Product overview
Description
The IMP23ABSU is a compact, low-power microphone built with a capacitive sensing element and an IC interface. The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process to produce audio sensors.The IMP23ABSU has an acoustic overload point of 130 dBSPL with a typical 64 dB signal-to-noise ratio.
The sensitivity of the IMP23ABSU is -38 dBV ±1 dB @ 94 dBSPL, 1 kHz.
The IMP23ABSU is available in a package compliant with reflow soldering and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.
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All features
- Single supply voltage operation 1.52 V - 3.6 V
- Omnidirectional sensitivity
- High signal-to-noise ratio
- High acoustic overload point: 130 dBSPL typ.
- Package compliant with reflow soldering
- Enhanced RF immunity
- Ultra-flat frequency response
- Ultrasound bandwidth (up to 80 kHz)
- Low latency
- Ultra-low-power: 150 µA max.
- ECOPACK, RoHS, and “Green” compliant
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Featured Videos
Basic principles on which microphones are based, as well as a comparison between several microphone types.
All tools & software
All resources
| Resource title | Version | Latest update |
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Product Specifications (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 2.0 | 17 Sep 2020 | 17 Sep 2020 |
Application Notes (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 2.0 | 17 Sep 2020 | 17 Sep 2020 |
Presentations (2)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.0 | 13 Nov 2020 | 13 Nov 2020 | ||
| 1.1 | 19 Jul 2021 | 19 Jul 2021 |
Flyers (3)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 26 Feb 2020 | 26 Feb 2020 | |||
| 1.0 | 11 Nov 2020 | 11 Nov 2020 | ||
| 4.0 | 04 May 2021 | 04 May 2021 |
Brochures (5)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 2.0 | 07 Apr 2021 | 07 Apr 2021 | ||
| 2.1 | 06 Aug 2020 | 06 Aug 2020 | ||
| 01.21 | 19 Mar 2021 | 19 Mar 2021 | ||
| 1.0 | 19 Sep 2019 | 19 Sep 2019 | ||
| 1.0 | 23 Jun 2020 | 23 Jun 2020 |
EDA Symbols, Footprints and 3D Models
STMicroelectronics - IMP23ABSU
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
Quality and Reliability
| Part Number | Marketing Status | Package | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|
| IMP23ABSUTR | Active | RHLGA 2.65X3.5X1.08(MAX)MM 4L | Ecopack1 | |
IMP23ABSUTR
Package:
RHLGA 2.65X3.5X1.08(MAX)MM 4LMaterial Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Order from Distributors | Order from ST | Marketing Status | ECCN (US) | ECCN (EU) | Packing Type | Package | Temperature (°C) | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | |||||||||||
| IMP23ABSUTR | No availability of distributors reported, please contact our sales office | Active | EAR99 | NEC | Tape And Reel | RHLGA 2.65X3.5X1.08(MAX)MM 4L | -40 | 85 | CHINA | 1.1 / 1k | ||
Marketing Status
ActiveECCN (US)
EAR99Budgetary Price (US$)*/Qty
1.1 / 1k(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
