SPI, I2C and USB interfaces
- OTA (Over the air) Bluetooth® Low Energy and 802.15.4 update
- Quad SPI memory interface with XIP
- Rich analog peripherals (down to 1.62 V)
- 12-bit ADC 4.26 Msps, up to 16-bit with hardware oversampling, 200 µA/Msps
- 2x ultra-low-power comparator
- Accurate 2.5 V or 2.048 V reference voltage buffered output
- System peripherals
- Inter processor communication controller (IPCC) for communication with Bluetooth® Low Energy and 802.15.4
- HW semaphores for resources sharing between CPUs
- 2x DMA controllers (7x channels each) supporting ADC, SPI, I2C, USART, QSPI, SAI, AES, Timers
- 1x USART (ISO 7816, IrDA, SPI Master, Modbus and Smartcard mode)
- 1x LPUART (low power)
- 2x SPI 32 Mbit/s
- 2x I2C (SMBus/PMBus)
- 1x SAI (dual channel high quality audio)
- 1x USB 2.0 FS device, crystal-less, BCD and LPM
- Touch sensing controller, up to 18 sensors
- LCD 8x40 with step-up converter
- 1x 16-bit, four channels advanced timer
- 2x 16-bits, two channels timer
- 1x 32-bits, four channels timer
- 2x 16-bits ultra-low-power timer
- 1x independent Systick
- 1x independent watchdog
- 1x window watchdog
- Security and ID
- Secure firmware installation (SFI) for Bluetooth® Low Energy and 802.15.4 SW stack
- 3x hardware encryption AES maximum 256-bit for the application, the Bluetooth® Low Energy and IEEE802.15.4
- Customer key storage / key manager services
- HW public key authority (PKA)
- Cryptographic algorithms: RSA, Diffie-Helman, ECC over GF(p)
- True random number generator (RNG)
- Sector protection against R/W operation (PCROP)
- CRC calculation unit
- Die information: 96-bit unique ID
- IEEE 64-bit unique ID. Possibility to derive 802.15.4 64-bit and Bluetooth® Low Energy 48-bit EUI
- Up to 72 fast I/Os, 70 of them 5 V-tolerant
- Development support
- Serial wire debug (SWD), JTAG for the Application processor
- Application cross trigger with input and output
- Embedded Trace Macrocell™ for application
- All packages are ECOPACK2 compliant
回路ダイアグラム

サンプル & 購入
製品型番 | パッケージ | 梱包タイプ | 温度(℃) | 製品ステータス | 概算価格(USS) | 数量 | ECCN (US) | Country of Origin | 詳細 | 販売代理店からオーダー | STからオーダー | |
---|---|---|---|---|---|---|---|---|---|---|---|---|
最小値 | max | |||||||||||
STM32WB55VGY7TR | WLCSP 100L DIE 495 PITCH 0.4 | Tape And Reel | -40 | 105 | アクティブ | 5.2002 | 10000 | 5A992C | - | 販売代理店に在庫がない場合は、STのセールスオフィスまでお問い合わせください | ||
STM32WB55VGQ7 | UFBGA 7X7 129 B P 0.5 | Tray | -40 | 105 | プレビュー | 5.457 | 10000 | 5A992C | - | 販売代理店に在庫がない場合は、STのセールスオフィスまでお問い合わせください | ||
STM32WB55VGQ6 | UFBGA 7X7 129 B P 0.5 | Tray | -40 | 85 | プレビュー | 5.1 | 10000 | 5A992C | - | 販売代理店に在庫がない場合は、STのセールスオフィスまでお問い合わせください | ||
STM32WB55VGY6TR | WLCSP 100L DIE 495 PITCH 0.4 | Tape And Reel | -40 | 85 | アクティブ | 4.86 | 10000 | 5A992C | - | 販売代理店に在庫がない場合は、STのセールスオフィスまでお問い合わせください | ||
STM32WB55VGF6TR | THIN WLCSP 100 DIE 495 P0.4 | Tape And Reel | -40 | 85 | プレビュー | - | - | 5A992C | - | 販売代理店に在庫がない場合は、STのセールスオフィスまでお問い合わせください |
STM32WB55VGY7TR
パッケージ
WLCSP 100L DIE 495 PITCH 0.4梱包タイプ
Tape And ReelUnit Price (US$)
5.2002*STM32WB55VGQ7
パッケージ
UFBGA 7X7 129 B P 0.5梱包タイプ
TrayUnit Price (US$)
5.457*STM32WB55VGQ6
パッケージ
UFBGA 7X7 129 B P 0.5梱包タイプ
TrayUnit Price (US$)
5.1*STM32WB55VGY6TR
パッケージ
WLCSP 100L DIE 495 PITCH 0.4梱包タイプ
Tape And ReelUnit Price (US$)
4.86*STM32WB55VGF6TR
パッケージ
THIN WLCSP 100 DIE 495 P0.4梱包タイプ
Tape And ReelUnit Price (US$)
*(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
ビデオ
How to program the STM32WB dual core in single operation, through STM32CubeProgrammer or through code example delivered in Software package.
MadeForSTM32™ is a new quality label delivered by ST, which is granted after an evaluation process. It helps engineers identify third party solutions with the highest level of integration and quality for the STM32 microcontrollers' ecosystem. MadeForSTM32™ is offered to members of the ST Partner Program who want to go one step further in our collaboration, with the overall objective of contributing to a high-quality STM32 ecosystem.
We asked Nathalie the following questions: - Why is the STM32WB the best product for 2.4GHz design? - How can the STM32WB accelerate customer development? - How can STM32WB help tackle hidden system cost? - Can we see a quick demo?
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製品型番 | 製品ステータス | パッケージ | グレード | RoHSコンプライアンスグレード | Material Declaration** |
---|---|---|---|---|---|
STM32WB55VGF6TR | プレビュー | THIN WLCSP 100 DIE 495 P0.4 | インダストリアル | Ecopack2 | |
STM32WB55VGQ6 | プレビュー | UFBGA 7X7 129 B P 0.5 | インダストリアル | Ecopack2 | |
STM32WB55VGQ7 | プレビュー | UFBGA 7X7 129 B P 0.5 | インダストリアル | Ecopack2 | |
STM32WB55VGY6TR | アクティブ | WLCSP 100L DIE 495 PITCH 0.4 | インダストリアル | Ecopack2 | |
STM32WB55VGY7TR | アクティブ | WLCSP 100L DIE 495 PITCH 0.4 | インダストリアル | Ecopack2 | |
STM32WB55VGF6TR
Package:
THIN WLCSP 100 DIE 495 P0.4Material Declaration**:
STM32WB55VGQ6
Package:
UFBGA 7X7 129 B P 0.5Material Declaration**:
STM32WB55VGQ7
Package:
UFBGA 7X7 129 B P 0.5Material Declaration**:
STM32WB55VGY6TR
Package:
WLCSP 100L DIE 495 PITCH 0.4Material Declaration**:
STM32WB55VGY7TR
Package:
WLCSP 100L DIE 495 PITCH 0.4Material Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.