ILPS28QSW

Evaluation
Design Win Education

Dual full-scale, 1260 hPa and 4060 hPa, absolute digital output barometer with Qvar detection in a water-resistant package

Download databrief
Overview
Sample & Buy
Solutions
Documentation
CAD Resources
Tools & Software
Quality & Reliability
Get Started
Partner products
Sales Briefcase

Product overview

Description

The ILPS28QSW is an ultra-compact piezoresistive absolute pressure sensor which functions as a digital output barometer, supporting dual full-scale up to user-selectable 4060 hPa.

The device comprises a sensing element and an IC interface which communicates over the I²C or MIPI I3CSM interface from the sensing element to the application. The ILPS28QSW provides lower power consumption, achieving lower pressure noise than its predecessor.

The ILPS28QSW embeds an analog hub sensing functionality which is able to connect an analog input and convert it to a digital signal for embedded processing. In addition, an embedded Qvar (electric charge variation detection) channel can be enabled for sensing in applications such as water leakage detection, tap, double tap, long press, and L/R - R/L swipe.

The ILPS28QSW is available in a ceramic LGA package with metal lid. It is guaranteed to operate over a temperature range extending from -40 °C to +105 °C. The package is holed to allow external pressure to reach the sensing element. Gel inside the IC protects the electrical components from water and the metal cap is, optionally, connected to ground or left floating electrically in the application PCB layout. The connection of the metal cap is determined according to the customer’s target application.

  • All features

    • Dual full-scale absolute pressure sensor in a water-resistant packageMode 1: 260 ~ 1260 hPaMode 2: 260 ~ 4060 hPa
    • Embedded analog hub for processing analog input data
    • Embedded Qvar for detecting electric charge variation
    • Current consumption down to 1.7 μA
    • Absolute pressure accuracy: 0.5 hPa
    • Low pressure sensor noise: 0.32 Pa
    • Embedded temperature compensation
    • Extended temperature range from -40 to +105 °C
    • 24-bit pressure data output
    • ODR from 1 Hz to 200 Hz
    • I²C or MIPI I3CSM interface
    • Embedded FIFO
    • Supply voltage: 1.7 to 3.6 V
    • Easily sealed package with O-ring
    • ECOPACK lead-free compliant

All tools & software

    • Part number
      Status
      Description
      Type
      Supplier

      SensiBLE

      Active

      Certified Bluetooth low energy master/slave network processor module, compliant with Bluetooth v4.1

      Hardware Integrated Devices from Partners SensiEDGE
      SensiBLE

      Description:

      Certified Bluetooth low energy master/slave network processor module, compliant with Bluetooth v4.1

      SensiBLE 2.0

      Active

      Low power single core (SOC) system-on-chip with 32MHz 32-bit ARM® Cortex®-M0 CPU, and Certified Bluetooth low energy (BLE) v4.2

      Hardware Integrated Devices from Partners SensiEDGE
      SensiBLE 2.0

      Description:

      Low power single core (SOC) system-on-chip with 32MHz 32-bit ARM® Cortex®-M0 CPU, and Certified Bluetooth low energy (BLE) v4.2

      SensiBLE 2.1

      Active

      Low power single core (SOC) system-on-chip with 32MHz 32-bit ARM® Cortex®-M0 MCU, Certified Bluetooth low energy (BLE) v5.2

      Hardware Integrated Devices from Partners SensiEDGE
      SensiBLE 2.1

      Description:

      Low power single core (SOC) system-on-chip with 32MHz 32-bit ARM® Cortex®-M0 MCU, Certified Bluetooth low energy (BLE) v5.2

      SensiSUB

      Active

      End-to-end solution for LPWAN enabling cloud connectivity to sensor data over a long range Sub-1 GHz star network

      Hardware Integrated Devices from Partners SensiEDGE
      SensiSUB

      Description:

      End-to-end solution for LPWAN enabling cloud connectivity to sensor data over a long range Sub-1 GHz star network
    • Part number
      Status
      Description
      Type
      Supplier

      FAE Engineering Services

      Active

      Engineering services on the SensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing.

      Design Services from Partners FAE Technology
      FAE Engineering Services

      Description:

      Engineering services on the SensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing.

      SensiEDGE customization services

      Active

      End-to-end development services: Hardware, Firmware, Software development, Enclosure, Cloud and mobile APPs. Speed up your IoT project with SensiEDGE!

      Design Services from Partners SensiEDGE
      SensiEDGE customization services

      Description:

      End-to-end development services: Hardware, Firmware, Software development, Enclosure, Cloud and mobile APPs. Speed up your IoT project with SensiEDGE!

EDA Symbols, Footprints and 3D Models

STMicroelectronics - ILPS28QSW

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

Symbols

Symbols

Footprints

Footprints

3D model

3D models

Quality and Reliability

Part Number Marketing Status Package RoHS Compliance Grade Material Declaration**
ILPS28QSW
Preview
CERAMIC CCLGA 2.8X2.8X2.1 6L+PAD Ecopack2
ILPS28QSWTR
Evaluation
CERAMIC CCLGA 2.8X2.8X2.1 6L+PAD Ecopack2

ILPS28QSW

Package:

CERAMIC CCLGA 2.8X2.8X2.1 6L+PAD

Material Declaration**:

Marketing Status

Preview

Package

CERAMIC CCLGA 2.8X2.8X2.1 6L+PAD

RoHS Compliance Grade

Ecopack2

ILPS28QSWTR

Package:

CERAMIC CCLGA 2.8X2.8X2.1 6L+PAD

Material Declaration**:

Marketing Status

Evaluation

Package

CERAMIC CCLGA 2.8X2.8X2.1 6L+PAD

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

Swipe or click the button to explore more details Don't show this again
Part Number
Order from distributors
Order from ST
Marketing Status
ECCN (US)
ECCN (EU)
Packing Type
Package
Temperature (°C) Country of Origin
Budgetary Price (US$)*/Qty
min
max
ILPS28QSW Available at distributors

Distributor availability of ILPS28QSW

Distributor Name
Region Stock Min. Order Third party link

Distributor reported inventory date:

No availability of distributors reported, please contact our sales office
Preview
EAR99 NEC Tray CERAMIC CCLGA 2.8X2.8X2.1 6L+PAD -40 85 THAILAND
ILPS28QSWTR Available at distributors

Distributor availability of ILPS28QSWTR

Distributor Name
Region Stock Min. Order Third party link

Distributor reported inventory date:

No availability of distributors reported, please contact our sales office
Evaluation
EAR99 NEC Tape and Reel CERAMIC CCLGA 2.8X2.8X2.1 6L+PAD -40 85 THAILAND

ILPS28QSW Preview

Package:
CERAMIC CCLGA 2.8X2.8X2.1 6L+PAD
ECCN (US):
EAR99
Budgetary Price (US$)*/Qty:
-

Part Number:

ILPS28QSW

ECCN (EU):

NEC

Packing Type:

Tray

Operating Temperature (°C)

Min:

-40

Max:

85

Country of Origin:

THAILAND

ILPS28QSWTR Evaluation

Package:
CERAMIC CCLGA 2.8X2.8X2.1 6L+PAD
ECCN (US):
EAR99
Budgetary Price (US$)*/Qty:
-

Part Number:

ILPS28QSWTR

ECCN (EU):

NEC

Packing Type:

Tape and Reel

Operating Temperature (°C)

Min:

-40

Max:

85

Country of Origin:

THAILAND

Swipe or click the button to explore more details Don't show this again

(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors