ILPS28QSW

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Dual full-scale, 1260 hPa and 4060 hPa, absolute digital output barometer with Qvar detection in a water-resistant package

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Product overview

Description

The ILPS28QSW is an ultra-compact piezoresistive absolute pressure sensor which functions as a digital output barometer, supporting dual full-scale up to user-selectable 4060 hPa. The device comprises a sensing element and an IC interface which communicates over the I²C or MIPI I3CSM interface from the sensing element to the application. The ILPS28QSW provides lower power consumption, achieving lower pressure noise than its predecessor.
The ILPS28QSW embeds an analog hub sensing functionality which is able to connect an analog input and convert it to a digital signal for embedded processing. In addition, an embedded Qvar (electric charge variation detection) channel can be enabled for sensing in applications such as water leakage detection, tap, double tap, long press, and L/R - R/L swipe.
The ILPS28QSW is available in a ceramic LGA package with metal lid. It is guaranteed to operate over a temperature range extending from -40 °C to +105 °C. The package is holed to allow external pressure to reach the sensing element. Gel inside the IC protects the electrical components from water and the metal cap is, optionally, connected to ground or left floating electrically in the application PCB layout. The connection of the metal cap is determined according to the customer’s target application.
  • All features

    • Dual full-scale absolute pressure sensor in a water-resistant packageMode 1: 260 ~ 1260 hPaMode 2: 260 ~ 4060 hPa
    • Embedded analog hub for processing analog input data
    • Embedded Qvar for detecting electric charge variation
    • Current consumption down to 1.7 μA
    • Absolute pressure accuracy: 0.5 hPa
    • Low pressure sensor noise: 0.32 Pa
    • Embedded temperature compensation
    • Extended temperature range from -40 to +105 °C
    • 24-bit pressure data output
    • ODR from 1 Hz to 200 Hz
    • I²C or MIPI I3CSM interface
    • Embedded FIFO
    • Supply voltage: 1.7 to 3.6 V
    • Easily sealed package with O-ring
    • ECOPACK lead-free compliant

All tools & software

    • Part number
      Status
      Description
      Type
      Supplier

      SensiBLE

      Active

      Certified Bluetooth low energy master/slave network processor module, compliant with Bluetooth v4.1

      Hardware Integrated Devices from Partners SensiEDGE
      SensiBLE

      Description:

      Certified Bluetooth low energy master/slave network processor module, compliant with Bluetooth v4.1

      SensiBLE 2.0

      Active

      Low power single core (SOC) system-on-chip with 32MHz 32-bit ARM® Cortex®-M0 CPU, and Certified Bluetooth low energy (BLE) v4.2

      Hardware Integrated Devices from Partners SensiEDGE
      SensiBLE 2.0

      Description:

      Low power single core (SOC) system-on-chip with 32MHz 32-bit ARM® Cortex®-M0 CPU, and Certified Bluetooth low energy (BLE) v4.2

      SensiBLE 2.1

      Active

      Low power single core (SOC) system-on-chip with 32MHz 32-bit ARM® Cortex®-M0 MCU, Certified Bluetooth low energy (BLE) v5.2

      Hardware Integrated Devices from Partners SensiEDGE
      SensiBLE 2.1

      Description:

      Low power single core (SOC) system-on-chip with 32MHz 32-bit ARM® Cortex®-M0 MCU, Certified Bluetooth low energy (BLE) v5.2

      SensiSUB

      Active

      End-to-end solution for LPWAN enabling cloud connectivity to sensor data over a long range Sub-1 GHz star network

      Hardware Integrated Devices from Partners SensiEDGE
      SensiSUB

      Description:

      End-to-end solution for LPWAN enabling cloud connectivity to sensor data over a long range Sub-1 GHz star network
    • Part number
      Status
      Description
      Type
      Supplier

      FAE Engineering Services

      Active

      Engineering services on the SensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing.

      Design Services from Partners FAE Technology
      FAE Engineering Services

      Description:

      Engineering services on the SensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing.

      SensiEDGE customization services

      Active

      End-to-end development services: Hardware, Firmware, Software development, Enclosure, Cloud and mobile APPs. Speed up your IoT project with SensiEDGE!

      Design Services from Partners SensiEDGE
      SensiEDGE customization services

      Description:

      End-to-end development services: Hardware, Firmware, Software development, Enclosure, Cloud and mobile APPs. Speed up your IoT project with SensiEDGE!

EDA Symbols, Footprints and 3D Models

STMicroelectronics - ILPS28QSW

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Quality and Reliability

Part Number Marketing Status Package RoHS Compliance Grade Material Declaration**
ILPS28QSW
Preview
CERAMIC CCLGA 2.8X2.8X2.1 6L+PAD Ecopack2
ILPS28QSWTR
Preview
CERAMIC CCLGA 2.8X2.8X2.1 6L+PAD Ecopack2

ILPS28QSW

Package:

CERAMIC CCLGA 2.8X2.8X2.1 6L+PAD

Material Declaration**:

Marketing Status

Preview

Package

CERAMIC CCLGA 2.8X2.8X2.1 6L+PAD

RoHS Compliance Grade

Ecopack2

ILPS28QSWTR

Package:

CERAMIC CCLGA 2.8X2.8X2.1 6L+PAD

Material Declaration**:

Marketing Status

Preview

Package

CERAMIC CCLGA 2.8X2.8X2.1 6L+PAD

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

Part Number
Order from Distributors
Order from ST
Marketing Status
ECCN (US)
ECCN (EU)
Packing Type
Package
Temperature (°C) Country of Origin
Budgetary Price (US$)*/Qty
min
max
ILPS28QSW No availability of distributors reported, please contact our sales office
Preview
EAR99 NEC Tray CERAMIC CCLGA 2.8X2.8X2.1 6L+PAD -40 85 THAILAND
ILPS28QSWTR No availability of distributors reported, please contact our sales office
Preview
EAR99 NEC Tape And Reel CERAMIC CCLGA 2.8X2.8X2.1 6L+PAD -40 85 THAILAND

ILPS28QSW

Marketing Status

Preview

ECCN (US)

EAR99

Budgetary Price (US$)*/Qty

ECCN (EU)

NEC

Packing Type

Tray

Package

CERAMIC CCLGA 2.8X2.8X2.1 6L+PAD

Operating Temperature (°C)

(min)

-40

(max)

85

Budgetary Price (US$)* / Qty

Country of Origin

THAILAND

ILPS28QSWTR

Marketing Status

Preview

ECCN (US)

EAR99

Budgetary Price (US$)*/Qty

ECCN (EU)

NEC

Packing Type

Tape And Reel

Package

CERAMIC CCLGA 2.8X2.8X2.1 6L+PAD

Operating Temperature (°C)

(min)

-40

(max)

85

Budgetary Price (US$)* / Qty

Country of Origin

THAILAND

(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors