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The increasing demand for compact power management systems has brought about the need for excellent thermal design. Thanks to newly engineered power density and thermal conduction technologies, the PSMC (TO-277A), SMA Flat, SMB Flat and SOD Flat packages for diodes and rectifiers combine compactness and high power density, making them ideal for space-constrained circuits.
Further details on the light and ultra-small packages:
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This series of diodes in a thin package helps electrical engineers design circuits with higher thermal performance in a compact format, leading to device miniaturization and fewer bill-of-material costs.
It is suitable for the following extended range of devices, including automotive applications, as it is compliant with AEC-Q101 standards:
• Automotive Electronic Control Units, lighting circuits, injection units
• Industrial equipment
• Telecom power and servers
• Notebook adapters and battery chargers with ultra-compact form factors
The automotive-grade devices of this series have a maximum junction temperature of 175 ºC.
For PSMC (TO-277A), SOD123 Flat and SOD128 Flat packages, the heat is sunk downwards from the chip to the PCB at the bottom. Optimized copper clips were designed with a large coverage on top of the die. They provide better thermal conduction than common aluminum wire bonds.
Featured series:
Housed in the 1mm-thick SMA Flat and SMB Flat packages, ST’s 30 to 200 V power Schottky rectifiers are tailored for miniature LED lighting, battery-powered equipment and power converters for consumer and harsh industrial environments thanks to their junction temperature (Tj) ranging from –40 to +175 °C. Compatible with reflow and wave-soldering (notch), they also belong to a No-Tariff country back-end and benefit from our 10-year longevity commitment.
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